JPH11142184A - Resin molded circuit apparatus - Google Patents

Resin molded circuit apparatus

Info

Publication number
JPH11142184A
JPH11142184A JP30477997A JP30477997A JPH11142184A JP H11142184 A JPH11142184 A JP H11142184A JP 30477997 A JP30477997 A JP 30477997A JP 30477997 A JP30477997 A JP 30477997A JP H11142184 A JPH11142184 A JP H11142184A
Authority
JP
Japan
Prior art keywords
resin
circuit board
molded
insulating coating
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30477997A
Other languages
Japanese (ja)
Inventor
Osamu Terakura
Kazuhiro Yasuda
和弘 安田
修 寺倉
Original Assignee
Denso Corp
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, 株式会社デンソー filed Critical Denso Corp
Priority to JP30477997A priority Critical patent/JPH11142184A/en
Publication of JPH11142184A publication Critical patent/JPH11142184A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Abstract

PROBLEM TO BE SOLVED: To present a solder part of a circuit board from being melted when the whole of the circuit board is molded of resin. SOLUTION: An insulating coating material 28 is coated by a dispenser or the like to a solder face of a circuit board 11 where a Hall IC 16 and capacitors 20-22 are soldered. The insulating coating material 28 is preferably a material with good adhesion to the solder face and moisture resistance, e.g. silicon-based insulating moisture-proof material. After the insulating coating material 28 is set, the whole of the circuit board 11 is molded of a mold resin 29. At this time, the insulating coating material 28 having heat insulation properties can reduce the transmission of heat from the molten resin to the solder face of the circuit board 11. Even when a thermoplastic resin of a high melting point such as PPS, etc., is used as the mold resin 29, a temperature of a solder part when the circuit board is molded can be controlled to be not higher than a melting point of the solder.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【発明の属する技術分野】本発明は、回路素子が半田付
けされた回路基板を樹脂でモールドしてなる樹脂モール
ド回路装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molded circuit device formed by molding a circuit board on which circuit elements are soldered with resin.
【0002】[0002]
【従来の技術】この種の樹脂モールド回路装置は、配線
パターンが形成された回路基板に、IC、コンデンサ、
抵抗等の回路素子を半田付けした後、これら全体を樹脂
でモールド成形することで、回路素子を保護するように
している。
2. Description of the Related Art A resin-molded circuit device of this kind is provided with an IC, a capacitor,
After soldering circuit elements such as resistors, the whole is molded with resin to protect the circuit elements.
【0003】[0003]
【発明が解決しようとする課題】一般に、モールド樹脂
は、耐熱性や剛性等を考慮して、PPS(ポリフェニレ
ンスルフィド)等の高融点の熱可塑性樹脂を使用するこ
とが多いが、高融点の熱可塑性樹脂は、モールド成形時
の樹脂の溶融温度が310℃前後であり、半田の溶融温
度である250℃前後と比べて60℃程度も高い。しか
も、モールド成形時の溶融樹脂の粘度が高く、溶融樹脂
の流動性が低いため、モールド成形時に溶融樹脂の温度
が回路基板の半田付け部に影響する時間が長くなる。こ
の結果、モールド成形時に回路基板の半田付け部が半田
の溶融温度以上の高温に長い時間さらされてしまい、そ
の熱で半田付け部が溶融して、半田付け部の接合信頼性
が低下したり、極端な場合には、半田付け不良やショー
トが発生することがあった。
Generally, a high melting point thermoplastic resin such as PPS (polyphenylene sulfide) is often used as a molding resin in consideration of heat resistance and rigidity. The melting temperature of the plastic resin at the time of molding is about 310 ° C., which is about 60 ° C. higher than the melting temperature of the solder of about 250 ° C. Moreover, since the viscosity of the molten resin during molding is high and the fluidity of the molten resin is low, the time during which the temperature of the molten resin affects the soldered portion of the circuit board during molding is increased. As a result, the soldered portion of the circuit board is exposed to a high temperature equal to or higher than the melting temperature of the solder for a long time during molding, and the heat melts the soldered portion, thereby reducing the bonding reliability of the soldered portion. In extreme cases, poor soldering or short-circuiting may occur.
【0004】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、モールド成形時の熱
で回路基板の半田付け部が溶融することを防止できて、
半田付け不良やショートを防止でき、半田付け部の接合
信頼性を向上できる樹脂モールド回路装置を提供するこ
とにある。
[0004] The present invention has been made in view of such circumstances, and an object thereof is to prevent the soldered portion of a circuit board from being melted by heat during molding.
