JPH0211377U - - Google Patents
Info
- Publication number
- JPH0211377U JPH0211377U JP8917188U JP8917188U JPH0211377U JP H0211377 U JPH0211377 U JP H0211377U JP 8917188 U JP8917188 U JP 8917188U JP 8917188 U JP8917188 U JP 8917188U JP H0211377 U JPH0211377 U JP H0211377U
- Authority
- JP
- Japan
- Prior art keywords
- mini
- wiring board
- molded components
- board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は従来例を示す平面図である。
１……導体パツド、２……半田誘導ランド、３
……回路パターン、Ａ……ミニモールド部品、Ａ
′……電極リード。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a plan view showing a conventional example. 1...Conductor pad, 2...Solder guiding land, 3
...Circuit pattern, A...Mini mold parts, A
'...Electrode lead.
Claims (1)
導体パツドが形成された高密度実装配線基板にお
いて、ミニモールド部品を搭載する導体パツドの
一部より半田誘導ランドを設けたことを特徴とす
る高密度実装配線基板。 A high-density mounting wiring board on which conductor pads for mounting mini-molded components, etc. are formed on the board, characterized in that a solder guiding land is provided from a part of the conductor pad on which the mini-molded components are mounted. Mounted wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8917188U JPH0211377U (en) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8917188U JPH0211377U (en) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211377U true JPH0211377U (en) | 1990-01-24 |
Family
ID=31313721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8917188U Pending JPH0211377U (en) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211377U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05178454A (en) * | 1991-06-04 | 1993-07-20 | Yukio Ishida | Aligning transfer device |
-
1988
- 1988-07-05 JP JP8917188U patent/JPH0211377U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05178454A (en) * | 1991-06-04 | 1993-07-20 | Yukio Ishida | Aligning transfer device |