JPH0348263U - - Google Patents
Info
- Publication number
- JPH0348263U JPH0348263U JP10849689U JP10849689U JPH0348263U JP H0348263 U JPH0348263 U JP H0348263U JP 10849689 U JP10849689 U JP 10849689U JP 10849689 U JP10849689 U JP 10849689U JP H0348263 U JPH0348263 U JP H0348263U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductive pattern
- base material
- solder resist
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案実施例の構造を示す断面図であ
る。第２図は、フイルムカバーレイ法によりソル
ダレジストが形成されたプリント配線板の構造例
、およびその手順を説明するための断面図である
。
２……ベースフイルム、３……導体パターン、
４……ソルダレジスト層（ポリイミド樹脂製）。
FIG. 1 is a sectional view showing the structure of an embodiment of the present invention. FIG. 2 is a cross-sectional view for explaining an example of the structure of a printed wiring board on which a solder resist is formed by the film coverlay method, and the procedure thereof. 2...Base film, 3...Conductor pattern,
4...Solder resist layer (made of polyimide resin).
Claims (1)
形成された配線板において、上記基材の上記導体
パターン形成面がポリイミド樹脂製のソルダレジ
スト層により保護されていることを特徴とする、
プリント配線板。 A wiring board in which a conductive pattern is formed on the surface of a base material such as a base film, characterized in that the surface of the base material on which the conductive pattern is formed is protected by a solder resist layer made of polyimide resin.
printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10849689U JPH0348263U (en) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10849689U JPH0348263U (en) | 1989-09-16 | 1989-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348263U true JPH0348263U (en) | 1991-05-08 |
Family
ID=31657135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10849689U Pending JPH0348263U (en) | 1989-09-16 | 1989-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348263U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204050A (en) * | 2000-12-27 | 2002-07-19 | Toray Eng Co Ltd | Metal wiring circuit board and its manufacturing method |
| JP2003064509A (en) * | 2001-08-27 | 2003-03-05 | Hiroko Komoda | Synthetic resin glove |
-
1989
- 1989-09-16 JP JP10849689U patent/JPH0348263U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002204050A (en) * | 2000-12-27 | 2002-07-19 | Toray Eng Co Ltd | Metal wiring circuit board and its manufacturing method |
| JP2003064509A (en) * | 2001-08-27 | 2003-03-05 | Hiroko Komoda | Synthetic resin glove |