It is an object of the present invention to provide a resin molded circuit device which can prevent soldering failure and short circuit and can improve bonding reliability of a soldered portion.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明の請求項1の樹脂モールド回路装置は、回路
基板の半田付け面に断熱コーティング材をコーティング
した上で、樹脂でモールド成形したものである。このよ
うにすれば、モールド成形される溶融樹脂と回路基板の
半田付け面との間に断熱コーティング材が介在されるた
め、溶融樹脂から回路基板の半田付け面への熱の伝達
を、断熱性を有する断熱コーティング材で低減すること
ができる。これにより、モールド樹脂としてPPS等の
高融点の熱可塑性樹脂を使用しても、モールド成形時の
半田付け部の温度を半田の溶融温度以下の温度に抑える
ことができ、モールド成形時の熱で半田付け部が溶融す
ることを防止できて、半田付け不良やショートを防止で
き、半田付け部の接合信頼性を向上できる。
According to a first aspect of the present invention, there is provided a resin-molded circuit device according to the present invention, in which a soldering surface of a circuit board is coated with a heat-insulating coating material and then molded with a resin. It was done. In this case, since the heat insulating coating material is interposed between the molten resin to be molded and the soldering surface of the circuit board, the transfer of heat from the molten resin to the soldering surface of the circuit board is performed by the heat insulating material. It can be reduced by a heat insulating coating material having As a result, even when a high melting point thermoplastic resin such as PPS is used as the molding resin, the temperature of the soldering portion during molding can be suppressed to a temperature equal to or lower than the melting temperature of the solder. It is possible to prevent the soldered portion from being melted, prevent defective soldering and short-circuit, and improve the bonding reliability of the soldered portion.
【0006】この場合、請求項2のように、断熱コーテ
ィング材として、防湿性を有するものを用いると良い。
このようにすれば、万一、成形樹脂にクラック等が生じ
て湿気が成形樹脂の内部に侵入したとしても、回路基板
の半田付け面(配線パターン面)は、防湿性のある断熱
コーティング材で覆われているため、湿気の侵入による
絶縁性低下を断熱コーティング材で防ぐことができ、絶
縁信頼性も向上することができる。
In this case, it is preferable to use a heat-insulating coating material having a moisture-proof property.
In this way, even if cracks or the like occur in the molding resin and moisture enters the inside of the molding resin, the soldering surface (wiring pattern surface) of the circuit board is made of a moisture-proof heat-insulating coating material. Since it is covered, a decrease in insulation due to invasion of moisture can be prevented by the heat insulating coating material, and insulation reliability can be improved.
【0007】また、請求項3のように、回路基板は、配
線パターン用のめっきを施すめっき下地部を凸状に成形
した易めっき性樹脂の一次成形体と、この一次成形体を
前記めっき下地部の表面を露出させるようにインサート
成形した難めっき性樹脂の二次成形体とから構成し、前
記めっき下地部にめっきで配線パターンを形成するよう
にしても良い。このようにすれば、平面的な配線パター
ンのみではなく、回路基板の種々の形状に合わせて立体
的な配線パターンも形成することができ、回路基板形状
の設計自由度を増大することができる。
According to a third aspect of the present invention, there is provided a circuit board, comprising: a primary molded body of an easily-platable resin in which a plating underlayer for plating a wiring pattern is formed in a convex shape; And a secondary molded body of a hard-to-plate resin that is insert-molded so as to expose the surface of the portion, and a wiring pattern may be formed by plating on the plating base. With this configuration, not only a planar wiring pattern but also a three-dimensional wiring pattern can be formed in accordance with various shapes of the circuit board, and the degree of freedom in designing the circuit board shape can be increased.
【0008】[0008]
【発明の実施の形態】以下、本発明を回転検出装置に適
用した一実施形態を図面に基づいて説明する。回路基板
11は、図3に示すように、めっきで配線パターン12
を形成するめっき下地部13を凸状に形成した一次成形
体14と、この一次成形体14をめっき下地部13の表
面を露出させるようにインサート成形した二次成形体1
5とから構成されている。一次成形体14は、めっきが
付着しやすい易めっき性樹脂、例えば液晶ポリマー(L
CP)等の耐熱性樹脂で成形されている。これに対し、
二次成形体15は、めっきが付着し難い難めっき性樹
脂、例えばポリフェニレンスルフィド(PPS)、液晶
ポリマー(LCP)、ポリエーテルスルホン(PE
S)、ポリエーテルイミド(PEI)等、無電解めっき
液に対する耐薬品性のある樹脂で成形されている。一次
成形体14のめっき下地部13の表面には、Au,S
n,Ni等の無電解めっきにより配線パターン12が形
成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment in which the present invention is applied to a rotation detecting device will be described below with reference to the drawings. As shown in FIG. 3, the circuit board 11 is provided with a wiring pattern 12 by plating.
