JPS6175160U - - Google Patents
Info
- Publication number
- JPS6175160U JPS6175160U JP16091284U JP16091284U JPS6175160U JP S6175160 U JPS6175160 U JP S6175160U JP 16091284 U JP16091284 U JP 16091284U JP 16091284 U JP16091284 U JP 16091284U JP S6175160 U JPS6175160 U JP S6175160U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern
- leadless
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はリードレス部品の平面図、第２図は従
来の印刷配線板の平面図、第３図は従来の印刷配
線板装置の実装状態を示す平面図、第４図は第３
図の−線による断面を示す断面図、第５図な
いし第７図はこの考案の一実施例を示す図で、第
５図は印刷配線板の平面図、第６図は印刷配線板
装置の実装状態を示す平面図、第７図は第６図の
−線による断面を示す断面図である。
図において、１はリードレス部品、２はその電
極、３は印刷配線板、４はパターン、５はハンダ
、６はガスの逃げ穴である。なお、図中、同一符
号は同一又は相当部分を示す。
Fig. 1 is a plan view of a leadless component, Fig. 2 is a plan view of a conventional printed wiring board, Fig. 3 is a plan view showing the mounting state of a conventional printed wiring board device, and Fig. 4 is a plan view of a conventional printed wiring board device.
5 to 7 are views showing an embodiment of the invention, FIG. 5 is a plan view of a printed wiring board, and FIG. 6 is a plan view of a printed wiring board device. FIG. 7 is a plan view showing the mounted state, and a cross-sectional view taken along the line - in FIG. 6. In the figure, 1 is a leadless component, 2 is its electrode, 3 is a printed wiring board, 4 is a pattern, 5 is solder, and 6 is a gas escape hole. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ダ付けして固着させる印刷配線板装置において、
上記リードレス部品がハンダ付けされる部分のパ
ターンと、そのパターンが固着された部分の印刷
配線板とに、上記ハンダ付け時に発生するガスの
逃げ穴を設けたことを特徴とする印刷配線板装置
。 In printed wiring board equipment that solders and fixes leadless components to printed wiring board patterns,
A printed wiring board device characterized in that a pattern in a portion where the leadless component is soldered and a portion of the printed wiring board to which the pattern is fixed are provided with escape holes for gas generated during the soldering. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16091284U JPS6175160U (en) | 1984-10-22 | 1984-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16091284U JPS6175160U (en) | 1984-10-22 | 1984-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6175160U true JPS6175160U (en) | 1986-05-21 |
Family
ID=30718824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16091284U Pending JPS6175160U (en) | 1984-10-22 | 1984-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6175160U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119962U (en) * | 1991-04-10 | 1992-10-27 | オムロン株式会社 | Terminal pin mounting structure on circuit board |
-
1984
- 1984-10-22 JP JP16091284U patent/JPS6175160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119962U (en) * | 1991-04-10 | 1992-10-27 | オムロン株式会社 | Terminal pin mounting structure on circuit board |