JPS5818346U - IC package - Google Patents

IC package

Info

Publication number
JPS5818346U
JPS5818346U JP11207781U JP11207781U JPS5818346U JP S5818346 U JPS5818346 U JP S5818346U JP 11207781 U JP11207781 U JP 11207781U JP 11207781 U JP11207781 U JP 11207781U JP S5818346 U JPS5818346 U JP S5818346U
Authority
JP
Japan
Prior art keywords
package
connector
peripheral wall
leads
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11207781U
Other languages
Japanese (ja)
Other versions
JPS6127183Y2 (en
Inventor
幸祐 西村
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP11207781U priority Critical patent/JPS5818346U/en
Publication of JPS5818346U publication Critical patent/JPS5818346U/en
Application granted granted Critical
Publication of JPS6127183Y2 publication Critical patent/JPS6127183Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例であるＩＣパッケージをプリン
ト基板に実装する手順を説明する図、第２図は同ＩＣパ
ッケージを６個実装後の外観斜視図、第３図は使用例を
示す図である。 ＰはＩＣパッケージ、Ｌはリード、ＰＷＢはプリント基
板、Ｓは半田、Ｂはワイヤ、Ｃは配線パターン。Fig. 1 is a diagram explaining the procedure for mounting an IC package, which is an embodiment of the present invention, on a printed circuit board, Fig. 2 is a perspective view of the external appearance after six of the same IC packages are mounted, and Fig. 3 shows an example of use. It is a diagram. P is the IC package, L is the lead, PWB is the printed circuit board, S is the solder, B is the wire, and C is the wiring pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パッケージ本体の天面の略中央部に外周壁にリードを配
設してなる凸状のコネクタ一部を設け、また底面の上記
凸状コネクタ一部に対応する位置に内周壁に上記リード
の一方を導いて配設してなる凹状のコネクタ一部を設け
ると共に、上記両コネクタ一部は互いに電気的且つ機械
的に装脱自在の関係にあるように形成してなることを特
徴とするＩＣパッケージ。A part of the convex connector with leads arranged on the outer peripheral wall is provided approximately at the center of the top surface of the package body, and one of the leads is provided on the inner peripheral wall at a position corresponding to the part of the convex connector on the bottom surface. An IC package characterized in that a concave connector portion is provided, and the connector portions are formed in such a manner that they are electrically and mechanically detachable from each other. .
JP11207781U 1981-07-27 1981-07-27 IC package Granted JPS5818346U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11207781U JPS5818346U (en) 1981-07-27 1981-07-27 IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11207781U JPS5818346U (en) 1981-07-27 1981-07-27 IC package

Publications (2)

Publication Number Publication Date
JPS5818346U true JPS5818346U (en) 1983-02-04
JPS6127183Y2 JPS6127183Y2 (en) 1986-08-13

Family

ID=29906418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11207781U Granted JPS5818346U (en) 1981-07-27 1981-07-27 IC package

Country Status (1)

Country Link
JP (1) JPS5818346U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140738A (en) * 1991-03-12 1994-05-20 Ibiden Co Ltd Leadless chip carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140738A (en) * 1991-03-12 1994-05-20 Ibiden Co Ltd Leadless chip carrier

Also Published As

Publication number Publication date
JPS6127183Y2 (en) 1986-08-13

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