JPS60172361U - Printed board - Google Patents

Printed board

Info

Publication number
JPS60172361U
JPS60172361U JP5912784U JP5912784U JPS60172361U JP S60172361 U JPS60172361 U JP S60172361U JP 5912784 U JP5912784 U JP 5912784U JP 5912784 U JP5912784 U JP 5912784U JP S60172361 U JPS60172361 U JP S60172361U
Authority
JP
Japan
Prior art keywords
wiring pattern
printed board
electronic component
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5912784U
Other languages
Japanese (ja)
Inventor
伸一 服部
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP5912784U priority Critical patent/JPS60172361U/en
Publication of JPS60172361U publication Critical patent/JPS60172361U/en
Pending legal-status Critical Current

Links

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例をすもので、第１図は斜視図、
第２図は第１図中■−■線に沿って示す断面図である。 図中、１は基板、２は配線パターン、５は電子部品、６
はテストランド、７は銀粉塗膜（導電性皮膜）を示す。The drawings show one embodiment of the present invention, and FIG. 1 is a perspective view;
FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1. In the figure, 1 is a board, 2 is a wiring pattern, 5 is an electronic component, and 6
7 indicates a test land, and 7 indicates a silver powder coating (conductive film).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に形成された配線パターンと、この配線パターンの
途中部位に設けられた回路検査用のテストランドと、こ
のテストランドの表面に形成された半田が付着しない導
電性皮膜と、前記配線パターーンの所定部位に装着され
た電子部品とを具備し、半田槽を通過させることにより
前記配線パターンと前記電子部品とを接続させる三とを
特徴とするプリント基板。A wiring pattern formed on a substrate, a test land for circuit inspection provided in the middle of this wiring pattern, a conductive film formed on the surface of this test land to which solder does not adhere, and a predetermined area of the wiring pattern. 3. A printed circuit board, comprising: an electronic component mounted on a portion of the printed circuit board, and connecting the wiring pattern and the electronic component by passing through a solder bath.
JP5912784U 1984-04-20 1984-04-20 Printed board Pending JPS60172361U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5912784U JPS60172361U (en) 1984-04-20 1984-04-20 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5912784U JPS60172361U (en) 1984-04-20 1984-04-20 Printed board

Publications (1)

Publication Number Publication Date
JPS60172361U true JPS60172361U (en) 1985-11-15

Family

ID=30585260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5912784U Pending JPS60172361U (en) 1984-04-20 1984-04-20 Printed board

Country Status (1)

Country Link
JP (1) JPS60172361U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031457A (en) * 1989-05-29 1991-01-08 Furukawa Battery Co Ltd:The Cell element composite of storage battery and nickel zinc sealed battery

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031457A (en) * 1989-05-29 1991-01-08 Furukawa Battery Co Ltd:The Cell element composite of storage battery and nickel zinc sealed battery

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