JPH0276871U - - Google Patents
Info
- Publication number
- JPH0276871U JPH0276871U JP15560488U JP15560488U JPH0276871U JP H0276871 U JPH0276871 U JP H0276871U JP 15560488 U JP15560488 U JP 15560488U JP 15560488 U JP15560488 U JP 15560488U JP H0276871 U JPH0276871 U JP H0276871U
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- circuit
- pattern
- pattern provided
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Waveguide Connection Structure (AREA)
Description
第１図は本考案の高周波回路の回路側のパター
ンの一例を示す平面図、第２図ａ，ｂ，ｃは本考
案の高周波回路の高周波素子の一例を示す平面図
、側面図、裏面図、第３図ａ，ｂは第２図の高周
波素子を第１図の回路パターンに半田付けして装
着した状態を示す平面図、側面図、第４図ａ，ｂ
，ｃ，ｄは従来のこの種の高周波回路における高
周波素子の位置ずれ状態の例を示す平面図である
。
１……高周波素子、１１……パツケージ、１２
……リード電極、１３……位置決め用パターン、
２……回路パターン、３……半田、４……位置決
め用パターン。なお図中同一符号は同一または相
当する部分を示す。
Fig. 1 is a plan view showing an example of a pattern on the circuit side of the high-frequency circuit of the present invention, and Fig. 2 a, b, and c are plan views, side views, and back views showing examples of the high-frequency elements of the high-frequency circuit of the present invention. , Figures 3a and b are a plan view and side view showing the state in which the high-frequency element of Figure 2 is soldered and attached to the circuit pattern of Figure 1, and Figures 4a and b are
, c, and d are plan views showing examples of misaligned high-frequency elements in conventional high-frequency circuits of this type. 1... High frequency element, 11... Package, 12
...Lead electrode, 13...Positioning pattern,
2...Circuit pattern, 3...Solder, 4...Positioning pattern. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
着される高周波回路において、上記高周波素子が
該素子のパツケージに設けられたパターンと上記
回路パターンの配設された基板面に設けられたパ
ターンとの半田付けにより位置決めされて装着さ
れたことを特徴とする高周波回路。 In a high-frequency circuit in which a high-frequency element is mounted by soldering to a circuit pattern, the high-frequency element is soldered between a pattern provided on a package of the element and a pattern provided on a substrate surface on which the circuit pattern is arranged. A high frequency circuit characterized by being positioned and mounted by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15560488U JPH0276871U (en) | 1988-12-01 | 1988-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15560488U JPH0276871U (en) | 1988-12-01 | 1988-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276871U true JPH0276871U (en) | 1990-06-13 |
Family
ID=31433380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15560488U Pending JPH0276871U (en) | 1988-12-01 | 1988-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276871U (en) |
-
1988
- 1988-12-01 JP JP15560488U patent/JPH0276871U/ja active Pending