JPH0377458U - - Google Patents
Info
- Publication number
- JPH0377458U JPH0377458U JP13878289U JP13878289U JPH0377458U JP H0377458 U JPH0377458 U JP H0377458U JP 13878289 U JP13878289 U JP 13878289U JP 13878289 U JP13878289 U JP 13878289U JP H0377458 U JPH0377458 U JP H0377458U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead terminal
- printed wiring
- mount component
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例を示す図、第２図は
従来例を示す図、第３図は第２図の右側面図、第
４図は他の従来例を示す図である。
１……表面実装部品、２……パツケージ、３…
…リード端子、３ａ……垂直部、３ｂ……水平部
、４……プリント基板、４ａ……表面、４ｂ……
プリント配線、５……はんだフイレツト。
FIG. 1 is a diagram showing an embodiment of this invention, FIG. 2 is a diagram showing a conventional example, FIG. 3 is a right side view of FIG. 2, and FIG. 4 is a diagram showing another conventional example. 1...Surface mount component, 2...Package, 3...
...Lead terminal, 3a...Vertical part, 3b...Horizontal part, 4...Printed circuit board, 4a...Surface, 4b...
Printed wiring, 5...Solder fillet.
Claims (1)
出されたリード端子３を、プリント基板４の表面
４ａのプリント配線４ｂに接続する表面実装部品
１であつて、 前記リード端子３を、垂直部３ａからプリント
配線４ｂに当接する水平部３ｂをパツケージ２側
に折り曲げて形成したことを特徴とする表面実装
部品。[Claims for Utility Model Registration] A surface mount component 1 in which a lead terminal 3 exposed from a package 2 forming the surface mount component 1 is connected to a printed wiring 4b on a surface 4a of a printed circuit board 4, wherein the lead terminal 3 is formed by bending the horizontal portion 3b that contacts the printed wiring 4b from the vertical portion 3a toward the package 2 side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13878289U JPH0377458U (en) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13878289U JPH0377458U (en) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377458U true JPH0377458U (en) | 1991-08-05 |
Family
ID=31685860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13878289U Pending JPH0377458U (en) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377458U (en) |
-
1989
- 1989-11-30 JP JP13878289U patent/JPH0377458U/ja active Pending