JPS6114704A - Method of producing slide resistor - Google Patents
Method of producing slide resistorInfo
- Publication number
- JPS6114704A JPS6114704A JP59134727A JP13472784A JPS6114704A JP S6114704 A JPS6114704 A JP S6114704A JP 59134727 A JP59134727 A JP 59134727A JP 13472784 A JP13472784 A JP 13472784A JP S6114704 A JPS6114704 A JP S6114704A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- resistor
- substrate
- resistance portion
- horse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は例えば、アクセルペタルセンサーや回転角位置
センサーに使用される摺動抵抗体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a sliding resistor used, for example, in an accelerator pedal sensor or a rotational angular position sensor.
具体的には基板、抵抗部分を一体成形し、その後フルア
ディティブ法により導体を成形し得る自動車の各種セン
サーに使用される摺動抵抗体の製造方法に関する。Specifically, the present invention relates to a method for manufacturing sliding resistors used in various automotive sensors, in which a substrate and a resistor part are integrally molded, and then a conductor is molded by a fully additive method.
従来技術と問題点
従来の摺動抵抗体の製造方法は、抵抗部分を基板にイン
ジェクションして、かつ導体を一体成形する製造方法で
あった。Prior Art and Problems The conventional method for manufacturing a sliding resistor involves injecting a resistor into a substrate and integrally molding a conductor.
而して、かかる製造方法による摺動抵抗体においては抵
抗部分の硬化収縮作用により、基板吉導体間、及び基板
と抵抗間に隙間が生じ、該基板と導体、及び基板と抵抗
相互間の接着が完全ではなかった。Therefore, in the sliding resistor produced by this manufacturing method, gaps are created between the substrate and the conductor and between the substrate and the resistor due to the hardening and shrinkage of the resistor part, and the adhesion between the substrate and the conductor and between the substrate and the resistor. was not perfect.
問題点解決のための手段
本発明による摺動抵抗体の製造方法は前記従来技術の問
題点を解決するために発明したもので、第１に抵抗部分
を金型に固定し、第２に抵抗部分を基板にインサート成
形し、第３にフルアディティブ法により導体を成形し、
最後に導電性接着剤で導体と抵抗部分を導通させる製造
方法であり、新規な摺動抵抗体を構成し得るものである
。Means for Solving the Problems The method of manufacturing a sliding resistor according to the present invention was invented to solve the problems of the prior art. The part is insert molded on the board, and thirdly, the conductor is molded using a fully additive method.
Finally, this is a manufacturing method that connects the conductor and the resistor part with a conductive adhesive, making it possible to construct a novel sliding resistor.
本発明の実施例
第１図は本発明の一実施例である抵抗インサ−ト方式に
よる摺動抵抗体の構造を示すものである。１は馬神型基
板である。２は抵抗部分で円弧状の一部を成形し、該馬
蹄型基板１の周縁にインサート配設している。３は導体
であり、前記抵抗部分２と一連にかつ前記馬綽型基板１
に配設されている。４は導電性接着剤であり前記抵抗部
分２と導体３を導通させ得る如く接続固定している。Embodiment of the Invention FIG. 1 shows the structure of a sliding resistor using a resistor insert method, which is an embodiment of the invention. 1 is a horse god type board. Reference numeral 2 denotes a resistance portion formed into a circular arc shape, and inserted into the periphery of the horseshoe-shaped substrate 1. 3 is a conductor, which is connected to the resistive portion 2 and connected to the horse-shaped substrate 1;
It is located in Reference numeral 4 denotes a conductive adhesive which connects and fixes the resistive portion 2 and the conductor 3 so that they can be electrically connected.
次に、第２図（ａ）ないし第２図（ｄ）に基づき、本発
明に係る摺動抵抗体の製造方法の一実施例を説明する。Next, an embodiment of the method for manufacturing a sliding resistor according to the present invention will be described with reference to FIGS. 2(a) to 2(d).
