JPS62112159U - - Google Patents
Info
- Publication number
- JPS62112159U JPS62112159U JP20321085U JP20321085U JPS62112159U JP S62112159 U JPS62112159 U JP S62112159U JP 20321085 U JP20321085 U JP 20321085U JP 20321085 U JP20321085 U JP 20321085U JP S62112159 U JPS62112159 U JP S62112159U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- external electrode
- electronic component
- protrusion
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案電子部品の一実施例を示す斜視
図、第２図は本考案電子部品の他の実施例を示す
斜視図、第３図は電子部品の搭載状態を示す断面
図、第４図は第３図の―線拡大断面図、第５
図は従来の電子部品の搭載状態を示す説明図であ
る。
１，１′……電子部品、２……基板、３……導
電パターン、４……クリーム半田、５′，５″…
…外部電極、６，６′……突起。
FIG. 1 is a perspective view showing one embodiment of the electronic component of the present invention, FIG. 2 is a perspective view of another embodiment of the electronic component of the present invention, and FIG. 3 is a cross-sectional view showing the state in which the electronic component is mounted. Figure 4 is an enlarged sectional view taken along the line - in Figure 3, and Figure 5.
The figure is an explanatory diagram showing a state in which conventional electronic components are mounted. 1, 1'... Electronic component, 2... Board, 3... Conductive pattern, 4... Cream solder, 5', 5''...
...External electrode, 6,6'...protrusion.
Claims (1)
半田付け固定するようにした電子部品において、 上記外部電極に導電パターンとの間に間隙を形
成する突起を形成したことを特徴とする電子部品
。[Scope of Claim for Utility Model Registration] An electronic component in which an external electrode is fixed by soldering to a conductive pattern formed on a substrate, in which a protrusion is formed on the external electrode to form a gap between the conductive pattern and the conductive pattern. Electronic components featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20321085U JPS62112159U (en) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20321085U JPS62112159U (en) | 1985-12-27 | 1985-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62112159U true JPS62112159U (en) | 1987-07-17 |
Family
ID=31168325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20321085U Pending JPS62112159U (en) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112159U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101326907B1 (en) * | 2005-10-10 | 2013-11-11 | 콘티넨탈 오토모티브 게엠베하 | Electrical device |
| JP2017068960A (en) * | 2015-09-29 | 2017-04-06 | 京セラ株式会社 | heater |
| JP2019062042A (en) * | 2017-09-26 | 2019-04-18 | 太陽誘電株式会社 | Electronic component with metal terminal and electronic component mounted circuit board |
-
1985
- 1985-12-27 JP JP20321085U patent/JPS62112159U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101326907B1 (en) * | 2005-10-10 | 2013-11-11 | 콘티넨탈 오토모티브 게엠베하 | Electrical device |
| JP2017068960A (en) * | 2015-09-29 | 2017-04-06 | 京セラ株式会社 | heater |
| JP2019062042A (en) * | 2017-09-26 | 2019-04-18 | 太陽誘電株式会社 | Electronic component with metal terminal and electronic component mounted circuit board |