JPH0262769U - - Google Patents
Info
- Publication number
- JPH0262769U JPH0262769U JP14127788U JP14127788U JPH0262769U JP H0262769 U JPH0262769 U JP H0262769U JP 14127788 U JP14127788 U JP 14127788U JP 14127788 U JP14127788 U JP 14127788U JP H0262769 U JPH0262769 U JP H0262769U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- electrode leads
- substrate
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ及びｂは本考案の一実施例の平面図及
び表面実装部品の実装状態に対応するＡ―Ａ′線
断面図、第２図ａ及びｂは従来の印刷配線板の一
例の平面図及び表面実装部品の実装状態に対応す
るＡ―Ａ′線断面図である。
２……印刷配線層、３……パツド、４……開孔
部、５……基板、６……表面実装部品、７……リ
ード、８……半田部。
Figures 1a and b are a plan view of an embodiment of the present invention and a sectional view taken along the line A-A' corresponding to the mounting state of surface mount components, and Figures 2a and b are plane views of an example of a conventional printed wiring board. FIG. 4 is a cross-sectional view taken along the line AA′ corresponding to the mounting state of the surface-mounted components. 2...Printed wiring layer, 3...Pad, 4...Opening portion, 5...Substrate, 6...Surface mount component, 7...Lead, 8...Solder part.
Claims (1)
半田付して印刷配線層に接続する複数のパツドを
有する印刷配線板において、前記パツドの中央部
に表面から前記基板表面に達して前記電極リード
を挿入する開孔部を設けたことを特徴とする印刷
配線板。 In a printed wiring board having a plurality of pads formed on a substrate and to which electrode leads of surface mount components are soldered and connected to a printed wiring layer, the electrode leads are connected to the center of the pads from the surface to the substrate surface. A printed wiring board characterized by having an opening for insertion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127788U JPH0262769U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127788U JPH0262769U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262769U true JPH0262769U (en) | 1990-05-10 |
Family
ID=31406212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14127788U Pending JPH0262769U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262769U (en) |
-
1988
- 1988-10-28 JP JP14127788U patent/JPH0262769U/ja active Pending