JPS6357774U - - Google Patents
Info
- Publication number
- JPS6357774U JPS6357774U JP15101086U JP15101086U JPS6357774U JP S6357774 U JPS6357774 U JP S6357774U JP 15101086 U JP15101086 U JP 15101086U JP 15101086 U JP15101086 U JP 15101086U JP S6357774 U JPS6357774 U JP S6357774U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- mount component
- surface mount
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａは本考案の一実施例の斜視図、同図ｂ
は本実施例に部品を実装する状態の斜視図、同図
ｃは本実施例の要部拡大断面図、第２図ａは従来
の印刷配線板の一例に部品を実装する状態を示す
斜視図、同図ｂは従来例の印刷配線板の要部拡大
断面図である。
１，１１……印刷配線板本体、２……回路パタ
ーン、３，１３……パツド、３ａ……凹部、４，
１４……半田、２０……表面実装部品、２０ａ…
…リード端子。
Figure 1a is a perspective view of an embodiment of the present invention, Figure 1b
2 is a perspective view of a state in which components are mounted on this embodiment, FIG. , FIG. 1B is an enlarged sectional view of a main part of a conventional printed wiring board. 1, 11... Printed wiring board body, 2... Circuit pattern, 3, 13... Pad, 3a... Recess, 4,
14...Solder, 20...Surface mount component, 20a...
...Lead terminal.
Claims (1)
ドを有する印刷配線板において、印刷配線板本体
上に設けられた前記表面実装部品用のパツドがそ
の表面中心部に前記表面実装部品のリード端子の
径より大きい凹部を備えていることを特徴とする
印刷配線板。 In a printed wiring board having a pad for a surface mount component connected to a circuit pattern, the pad for the surface mount component provided on the main body of the printed wiring board has a diameter larger than the diameter of the lead terminal of the surface mount component at the center of the surface. A printed wiring board characterized by having a large recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15101086U JPS6357774U (en) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15101086U JPS6357774U (en) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357774U true JPS6357774U (en) | 1988-04-18 |
Family
ID=31067677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15101086U Pending JPS6357774U (en) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357774U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5094476A (en) * | 1973-11-28 | 1975-07-28 | ||
| JPS59125688A (en) * | 1982-12-27 | 1984-07-20 | 富士通株式会社 | Printed board |
-
1986
- 1986-09-30 JP JP15101086U patent/JPS6357774U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5094476A (en) * | 1973-11-28 | 1975-07-28 | ||
| JPS59125688A (en) * | 1982-12-27 | 1984-07-20 | 富士通株式会社 | Printed board |