JPS6452272U - - Google Patents
Info
- Publication number
- JPS6452272U JPS6452272U JP1987148879U JP14887987U JPS6452272U JP S6452272 U JPS6452272 U JP S6452272U JP 1987148879 U JP1987148879 U JP 1987148879U JP 14887987 U JP14887987 U JP 14887987U JP S6452272 U JPS6452272 U JP S6452272U
- Authority
- JP
- Japan
- Prior art keywords
- electrode portion
- circuit board
- terminal
- conductive layer
- board device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の一実施例である回基板装置を
示す図（第２図におけるＡ―Ａ線に沿う断面図）
、第２図は回路基板装置の平面図、第３図は回路
基板装置を内設したチユーナ装置の断面図、第４
図乃至第６図は凹部の変形例を説明するための図
、第７図は従来の回路基板装置の一例を内設した
チユーナ装置の断面図である。
６……回路基板装置、７……絶縁基板、８……
導電層、９……電子部品、９ａ……端子、１０…
…チユーナ装置、１０ａ……ケース、１１，１４
，１５，１６……凹部、１２……電極部、１３…
…半田。
Fig. 1 is a diagram showing a circuit board device that is an embodiment of the present invention (a cross-sectional view taken along line A-A in Fig. 2).
, FIG. 2 is a plan view of the circuit board device, FIG. 3 is a sectional view of the tuner device in which the circuit board device is installed, and FIG. 4 is a plan view of the circuit board device.
6 to 6 are diagrams for explaining modified examples of the recess, and FIG. 7 is a sectional view of a tuner device in which an example of a conventional circuit board device is installed. 6...Circuit board device, 7...Insulating board, 8...
Conductive layer, 9...Electronic component, 9a...Terminal, 10...
...Tuner device, 10a...Case, 11, 14
, 15, 16... recessed part, 12... electrode part, 13...
…solder.
Claims (1)
該導電層に設けられている電極部に電子部品の端
子が半田付けされてなる回路基板装置において、 該絶縁基板の上記電極部形成位置に凹部を設け
ると共に、該凹部内を含めて該導電層を配設して
電極部を形成し、該電極部に上記電子部品の端子
を挿入して接続してなる構成の回路基板装置。[Claims for Utility Model Registration] A conductive layer is patterned on an insulating substrate,
In a circuit board device in which a terminal of an electronic component is soldered to an electrode portion provided on the conductive layer, a recess is provided at the electrode portion formation position of the insulating substrate, and the conductive layer including the inside of the recess is provided. A circuit board device having a structure in which an electrode portion is formed by arranging a terminal, and a terminal of the electronic component is inserted and connected to the electrode portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987148879U JPS6452272U (en) | 1987-09-29 | 1987-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987148879U JPS6452272U (en) | 1987-09-29 | 1987-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6452272U true JPS6452272U (en) | 1989-03-31 |
Family
ID=31420596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987148879U Pending JPS6452272U (en) | 1987-09-29 | 1987-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6452272U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0431219U (en) * | 1990-07-09 | 1992-03-13 | ||
| JP2022014489A (en) * | 2020-07-07 | 2022-01-20 | 三菱電機株式会社 | On-vehicle electronic control device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225491A (en) * | 1985-07-25 | 1987-02-03 | 松下電工株式会社 | Printed wiring board and making thereof |
-
1987
- 1987-09-29 JP JP1987148879U patent/JPS6452272U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225491A (en) * | 1985-07-25 | 1987-02-03 | 松下電工株式会社 | Printed wiring board and making thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0431219U (en) * | 1990-07-09 | 1992-03-13 | ||
| JP2022014489A (en) * | 2020-07-07 | 2022-01-20 | 三菱電機株式会社 | On-vehicle electronic control device |
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