And a secondary formed body 1 formed by insert-molding the primary formed body 14 so as to expose the surface of the plated base portion 13.
And 5. The primary molded body 14 is made of an easily plating resin to which plating easily adheres, for example, a liquid crystal polymer (L
It is molded with a heat-resistant resin such as CP). In contrast,
The secondary molded body 15 is made of a hard-to-plate resin to which plating does not easily adhere, such as polyphenylene sulfide (PPS), liquid crystal polymer (LCP), and polyether sulfone (PE).
It is formed of a resin having chemical resistance to the electroless plating solution, such as S) and polyetherimide (PEI). Au, S is formed on the surface of the plating base portion 13 of the primary compact 14.
The wiring pattern 12 is formed by electroless plating of n, Ni, or the like.
【0009】図1及び図2に示すように、回路基板11
の前端部(図示左端部)にホールIC16(回路素子)
が組み付けられている。このホールIC16の端子17
[図2(b)参照]を回路基板11のスルーホール(図
示せず)に挿入して、回路基板11の下面(半田付け
面)に半田付けすることで、ホールIC16の保持と電
気的接続とを行っている。
As shown in FIG. 1 and FIG.
Hall IC 16 (circuit element) at the front end (left end in the figure)
Is assembled. Terminal 17 of this Hall IC 16
[FIG. 2B] is inserted into a through hole (not shown) of the circuit board 11 and soldered to the lower surface (soldering surface) of the circuit board 11 to hold and electrically connect the Hall IC 16. And go.
【0010】このホールIC16の背面側にはバイアス
磁石18が組み付けられている。また、回路基板11の
半田付け面には、コンデンサ20〜22(回路素子)の
各端子が半田付けされ、該回路基板11の後端部(図示
右端部)には、3本のターミナル23〜25が上向きに
突設され、これら各ターミナル23〜25とホールIC
16と各コンデンサ20〜22とが回路基板11に形成
された配線パターン12[図2(a)に一部のみ図示]
とスルーホール27(内周面にめっきが施されている)
とによって電気的に接続されている。
A bias magnet 18 is mounted on the back side of the Hall IC 16. The terminals of the capacitors 20 to 22 (circuit elements) are soldered to the soldering surface of the circuit board 11, and three terminals 23 to 23 are provided at the rear end (right end in the drawing) of the circuit board 11. 25 are projected upward, and each of these terminals 23 to 25 is connected to a hall IC.
Wiring pattern 12 formed on circuit board 11 with 16 and capacitors 20 to 22 [only a part is shown in FIG. 2A]
And through hole 27 (the inner peripheral surface is plated)
And are electrically connected by
【0011】更に、回路基板11の半田付け面の全面に
は、断熱コーティング材28がディスペンサ等(図示せ
ず)によりコーティングされている。この断熱コーティ
ング材28は、半田付け面との密着性が良く、且つ防湿
性を有する材料、例えばシリコン系断熱防湿材を用いる
と良い。
Further, the entire surface of the soldering surface of the circuit board 11 is coated with a heat insulating coating material 28 by a dispenser or the like (not shown). As the heat insulating coating material 28, a material having good adhesion to the soldering surface and having a moisture proof property, for example, a silicon-based heat and moisture proof material may be used.
【0012】断熱コーティング材28の硬化後に、図1
に示すように、回路基板11の全体はモールド樹脂29
でモールド成形される。モールド樹脂29としては、高
剛性で且つ耐熱性に優れた樹脂、例えばポリフェニレン
スルフィド(PPS)等の高融点の熱可塑性樹脂を用い
ると良い。
After curing of the thermal insulation coating material 28, FIG.
As shown in FIG.
Is molded. As the mold resin 29, a resin having high rigidity and excellent heat resistance, for example, a high melting point thermoplastic resin such as polyphenylene sulfide (PPS) is preferably used.
【0013】モールド樹脂29の成形体には、ターミナ
ル23〜25を外部ターミナル(図示せず)と接続する
ためのコネクタハウジング30と取付ブラケット31が
一体に形成され、取付ブラケット31には金属製のブッ
シュ32がインサート成形されている。また、モールド
樹脂29の成形体の外周部に形成された溝33には、ゴ
ム製のOリング34が装着されている。
A connector housing 30 for connecting the terminals 23 to 25 to an external terminal (not shown) and a mounting bracket 31 are integrally formed on the molded body of the molding resin 29. The mounting bracket 31 is made of metal. The bush 32 is insert-molded. An O-ring 34 made of rubber is mounted in a groove 33 formed on the outer periphery of the molded body of the mold resin 29.
【0014】以上のように構成した回転検出装置は、車
体等の取付対象部位の取付穴(図示せず)にOリング3
4部分を嵌入し、取付ブラケット31のブッシュ32に
ネジ(図示せず)を挿通して車体等に取付固定される。
この回転検出装置の前端面(ホールIC16)が、エン
ジンのクランク軸等に嵌着されたシグナルロータ(図示
せず)と所定の隙間を介して対向し、ホールIC16か
らシグナルロータの回転速度に応じた周波数のパルス信
号が出力される。
The rotation detecting device constructed as described above is provided with an O-ring 3 in a mounting hole (not shown) of a mounting target portion such as a vehicle body.
