JPS645476U - - Google Patents
Info
- Publication number
- JPS645476U JPS645476U JP9778387U JP9778387U JPS645476U JP S645476 U JPS645476 U JP S645476U JP 9778387 U JP9778387 U JP 9778387U JP 9778387 U JP9778387 U JP 9778387U JP S645476 U JPS645476 U JP S645476U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- chip component
- rectangular
- leadless chip
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図、第２図ａ，ｂはこの考案の一実施例を
示し、第１図は角形リードレスチツプ部品塔載前
の状態を示す斜視図、第２図ａは角形リードレス
チツプ部品が塔載された状態を示す断面図、第２
図ｂはリフロー半田付け後の状態を示す断面図、
第３図、第４図ａ，ｂは従来の例を示し、第３図
は角形リードレスチツプ部品塔載前の状態を示す
斜視図、第４図ａは角形リードレスチツプ部品が
塔載された状態を示す断面図、第４図ｂはリフロ
ー半田付け後の状態を示す断面図である。
図において、１はリードレスチツプ部品、２は
電極パツド、３は基板、４は電極パターン、５は
回路パターン、６は半田ペースト、７は溶融・凝
固半田、８は半田付けパツド、９はパツドパター
ンである。なお、各図中同一符号は同一または相
当部分を示す。
Figures 1, 2a and 2b show an embodiment of this invention, with Figure 1 being a perspective view showing the state before mounting a rectangular leadless chip component, and Figure 2a showing a rectangular leadless chip component mounted on the chip. Cross-sectional view showing the mounted state, 2nd
Figure b is a cross-sectional view showing the state after reflow soldering,
3 and 4a and 4b show conventional examples, FIG. 3 is a perspective view showing the state before the prismatic leadless chip component is mounted, and FIG. 4a is the prismatic leadless chip component before it is mounted. FIG. 4b is a sectional view showing the state after reflow soldering. In the figure, 1 is a leadless chip component, 2 is an electrode pad, 3 is a substrate, 4 is an electrode pattern, 5 is a circuit pattern, 6 is a solder paste, 7 is melted/solidified solder, 8 is a soldering pad, and 9 is a pad pattern. It is. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
前記１つの面に前記電極パツドとは独立した半田
付けパツドを有する角形リードレスチツプ部品と
、前記角形リードレスチツプ部品の両端の電極パ
ツドの各々に対応する２つの電極パターン及び前
記の半田付け用パツドに対応し、かつ前記２つの
電極パターンとは独立したパツドパターンを有す
る基板とで構成され、前記角形リードレスチツプ
部品の両端の電極パツドと前記基板の２つの電極
パターンとが各々半田付けされると共に、この角
形リードレスチツプ部品の前記半田付けパツドと
基板の前記パツドパターンとが半田付けされてい
ることを特徴とする角形リードレスチツプ部品の
実装構造。 having electrode pads at both ends of at least one surface;
A rectangular leadless chip component having a soldering pad independent of the electrode pad on the one surface, two electrode patterns corresponding to each of the electrode pads at both ends of the rectangular leadless chip component, and the soldering pad described above. and a board having a pad pattern that corresponds to the pad and is independent of the two electrode patterns, and the electrode pads at both ends of the rectangular leadless chip component are soldered to the two electrode patterns of the board, respectively. Also, a mounting structure for a rectangular leadless chip component, characterized in that the soldering pad of the rectangular leadless chip component and the pad pattern of the board are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9778387U JPS645476U (en) | 1987-06-25 | 1987-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9778387U JPS645476U (en) | 1987-06-25 | 1987-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645476U true JPS645476U (en) | 1989-01-12 |
Family
ID=31323487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9778387U Pending JPS645476U (en) | 1987-06-25 | 1987-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645476U (en) |
-
1987
- 1987-06-25 JP JP9778387U patent/JPS645476U/ja active Pending