第２図（ａ）はインジェクション金型５に抵抗部分２を
固定した第１工程を示す図である。これにより、抵抗部
分２はインジェクション金型５に完全に固定される。前
記抵抗部分２の材料は例えば芳香族サルファイド系樹脂
にグラファイトガラス繊維を充填した材料で構成される
。FIG. 2(a) is a diagram showing the first step in which the resistance portion 2 is fixed to the injection mold 5. Thereby, the resistance portion 2 is completely fixed to the injection mold 5. The material of the resistance portion 2 is, for example, an aromatic sulfide resin filled with graphite glass fibers.
第２図（ｂ）は馬紳型基板１に抵抗部分２をインサート
成形した第２工程を示す図である。なお第２図（１））
において、５はインジェクション金型であり、馬１主型
基板１をホールドしている。FIG. 2(b) is a diagram showing the second step of insert molding the resistance portion 2 on the horse-shaped substrate 1. In addition, Figure 2 (1))
, 5 is an injection mold which holds the main mold substrate 1 of the horse 1 .
なお、馬綽型基板１は例えば、ポリエーテルサルフオン
（ＰＥＳ）の材料で構成されている。第２図（ｃ）は馬
綽型基板１に導体３をフルアディティブ法、すなわちメ
ッキ法により固定する第３工程を示す図である。第２図
（ｄ）は導電性接着剤４で、抵抗部分２と導体３とを接
続固定する第４工程を示す図である。Note that the horse-shaped substrate 1 is made of a material such as polyether sulfon (PES), for example. FIG. 2(c) is a diagram showing the third step of fixing the conductor 3 to the horse-shaped substrate 1 by a full additive method, that is, a plating method. FIG. 2(d) is a diagram showing a fourth step of connecting and fixing the resistive portion 2 and the conductor 3 using the conductive adhesive 4.
本発明の作用 上記実施例に基づき、その作用を説明する。Effect of the present invention The operation will be explained based on the above embodiment.
前記第１工程ではインジェクション金型５に抵抗部分２
を固定する手順が示されている。前記第２工程では、抵
抗部分２が馬１＝”ｌｐ型基板１にインサート成形する
手順が示されており、該第２工程によれば、該抵抗部分
２をインサート成形した後、馬１ｑ型基板１が硬化収縮
作用するので、該抵抗部分２が圧縮固定される。而して
、抵抗部分２と馬坤型基板１の接着度合が非常に優れた
作用を奏する。In the first step, the resistance portion 2 is placed in the injection mold 5.
The procedure for fixing is shown. In the second step, a procedure is shown in which the resistance portion 2 is insert-molded on the lp-type substrate 1. According to the second step, after insert-molding the resistance portion 2, the resistance portion 2 is inserted into the lp-type substrate 1. Since the substrate 1 is cured and shrunk, the resistance portion 2 is compressed and fixed.The degree of adhesion between the resistance portion 2 and the horse-shaped substrate 1 is therefore excellent.
第３工程では、馬神型基板１」二にフルアディティブ法
により導体３を配置し、固定する手順が示されている。In the third step, a procedure for arranging and fixing the conductor 3 on the horse-shaped board 1''2 by a full additive method is shown.
ここにおいて、フルアディティブ法はいわゆるメッキ法
のことで、評言すれば、無電解メッキによるメッキ法で
ある。そこで、被メツキ部材には電圧は印加しない構成
である。Here, the full additive method is a so-called plating method, and more specifically, it is a plating method using electroless plating. Therefore, the structure is such that no voltage is applied to the member to be plated.
第４工程では、導電性接着剤４で、導体３と抵抗部分２
が接続固定され、両者を導通させる手順が示されている
。In the fourth step, conductive adhesive 4 is used to connect conductor 3 and resistor part 2.
are connected and fixed, and the procedure for making them conductive is shown.
而して、抵抗部分２の表面で導体３と導通するので、抵
抗部分２の出力特性がオーム性を示すことになる。Since the surface of the resistive portion 2 is electrically connected to the conductor 3, the output characteristic of the resistive portion 2 exhibits ohmic properties.
