JPS6452260U - - Google Patents

Info

Publication number
JPS6452260U
JPS6452260U JP14888187U JP14888187U JPS6452260U JP S6452260 U JPS6452260 U JP S6452260U JP 14888187 U JP14888187 U JP 14888187U JP 14888187 U JP14888187 U JP 14888187U JP S6452260 U JPS6452260 U JP S6452260U
Authority
JP
Japan
Prior art keywords
groove
lead electrode
circuit board
lead
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14888187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14888187U priority Critical patent/JPS6452260U/ja
Publication of JPS6452260U publication Critical patent/JPS6452260U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例である回路基板を説
明するための斜視図、第2図は第1図における
―線に沿う断面図、第3図は第2図における
―線に沿う断面図、第4図は回路基板をチユー
ナ装置に組込んだ状態を示す断面図、第5図は本
考案の変形例を説明するための斜視図、第6図は
第5図における―線に沿う断面図である。 1,10……回路基板、2……絶縁基板、3,
11……溝部、4,12……リード電極、7……
チユーナ装置、8……金属ケース。
Fig. 1 is a perspective view for explaining a circuit board that is an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along line - in Fig. 1, and Fig. 3 is a cross-sectional view taken along line - in Fig. 2. Figure 4 is a sectional view showing the state in which the circuit board is assembled into the tuner device, Figure 5 is a perspective view for explaining a modification of the present invention, and Figure 6 is taken along the - line in Figure 5. FIG. 1, 10... Circuit board, 2... Insulating board, 3,
11... Groove, 4, 12... Lead electrode, 7...
Tuner device, 8...metal case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に導電層がパターン形成されたリー
ド電極を設けてなる回路基板において、該リード
電極の配設位置に溝部を形成し、該溝部内に該リ
ード電極を形成してなる構成の回路基板。
A circuit board comprising lead electrodes with a conductive layer patterned on an insulating substrate, wherein a groove is formed at the position where the lead electrode is arranged, and the lead electrode is formed in the groove. .
JP14888187U 1987-09-29 1987-09-29 Pending JPS6452260U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14888187U JPS6452260U (en) 1987-09-29 1987-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14888187U JPS6452260U (en) 1987-09-29 1987-09-29

Publications (1)

Publication Number Publication Date
JPS6452260U true JPS6452260U (en) 1989-03-31

Family

ID=31420600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14888187U Pending JPS6452260U (en) 1987-09-29 1987-09-29

Country Status (1)

Country Link
JP (1) JPS6452260U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015038898A (en) * 2009-12-04 2015-02-26 株式会社東芝 Electronic apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102594A (en) * 1981-12-14 1983-06-18 東芝ケミカル株式会社 Electric circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102594A (en) * 1981-12-14 1983-06-18 東芝ケミカル株式会社 Electric circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015038898A (en) * 2009-12-04 2015-02-26 株式会社東芝 Electronic apparatus

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