JPS5995656U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5995656U JPS5995656U JP18149083U JP18149083U JPS5995656U JP S5995656 U JPS5995656 U JP S5995656U JP 18149083 U JP18149083 U JP 18149083U JP 18149083 U JP18149083 U JP 18149083U JP S5995656 U JPS5995656 U JP S5995656U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- insulating substrate
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図、第３図および第４図は従来例の断面図
、第５図Ａ−Ｄは第１の実施例にかかる断面図、第６図
Ａ−Ｄは金属パイプの斜視図、第７（ｆｆｌＡ、 Ｂは
第２の実施例にかかる断面図である。
１１・・・絶縁基板、１２・・・配線パターン、１３・
・・スルーホール、−１４・・・ソルダーレジスト、１
５・・・金属層、１６・・・金属パオプ、１７・・・リ
ード線、２１・・・ソルダークリーム、２２・・・導電
性塗料。Figures 1, 2, 3 and 4 are cross-sectional views of the conventional example, Figures 5A-D are sectional views of the first embodiment, and Figures 6A-D are perspective views of the metal pipe. FIG. 7A and B are cross-sectional views of the second embodiment. 11... Insulating substrate, 12... Wiring pattern, 13...
...Through hole, -14...Solder resist, 1
5... Metal layer, 16... Metal pipe, 17... Lead wire, 21... Solder cream, 22... Conductive paint.
Claims (1)
配線パターンと、この配線パターンの形成された位置に
おいて上記絶縁基板の表裏を貫通するスルーホールと、
このスルーホール中に挿入されているパイプ状導電性ス
ルーホールピンと、上記スルーホールの周辺部に設けら
れており、上記スルーホールの周辺部に存在している配
線パターンと上記パイプ状導電性スルーホールピンとを
機械的に接合するとともに電気的にも接続する導電性接
合ペーストとからなる印刷配線基板。an insulating substrate, a desired wiring pattern formed on the surface of the insulating substrate, and a through hole passing through the front and back of the insulating substrate at the position where the wiring pattern is formed;
A pipe-shaped conductive through-hole pin inserted into this through-hole, a wiring pattern that is provided around the through-hole, and existing around the through-hole, and the pipe-shaped conductive through-hole. A printed wiring board consisting of a conductive bonding paste that mechanically and electrically connects the pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18149083U JPS5995656U (en) | 1983-11-24 | 1983-11-24 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18149083U JPS5995656U (en) | 1983-11-24 | 1983-11-24 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5995656U true JPS5995656U (en) | 1984-06-28 |
Family
ID=30393262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18149083U Pending JPS5995656U (en) | 1983-11-24 | 1983-11-24 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5995656U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340910A (en) * | 1999-03-24 | 2000-12-08 | Furukawa Electric Co Ltd:The | Metal base wiring board and manufacture thereof |
| JP2018129463A (en) * | 2017-02-10 | 2018-08-16 | 田淵電機株式会社 | Printed circuit board and printed circuit device |
-
1983
- 1983-11-24 JP JP18149083U patent/JPS5995656U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340910A (en) * | 1999-03-24 | 2000-12-08 | Furukawa Electric Co Ltd:The | Metal base wiring board and manufacture thereof |
| JP2018129463A (en) * | 2017-02-10 | 2018-08-16 | 田淵電機株式会社 | Printed circuit board and printed circuit device |
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