JPH0195783U - - Google Patents
Info
- Publication number
- JPH0195783U JPH0195783U JP19256987U JP19256987U JPH0195783U JP H0195783 U JPH0195783 U JP H0195783U JP 19256987 U JP19256987 U JP 19256987U JP 19256987 U JP19256987 U JP 19256987U JP H0195783 U JPH0195783 U JP H0195783U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- printed wiring
- component mounting
- mounting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案に係る追加用パツドの一実施例
を示す平面図、第２図は第１図のＡ―Ａ線断面図
、第３図は第２図に示す追加用パツドを主プリン
ト配線板に装着した状態を示す縦断面図、第４図
は本考案の他の実施例を示す平面図である。
１……基板、２……パツド、３……追加用パツ
ド（プリント配線板）、４……接着剤層、５……
主プリント配線板、６……配線ラツピング用ポス
ト、７……貫通孔、８……配線パターン、９……
絶縁被膜。
Fig. 1 is a plan view showing an embodiment of the additional pad according to the present invention, Fig. 2 is a sectional view taken along the line A-A in Fig. 1, and Fig. 3 is a main print of the additional pad shown in Fig. 2. FIG. 4 is a longitudinal cross-sectional view showing a state where the device is mounted on a wiring board, and a plan view showing another embodiment of the present invention. 1... Board, 2... Pad, 3... Additional pad (printed wiring board), 4... Adhesive layer, 5...
Main printed wiring board, 6... Post for wiring wrapping, 7... Through hole, 8... Wiring pattern, 9...
Insulating coating.
Claims (1)
ト配線板であつて、フイルム状基板と、この基板
の表面に形成された任意のパターンの導電性薄膜
よりなる部品実装用パツドと、前記基板の裏面に
形成された接着剤層と、前記主プリント配線板に
立設された配線ラツピング用ポストが嵌合可能に
穿設された貫通孔と、この貫通孔と前記パツドと
を電気的に接続する配線パターンと、これらのパ
ツド及び配線パターンの表面の少なくとも一部を
残して前記基板の表面を被覆する絶縁被膜とより
なることを特徴とするプリント配線板。 This is a printed wiring board that is additionally mounted on the surface of the main printed wiring board, and includes a film-like substrate, a component mounting pad made of a conductive thin film in an arbitrary pattern formed on the surface of the substrate, and a component mounting pad on the back surface of the substrate. The formed adhesive layer, a through-hole formed so that a wiring wrapping post installed upright on the main printed wiring board can fit therein, and a wiring pattern that electrically connects the through-hole and the pad. and an insulating coating that covers the surface of the substrate, leaving at least a portion of the surfaces of these pads and wiring patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987192569U JPH0639479Y2 (en) | 1987-12-18 | 1987-12-18 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987192569U JPH0639479Y2 (en) | 1987-12-18 | 1987-12-18 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195783U true JPH0195783U (en) | 1989-06-26 |
| JPH0639479Y2 JPH0639479Y2 (en) | 1994-10-12 |
Family
ID=31483419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987192569U Expired - Lifetime JPH0639479Y2 (en) | 1987-12-18 | 1987-12-18 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639479Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010016174A1 (en) * | 2008-08-07 | 2010-02-11 | シャープ株式会社 | Touch panel, display, and electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268270U (en) * | 1985-10-18 | 1987-04-28 |
-
1987
- 1987-12-18 JP JP1987192569U patent/JPH0639479Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268270U (en) * | 1985-10-18 | 1987-04-28 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010016174A1 (en) * | 2008-08-07 | 2010-02-11 | シャープ株式会社 | Touch panel, display, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0639479Y2 (en) | 1994-10-12 |