The four parts are fitted, and screws (not shown) are inserted into the bushes 32 of the mounting bracket 31 to be fixedly mounted on the vehicle body or the like.
A front end face (Hall IC 16) of the rotation detecting device faces a signal rotor (not shown) fitted to a crankshaft or the like of the engine via a predetermined gap, and the rotation detector detects the rotation speed of the signal rotor from the Hall IC 16 according to the rotation speed. The pulse signal of the frequency is output.
【0015】上記構成の回転検出装置を製造する場合に
は、回路基板11にホールIC16やコンデンサ20〜
22を半田付けした後、回路基板11の半田付け面の全
面に断熱コーティング材28をディスペンサ等(図示せ
ず)によりコーティングする。この断熱コーティング材
28が硬化した後、回路基板11全体をモールド樹脂2
9でモールド成形する。
When manufacturing the rotation detecting device having the above configuration, the Hall IC 16 and the capacitors 20 to
After soldering 22, the entire surface of the soldering surface of the circuit board 11 is coated with a heat insulating coating material 28 by a dispenser or the like (not shown). After the heat insulating coating material 28 is cured, the entire circuit board 11 is
9. Molding is performed.
【0016】この場合、モールド樹脂29の溶融樹脂と
回路基板11の半田付け面との間に断熱コーティング材
28が介在されるため、溶融樹脂から回路基板11の半
田付け面への熱の伝達を、断熱性を有する断熱コーティ
ング材28で低減することができる。これにより、モー
ルド樹脂29としてPPS等の高融点の熱可塑性樹脂を
使用しても、モールド成形時の半田付け部の温度を半田
の溶融温度以下の温度に抑えることができる。
In this case, since the heat-insulating coating material 28 is interposed between the molten resin of the mold resin 29 and the soldering surface of the circuit board 11, heat is transferred from the molten resin to the soldering surface of the circuit board 11. It can be reduced by the heat insulating coating material 28 having heat insulating properties. Accordingly, even when a high melting point thermoplastic resin such as PPS is used as the mold resin 29, the temperature of the soldering portion during molding can be suppressed to a temperature equal to or lower than the melting temperature of the solder.
【0017】本発明者は、断熱コーティング材28のコ
ーティング膜厚とモールド成形時の断熱効果との関係を
考察する試験を行ったので、その試験結果を図4に示
す。断熱コーティング材がない場合(従来に相当)は、
モールド成形時に回路基板の半田付け部が半田の溶融温
度以上の高温に直接さらされてしまい、その熱で半田付
け部が溶融して、半田付け部の接合信頼性を低下させた
り、極端な場合には、半田付け不良やショートが発生す
ることがある。
The present inventor conducted a test for examining the relationship between the coating thickness of the heat insulating coating material 28 and the heat insulating effect during molding, and the test results are shown in FIG. If there is no insulation coating material (equivalent to the conventional)
When the soldered part of the circuit board is directly exposed to a high temperature higher than the melting temperature of the solder during molding, the heat melts the soldered part and reduces the bonding reliability of the soldered part, or in extreme cases May cause poor soldering or short circuit.
【0018】これに対し、上記実施形態のように、回路
基板11の半田付け面を断熱コーティング材28でコー
ティングした場合、コーティング膜厚が5μmでも、十
分な断熱効果を得ることができ、モールド成形時の半田
付け部の温度を半田の溶融温度以下の温度に抑えること
ができる。断熱コーティング材28のコーティング膜厚
が5μmから10μm,50μmと厚くなるほど、断熱
効果が高くなるが、50μmを越えると、コーティング
膜厚が厚くなっても、断熱効果はあまり向上しなくな
る。従って、コーティング膜厚は、5μm〜50μm程
度が適当と考えられる。
On the other hand, when the soldering surface of the circuit board 11 is coated with the heat insulating coating material 28 as in the above embodiment, a sufficient heat insulating effect can be obtained even if the coating film thickness is 5 μm. The temperature of the soldering portion at this time can be suppressed to a temperature equal to or lower than the melting temperature of the solder. As the coating thickness of the heat insulating coating material 28 increases from 5 μm to 10 μm and 50 μm, the heat insulating effect increases. However, if the coating thickness exceeds 50 μm, the heat insulating effect does not improve much even if the coating film thickness increases. Therefore, it is considered appropriate that the coating film thickness is about 5 μm to 50 μm.
【0019】このように、回路基板11の半田付け面を
断熱コーティング材28でコーティングすることで、モ
ールド成形時の半田付け部の温度を半田の溶融温度以下
の温度に抑えることができ、モールド成形時の熱で半田
付け部が溶融することを防止できて、半田付け不良やシ
ョートを防止でき、半田付け部の接合信頼性を向上でき
る。
As described above, by coating the soldering surface of the circuit board 11 with the heat insulating coating material 28, the temperature of the soldering portion during molding can be suppressed to a temperature lower than the melting temperature of the solder. It is possible to prevent the soldered portion from being melted by heat at the time, to prevent poor soldering and short-circuit, and to improve the bonding reliability of the soldered portion.