本発明の効果
本発明によれば、抵抗部分２が馬紳型基板１にインサー
ト成形され、該馬吟型基板１が硬化収縮作用するので、
該抵抗部分が該馬蹄型基板１に堅固に接着されるので、
接着機能の充実を図ることができる。Effects of the Present Invention According to the present invention, the resistance portion 2 is insert-molded in the horse-shaped substrate 1, and the horse-shaped substrate 1 is cured and shrunk.
Since the resistive portion is firmly adhered to the horseshoe-shaped substrate 1,
The adhesive function can be enhanced.
抵抗部分の表面と導体を導電性接着剤で接続固定するの
で両者の導通機能が完全となり、抵抗部分の出力特性が
直線性であり、本発明に係る摺動抵抗体の性能が向上す
る。Since the surface of the resistor part and the conductor are connected and fixed with a conductive adhesive, the conduction function between the two is perfect, the output characteristic of the resistor part is linear, and the performance of the sliding resistor according to the present invention is improved.
また、本発明に係る製造方法により生産した摺動抵抗体
は新規であり、各種自動車用センサー、その他のスイッ
チ手段としても利用でき、その応用範囲は広いものであ
る。Further, the sliding resistor produced by the manufacturing method according to the present invention is new and can be used as various automobile sensors and other switching means, and its application range is wide.
第１図は本発明に係る摺動抵抗体の製造方法により製造
した一実施例を示ず摺動抵抗体の平面図である。
第２図（ａ）ないし第２図（ｄ）は本発明に係る摺動抵
抗体の製造方法の一実施例を示すもので、第２図（ａ）
は第１工程、第２図（ｂ）は第２工程、第２図（ｃ）は
第３工程、及び第２図（ｄ）は第４工程をそれぞれ示す
説明図である。
１・・・・馬夏中型基板、２・・・・抵抗部分、３・・
・・・導体、４・・・・・・導電性接着剤、５・・・・
・・インジェクション金型。FIG. 1 is a plan view of a sliding resistor manufactured by the method of manufacturing a sliding resistor according to an embodiment of the present invention. 2(a) to 2(d) show an embodiment of the method for manufacturing a sliding resistor according to the present invention, and FIG. 2(a)
is an explanatory diagram showing the first step, FIG. 2(b) the second step, FIG. 2(c) the third step, and FIG. 2(d) the fourth step. 1...Medium size board, 2...Resistance part, 3...
... Conductor, 4... Conductive adhesive, 5...
...Injection mold.
Claims (1)
、基板に抵抗部分をインサート成形する第２工程と、前
記第２工程後、基板にフルアディティブ法により導体を
固着する第３工程と、前記第３工程後、導電性接着剤で
抵抗部分と導体とを接続固定する第４工程とでなること
を特徴とする摺動抵抗体の製造方法。A first step of fixing the resistor part to the mold; a second step of insert molding the resistor part on the board after the first step; and a third step of fixing the conductor to the board by a full additive method after the second step. and, after the third step, a fourth step of connecting and fixing the resistance portion and the conductor with a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59134727A JPS6114704A (en) | 1984-06-29 | 1984-06-29 | Method of producing slide resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59134727A JPS6114704A (en) | 1984-06-29 | 1984-06-29 | Method of producing slide resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6114704A true JPS6114704A (en) | 1986-01-22 |
Family
ID=15135186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59134727A Pending JPS6114704A (en) | 1984-06-29 | 1984-06-29 | Method of producing slide resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6114704A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305502A (en) * | 1987-06-06 | 1988-12-13 | Asahi Chem Res Lab Ltd | Method of forming resistance circuit on substrate |
| JPH0242402U (en) * | 1988-09-19 | 1990-03-23 | ||
| JPH0350365U (en) * | 1989-09-21 | 1991-05-16 |
-
1984
- 1984-06-29 JP JP59134727A patent/JPS6114704A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305502A (en) * | 1987-06-06 | 1988-12-13 | Asahi Chem Res Lab Ltd | Method of forming resistance circuit on substrate |
| JPH0242402U (en) * | 1988-09-19 | 1990-03-23 | ||
| JPH0350365U (en) * | 1989-09-21 | 1991-05-16 |
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