JPS59107172U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS59107172U JPS59107172U JP20232782U JP20232782U JPS59107172U JP S59107172 U JPS59107172 U JP S59107172U JP 20232782 U JP20232782 U JP 20232782U JP 20232782 U JP20232782 U JP 20232782U JP S59107172 U JPS59107172 U JP S59107172U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- land
- printed board
- solder
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板を組込んだ電気機器の断面
図、第２図及び第３図と第４図及び第５図は第１図のプ
リント基板の各組立段階での各部分拡大裏面図及びＴ１
−Ｔ１線断面図とＴ２−Ｔ２線断面図、第６図及び第７
図は本考案によるプリント基板の一実施例を示す部分裏
面図及びＴ３−Ｔ３線断面図、第８図は第６図のプリン
ト基板の組立段階での部分断面図、第９図及び第１０図
と第１１図及び第１２図は本考案の他の各実施例を示す
部分裏面図及びＴ、−Ｔ４線断面図とＴ５−Ｔ、線断面
図である。
２・・・・・・絶縁基板、３・・・・・・導電パターン
、５ｂ・・・・・・半田付はランド、６ｂ・・・・・・
スルーホール、８ｂ・・・・・・リード部材、１２，１
３．４’・・・・・・非半田付着部分（スリット、半田
レジスト膜）。
第５図
第８図Figure 1 is a sectional view of an electrical device incorporating a conventional printed circuit board, and Figures 2, 3, 4, and 5 are enlarged back views of each part of the printed circuit board in Figure 1 at each assembly stage. Figure and T1
-T1 line sectional view and T2-T2 line sectional view, Figures 6 and 7
The figures are a partial back view and a sectional view taken along the line T3-T3 of an embodiment of the printed circuit board according to the present invention, FIG. 8 is a partial sectional view of the printed circuit board of FIG. 6 at the assembly stage, and FIGS. 9 and 10. 11 and 12 are a partial rear view, a sectional view taken along the lines T and -T4, and a sectional view taken along the line T5-T, showing other embodiments of the present invention. 2... Insulating board, 3... Conductive pattern, 5b... Land for soldering, 6b...
Through hole, 8b...Lead member, 12,1
3.4'... Non-solder attachment part (slit, solder resist film). Figure 5 Figure 8
Claims (1)
ホール周辺の半田付はランドに半径方向に非半田付着部
分を選択形成したものにおいて、前記非半田付着部分を
その所属する半田付はランドのスルーホールに傾斜して
挿入される１月−ド部材の傾斜万両に位置規制して形成
したことを特徴とするプリント基板。Soldering around the through-hole of an insulating substrate having a through-hole and a conductive land is performed by selectively forming a non-solder-attached part on the land in the radial direction, and the non-solder-attached part is attached to the through-hole of the land. 1. A printed circuit board characterized in that a board member inserted at an angle is formed so as to be positioned at an angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20232782U JPS59107172U (en) | 1982-12-29 | 1982-12-29 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20232782U JPS59107172U (en) | 1982-12-29 | 1982-12-29 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59107172U true JPS59107172U (en) | 1984-07-19 |
Family
ID=30427799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20232782U Pending JPS59107172U (en) | 1982-12-29 | 1982-12-29 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11802727B2 (en) | 2020-01-18 | 2023-10-31 | True Manufacturing Co., Inc. | Ice maker |
-
1982
- 1982-12-29 JP JP20232782U patent/JPS59107172U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11802727B2 (en) | 2020-01-18 | 2023-10-31 | True Manufacturing Co., Inc. | Ice maker |
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