【0020】また、仮に、モールド樹脂29として、P
PSよりも高融点の熱可塑性樹脂を使用して、モールド
成形時の半田付け部の温度が半田の溶融温度を越えるこ
とがあったとしても、回路基板11の半田付け面を断熱
コーティング材28で覆っているため、溶融した半田の
流出を防止することができ、モールド成形後に半田付け
部を元の状態に保持することができる。
If the molding resin 29 is P
Even if the temperature of the soldering part at the time of molding may exceed the melting temperature of the solder by using a thermoplastic resin having a melting point higher than that of PS, the soldering surface of the circuit board 11 may be coated with the heat insulating coating material 28. Since the cover is covered, the outflow of the molten solder can be prevented, and the soldered portion can be kept in the original state after the molding.
【0021】更に、上記実施形態では、断熱コーティン
グ材28として防湿性のあるものを使用したので、万
一、成形したモールド樹脂29にクラック等が生じて湿
気がモールド樹脂29の内部に侵入したとしても、湿気
の侵入による回路基板11の半田付け面(配線パターン
面)の絶縁性低下を断熱コーティング材28で防ぐこと
ができ、絶縁信頼性も向上することができる。
Further, in the above-described embodiment, since a heat-insulating coating material 28 having a moisture-proof property is used, it is assumed that cracks or the like occur in the molded resin 29 and moisture enters the interior of the resin 29. In addition, it is possible to prevent the insulation property of the soldering surface (wiring pattern surface) of the circuit board 11 from lowering due to the invasion of moisture by the heat insulating coating material 28, and to improve the insulation reliability.
【0022】尚、モールド樹脂29として、成形時の溶
融粘度がナイロンと同等レベルの高溶融粘度樹脂(例え
ばPPSハイフロー等)を使用すれば、モールド成形時
に溶融樹脂の温度が半田付け部に影響する時間が短くな
り、半田付け部の溶融をより確実に防止することができ
る。
Incidentally, if a high melt viscosity resin (for example, PPS high flow or the like) having a melt viscosity at the same level as nylon at the time of molding is used as the mold resin 29, the temperature of the molten resin at the time of molding affects the soldered portion. The time is shortened, and the melting of the soldered portion can be more reliably prevented.
【0023】上記実施形態の回路基板11は、一次成形
体14を二次成形体15にインサート成形して、一次成
形体14の露出部(めっき下地部13)にめっきで配線
パターン12を形成したが、一般的なプリント配線基板
を用いても良い。
In the circuit board 11 of the above embodiment, the primary molded body 14 is insert-molded into the secondary molded body 15 and the wiring pattern 12 is formed by plating on the exposed portion (plating base 13) of the primary molded body 14. However, a general printed circuit board may be used.
【0024】その他、本発明の適用範囲は、上記実施形
態のような回転検出装置に限定されず、回路素子が半田
付けされた回路基板を樹脂でモールド成形した構成のも
のに広く適用して実施できる。
In addition, the scope of application of the present invention is not limited to the rotation detecting device as in the above embodiment, but is widely applied to a configuration in which a circuit board on which circuit elements are soldered is molded with resin. it can.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明を回転検出装置に適用した一実施形態を
示す装置全体の縦断側面図
FIG. 1 is a longitudinal sectional side view of an entire apparatus showing an embodiment in which the present invention is applied to a rotation detecting apparatus.
【図2】(a)は回路素子が実装された回路基板の平面
図、(b)は(a)のA−A断面図
2A is a plan view of a circuit board on which circuit elements are mounted, and FIG. 2B is a cross-sectional view taken along line AA of FIG.
【図3】配線パターンの形成方法を説明するための回路
基板の部分拡大縦断面図
FIG. 3 is a partially enlarged longitudinal sectional view of a circuit board for describing a method of forming a wiring pattern.
【図4】断熱コーティング材のコーティング膜厚とモー
ルド成形時の断熱効果との関係を考察する試験結果を示
す図
FIG. 4 is a view showing a test result for examining a relationship between a coating film thickness of a heat insulating coating material and a heat insulating effect during molding.
【符号の説明】[Explanation of symbols]
11…回路基板、12…配線パターン、13…めっき下
地部、14…一次成形体(易めっき性樹脂)、15…二
次成形体(難めっき性樹脂)、16…ホールIC(回路
素子)、20〜22…コンデンサ(回路素子)、28…
断熱コーティング材、29…モールド樹脂。
11: circuit board, 12: wiring pattern, 13: plating base, 14: primary molded body (easy plating resin), 15: secondary molded body (hard plating resin), 16: Hall IC (circuit element), 20-22: capacitor (circuit element), 28:
Insulation coating material, 29 ... Mold resin.

