JPS62170676U - - Google Patents
Info
- Publication number
- JPS62170676U JPS62170676U JP5861186U JP5861186U JPS62170676U JP S62170676 U JPS62170676 U JP S62170676U JP 5861186 U JP5861186 U JP 5861186U JP 5861186 U JP5861186 U JP 5861186U JP S62170676 U JPS62170676 U JP S62170676U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- surface mount
- component
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例である印刷配線板
における部品リード線と部品搭載パターンのはん
だ付け状態を示す要部の拡大図、第２図は従来の
印刷配線板に表面実装部品をはんだ付けした状態
を示す側面図、第３図は、第２図の部品リード線
と部品搭載パターンのはんだ付け状態を示す要部
の拡大図である。
図において、１…印刷配線板、２…表面実装部
品、３…部品リード線、４…部品搭載パターン、
５…はんだフイレツト、６…部品搭載パターン４
の側面である。なお、各図中、同一符号は同一、
又は相当部分を示す。
Figure 1 is an enlarged view of the main parts showing the soldering state of component lead wires and component mounting patterns on a printed wiring board that is an example of this invention, and Figure 2 is an enlarged view of the soldering of surface mount components on a conventional printed wiring board. FIG. 3, which is a side view showing the attached state, is an enlarged view of the main part showing the soldered state of the component lead wire and the component mounting pattern of FIG. 2. In the figure, 1...Printed wiring board, 2...Surface mount component, 3...Component lead wire, 4...Component mounting pattern,
5...Solder fillet, 6...Component mounting pattern 4
This is an aspect of In addition, in each figure, the same reference numerals are the same,
or a corresponding portion.
Claims (1)
部品を搭載する印刷配線板において、この印刷配
線板の前記表面実装部品の搭載パターンの厚みを
、この表面実装部品の部品リード線の厚みよりも
厚くする構成としたことを特徴とする印刷配線板
。 In a printed wiring board on which surface mount components such as flatpack ICs and chip components are mounted, the thickness of the mounting pattern of the surface mount components on this printed wiring board is made thicker than the thickness of the component lead wire of this surface mount component. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5861186U JPS62170676U (en) | 1986-04-18 | 1986-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5861186U JPS62170676U (en) | 1986-04-18 | 1986-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62170676U true JPS62170676U (en) | 1987-10-29 |
Family
ID=30889340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5861186U Pending JPS62170676U (en) | 1986-04-18 | 1986-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62170676U (en) |
-
1986
- 1986-04-18 JP JP5861186U patent/JPS62170676U/ja active Pending