JPH0327067U - - Google Patents
Info
- Publication number
- JPH0327067U JPH0327067U JP8757289U JP8757289U JPH0327067U JP H0327067 U JPH0327067 U JP H0327067U JP 8757289 U JP8757289 U JP 8757289U JP 8757289 U JP8757289 U JP 8757289U JP H0327067 U JPH0327067 U JP H0327067U
- Authority
- JP
- Japan
- Prior art keywords
- component
- width
- wiring board
- printed wiring
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図、第２図はそれぞれこの考案の一実施例
を示す図、第３図〜第５図はそれぞれ従来の部品
取付ランドを説明するための図。
１……部品取付ランド、２……部品リード、３
……印刷配線板、４……取付部品、５……半田フ
イレツト。なお、各図中同一符号は同一又は相当
部分を示すものとする。
FIGS. 1 and 2 are views showing one embodiment of this invention, and FIGS. 3 to 5 are views for explaining conventional parts mounting lands, respectively. 1... Parts mounting land, 2... Parts lead, 3
...Printed wiring board, 4...Mounting parts, 5...Solder fillet. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
部品リードを半田接合し、上記印刷配線板上に上
記表面実装部品を取り付けるための部品取付ラン
ドにおいて、 半田ブリツジが形成され易い中央部だけその横
幅を狭くし、両端部は上記部品リードの横幅より
広くした形状とすることを特徴とする部品取付ラ
ンド。[Scope of Claim for Utility Model Registration] A solder bridge is formed on a printed wiring board, and a component mounting land for soldering component leads from a surface mount component and attaching the surface mount component to the printed wiring board. A component mounting land characterized in that the width of the land is narrower only in the central portion where it is easy to be formed, and the width of both ends is wider than the width of the component lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8757289U JPH0327067U (en) | 1989-07-26 | 1989-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8757289U JPH0327067U (en) | 1989-07-26 | 1989-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327067U true JPH0327067U (en) | 1991-03-19 |
Family
ID=31637214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8757289U Pending JPH0327067U (en) | 1989-07-26 | 1989-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033570A (en) * | 2011-08-02 | 2013-02-14 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension |
-
1989
- 1989-07-26 JP JP8757289U patent/JPH0327067U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033570A (en) * | 2011-08-02 | 2013-02-14 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension |
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