Claims (3)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 回路素子が半田付けされた回路基板を樹
    脂でモールド成形してなる樹脂モールド回路装置におい
    て、 前記回路基板の半田付け面に断熱コーティング材がコー
    ティングされていることを特徴とする樹脂モールド回路
    装置。
    1. A resin molded circuit device formed by molding a circuit board to which a circuit element is soldered with a resin, wherein a heat insulating coating material is coated on a soldering surface of the circuit board. Molded circuit device.
  2. 【請求項2】 前記断熱コーティング材は、防湿性を有
    することを特徴とする請求項1に記載の樹脂モールド回
    路装置。
    2. The resin-molded circuit device according to claim 1, wherein the heat-insulating coating material has a moisture-proof property.
  3. 【請求項3】 前記回路基板は、配線パターン用のめっ
    きを施すめっき下地部を凸状に成形した易めっき性樹脂
    の一次成形体と、この一次成形体を前記めっき下地部の
    表面を露出させるようにインサート成形した難めっき性
    樹脂の二次成形体とから構成され、前記めっき下地部に
    めっきで配線パターンが形成されていることを特徴とす
    る請求項1又は2に記載の樹脂モールド回路装置。
    3. The circuit board according to claim 1, further comprising: a primary molded body of an easily-plated resin in which a plating base part to be subjected to plating for a wiring pattern is formed in a convex shape, and exposing a surface of the primary molded body to the plating base part. The resin-molded circuit device according to claim 1, wherein a wiring pattern is formed by plating on the base portion of the plating, and a secondary molded body of a difficult-to-plate resin that is insert-molded as described above. .
JP30477997A 1997-11-07 1997-11-07 Resin molded circuit apparatus Pending JPH11142184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30477997A JPH11142184A (en) 1997-11-07 1997-11-07 Resin molded circuit apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30477997A JPH11142184A (en) 1997-11-07 1997-11-07 Resin molded circuit apparatus

