JPH05291320A - Electronic part and manufacturing method - Google Patents

Abstract

PURPOSE:To provide an electronic part and its manufacturing method, in which a mold does not require a groove for passing a fine conductor through for the electronic part having its out-going fine conductor. CONSTITUTION:An insulating tape 4 is bonded in a given area smoothly on both faces of a plurality of conductive parts 3 placed in a line. A conductive part is put between upper and lower molds 6 and 7 so that a mold boundary (A) is located on a smooth face of the insulating tape on an out-going side of the conductive part. Then, resin is injected into a molding space 8 in the mold to obtain an insulator 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic component in which conductive parts such as a plurality of leads and contacts arranged in a line extend from an insulating material formed by resin molding, and a manufacturing method thereof. It is about.

[0002]

2. Description of the Related Art Conventionally, for example, as shown in FIGS.
There is known an electronic component 11 in which a component having a conductive portion 12 such as a plurality of leads and contacts arranged in a line is sealed with a synthetic resin insulator 13 by molding.

Insulator 1 in such electronic component 11
Molding by 3 is performed by sandwiching the conductive portion 12 between a pair of upper and lower molds and injecting a resin into a mold space formed in the mold. Therefore, the conductive part 1 in the upper and lower molds
A groove for passing each conductive portion 12 is formed in a comb-like shape on the joint surface of the outer edge on the side where 2 extends.

[0004]

In the conventional molding method of electronic parts described above, there is a problem that it becomes difficult to manufacture a mold when the conductive parts are miniaturized due to the integration of electronic parts and the pitch thereof is reduced. is there.

Therefore, it is an object of the present invention to provide a structure of an electronic component which does not need to form a fine groove for penetrating a conductive portion in a mold for molding an insulating portion, and a manufacturing method thereof. ..

[0006]

According to the present invention, in order to solve the above-mentioned problems, a required range of a plurality of conductive parts is covered with insulating tapes adhered to the front and back sides, and the insulating tapes are used to end face the insulator. The parts are molded in a slightly protruding state.

Further, in order to manufacture this electronic component, after the insulating tape is smoothly adhered from the front and back sides to the required areas of the plurality of conductive parts arranged in a line, the insulating tape is smoothed on the extension side of the conductive parts. A method was used in which a conductive part was sandwiched between upper and lower molds so that the molding boundary was located on the surface, and a resin was injected into the mold space formed by the upper and lower molds to mold an insulator.

[0008]

In the electronic part according to the present invention, when an insulating material is molded, the area of the conductive portion to be covered with the insulating material is first coated with an insulating tape. Insulation tape
It is attached to the front and back of the conductive part to cover the front and back of the conductive part smoothly.

Next, in order to mold the insulating material, the conductive part is sandwiched between the upper and lower molds, and a resin is injected into the mold space formed inside and cured. The mold boundaries in the upper and lower molds are located on the smooth surface of the insulating tape. The bonding surface on the boundary line side of the upper and lower molds is formed smooth, but since this is in close contact with the surface of the smooth insulating tape, resin leakage does not occur.

[0010]

An embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component according to the present invention, FIG. 2 is a plan view of a manufacturing process of the electronic component according to the present invention, FIG. 3 is a sectional view taken along line BB in FIG. 2, and FIG. FIG. 5 is a cross-sectional view taken along line C, and FIG. 5 is a cross-sectional view showing the molding process of the electronic component according to the present invention.

As shown in FIG. 1, in an electronic component 1 according to the present invention, a plurality of conductive portions 3 are arranged in a line from an insulating material 2 made of synthetic resin. These conductive parts 3 are
Insulating tape 4 adhered to the front and back sides within the required range
Is covered by. That is, the insulating tape 4 extends to the outside of the portion covered with the insulator 2 and the extending side of the conductive portion 3. Therefore, the end surface 2a of the insulator 2 is located inside the outer edge of the insulating tape 4, that is, on the surface of the insulating tape 4, and the insulating tape 4 covering the conductive portion 3 extends from the end surface 2a. ..

FIG. 2 shows a state after the components are molded with the insulator 2 and before the parts are separated from the frame 5. 9 is a positioning hole. Molding is shown in Figure 5.
As shown in FIG. 3, the conductive part 3 supported by the frame 5 is sandwiched between the upper and lower molds 6 and 7, and the resin is injected into the mold space 8 formed in the molds 6 and 7. In the method of the present invention, the conductive portion 3 is formed prior to the molding step.
The insulating tape 4 is attached to the front and back sides of the required range. The range of attachment of the insulating tape 4 extends to the outside of the mold boundary line A of the insulator 2 on the side covered with the insulator 2 and the extending side of the conductive portion 3. Then, the upper and lower molds 6 and 7 are matched so that the mold boundary line A is located on the insulating tape 4. The joint surfaces 6a, 7a on the outer sides of the mold boundary line A in the molds 6, 7 are formed to be smooth, but this portion adheres to the smooth surface of the insulating tape. Therefore, when the resin is injected into the mold space 8, the resin does not leak from here. Since the joint surfaces 6a and 7a are smooth, their manufacture is easy.

[0013]

As described above, in the present invention, the required range of the plurality of conductive portions is covered with the insulating tape adhered to the front and back surfaces, and the end face of the insulator is insulated on the extension side of the conductive portion. Electronic components are constructed by terminating on the smooth surface of the tape. Also, in order to manufacture this electronic component,
After bonding the insulating tape smoothly from the front and back to the required area of the conductive parts arranged in a line, on the extension side of the conductive part, arrange the boundary line of the molding on the smooth surface of the insulating tape. By sandwiching the conductive part between the upper and lower molds and injecting a resin into the mold space formed by the upper and lower molds to mold an insulator, a mold for molding the insulating part, Since it is not necessary to form a groove for penetrating the fine conductive portion, there is an effect that the mold can be easily manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component according to the present invention.

FIG. 2 is a plan view of the manufacturing process of the electronic component according to the present invention.

FIG. 3 is a sectional view taken along line BB in FIG.

4 is a cross-sectional view taken along the line CC in FIG.

FIG. 5 is a cross-sectional view showing the molding process of the electronic component according to the present invention.

FIG. 6 is a plan view of a conventional electronic component.

7 is a cross-sectional view taken along the line DD in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Insulator 2a End face 3 Conductive part 4 Insulating tape 6, 7 type 8 Mold space A Mold boundary line

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location // H01G 1/02 K 9174-5E

Claims (2)

[Claims] 1. An electronic component having a plurality of conductive portions extending in a line from a molded insulator,
Electronic parts characterized in that required parts of the plurality of conductive parts are covered with insulating tapes adhered to the front and back surfaces, and the parts are molded with the insulating tapes slightly protruding from the end faces of the insulator. .. 2. An electronic component having a plurality of conductive parts extending in a line from a molded insulator,
After the insulating tape is smoothly adhered to the required range of the plurality of conductive parts arranged in a line from the front and back, the boundary line of the molding is located on the smooth surface of the insulating tape on the extending side of the conductive part. In this manner, the conductive part is sandwiched between the upper and lower molds, and the insulating material is molded by injecting a resin into the mold space formed by the upper and lower molds.