JPS6452274U - - Google Patents
Info
- Publication number
- JPS6452274U JPS6452274U JP14699987U JP14699987U JPS6452274U JP S6452274 U JPS6452274 U JP S6452274U JP 14699987 U JP14699987 U JP 14699987U JP 14699987 U JP14699987 U JP 14699987U JP S6452274 U JPS6452274 U JP S6452274U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- printed wiring
- circuit pattern
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の印刷配線板の一実施例を部分
断面で示した斜視図、第2図は本考案の第2の実
施例の部分断面斜視図、第3図は従来の印刷配線
板の一例の部分断面斜視図である。
1,5,11……銅箔のパツド部、2……基板
基材、3……部品リード(電極)、6……チツプ
部品、7……チツプ部品リード。
FIG. 1 is a partial cross-sectional perspective view of an embodiment of the printed wiring board of the present invention, FIG. 2 is a partial cross-sectional perspective view of the second embodiment of the present invention, and FIG. 3 is a conventional printed wiring board. It is a partial cross-sectional perspective view of an example. 1, 5, 11... copper foil pad part, 2... board base material, 3... component lead (electrode), 6... chip component, 7... chip component lead.
Claims (1)
と、これら回路パターン上および基板上に形成さ
れた半田レジスト層とを有する印刷配線板におい
て、前記基板上に断面がV字形溝を設け、このV
字形溝に表面実装部品用パツド部を形成した事を
特徴とする印刷配線板。 In a printed wiring board having a substrate, a circuit pattern provided on the substrate, and a solder resist layer formed on the circuit pattern and the substrate, a groove having a V-shaped cross section is provided on the substrate, and the V-shaped groove is provided on the substrate.
A printed wiring board characterized in that a pad portion for surface mount components is formed in the letter-shaped groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987146999U JPH0747901Y2 (en) | 1987-09-25 | 1987-09-25 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987146999U JPH0747901Y2 (en) | 1987-09-25 | 1987-09-25 | Printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6452274U true JPS6452274U (en) | 1989-03-31 |
JPH0747901Y2 JPH0747901Y2 (en) | 1995-11-01 |
Family
ID=31417008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987146999U Expired - Lifetime JPH0747901Y2 (en) | 1987-09-25 | 1987-09-25 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0747901Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2011077487A1 (en) * | 2009-12-24 | 2013-05-02 | 三菱電機株式会社 | Electronic component equipment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61160992A (en) * | 1985-01-09 | 1986-07-21 | 松下電器産業株式会社 | Printed wiring board |
-
1987
- 1987-09-25 JP JP1987146999U patent/JPH0747901Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61160992A (en) * | 1985-01-09 | 1986-07-21 | 松下電器産業株式会社 | Printed wiring board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2011077487A1 (en) * | 2009-12-24 | 2013-05-02 | 三菱電機株式会社 | Electronic component equipment |
Also Published As
Publication number | Publication date |
---|---|
JPH0747901Y2 (en) | 1995-11-01 |