Publications (1)

Publication Number Publication Date
JPH11142184A true JPH11142184A (en) 1999-05-28

Family

ID=17937135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30477997A Pending JPH11142184A (en) 1997-11-07 1997-11-07 Resin molded circuit apparatus

Country Status (1)

Country Link
JP (1) JPH11142184A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052517A1 (en) * 2003-11-28 2005-06-09 Aisin Seiki Kabushiki Kaisha Structure for holding electronic component
US20110115313A1 (en) * 2009-11-19 2011-05-19 Hyundai Motor Company Electric water pump
US20110221432A1 (en) * 2010-03-12 2011-09-15 Denso Corporation Sensor unit and magnetic flux concentrating module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052517A1 (en) * 2003-11-28 2005-06-09 Aisin Seiki Kabushiki Kaisha Structure for holding electronic component
KR100881773B1 (en) * 2003-11-28 2009-02-09 아이신세이끼가부시끼가이샤 Structure for holding electronic component
US20110115313A1 (en) * 2009-11-19 2011-05-19 Hyundai Motor Company Electric water pump
US8304939B2 (en) * 2009-11-19 2012-11-06 Hyundai Motor Company Electric water pump with molded circuit board and hall sensor
US20110221432A1 (en) * 2010-03-12 2011-09-15 Denso Corporation Sensor unit and magnetic flux concentrating module
US8957678B2 (en) * 2010-03-12 2015-02-17 Denso Corporation Sensor unit and magnetic flux concentrating module

Similar Documents

Publication Publication Date Title
US6707125B2 (en) Solid-state imaging apparatus and manufacturing method thereof
US5111363A (en) Mount for electronic parts
JP2004198240A (en) Sensor device
US8053684B2 (en) Mounting structure and method for mounting electronic component onto circuit board
KR970005083B1 (en) Variable resistor
JPH01286340A (en) Manufacture of substrate for mounting electronic parts
JPH11142184A (en) Resin molded circuit apparatus
US20060104468A1 (en) Condenser microphone and method of manufacturing substrate therefor
JP3444082B2 (en) Variable resistor
KR970006425B1 (en) Chip-type capacitor
JP4165020B2 (en) Circuit device provided with three-dimensional molded circuit board
JPH07336125A (en) Circuit module for automobile glass antenna and glass antenna for automobile
JP2020166949A (en) Connector device
JP2781890B2 (en) Method for manufacturing base of electromagnetic relay
JPH0744347B2 (en) Resin molded product with circuit
JPH0760926B2 (en) Electronic component mount
JPH09326467A (en) Electronic device
JPH08139429A (en) Electronic circuit device
JP3067515B2 (en) Multilayer circuit molded body and method of manufacturing the same
JP2567587Y2 (en) motor
JP2914679B2 (en) Hybrid integrated circuit device
JPH10321987A (en) Printed wiring board and manufacture thereof
JP2008281570A (en) Circuit device equipped with three-dimensional shaping circuit board
JPH07202453A (en) Circuit structure and production thereof
JPH069476Y2 (en) Chip-shaped electronic component