JPH0247086U - - Google Patents
Info
- Publication number
- JPH0247086U JPH0247086U JP12642888U JP12642888U JPH0247086U JP H0247086 U JPH0247086 U JP H0247086U JP 12642888 U JP12642888 U JP 12642888U JP 12642888 U JP12642888 U JP 12642888U JP H0247086 U JPH0247086 U JP H0247086U
- Authority
- JP
- Japan
- Prior art keywords
- width
- wiring board
- printed wiring
- insulating substrate
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010019 resist printing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案プリント配線板の一実施例を示
す部分断面図、第２図は本考案プリント配線板の
他の実施例を示す部分断面図、第３図は従来の表
面実装部品搭載用プリント配線板の部分断面図で
ある。
１……絶縁基板、２ａ，２ｂ……パツド、３…
…ソルダー・レジスト、４……導体パターン、Ｗ
……パツド幅、Ｌ……ソルダー・レジスト逃げ幅
、Ｗ′……ソルダー・レジスト印刷幅。
Fig. 1 is a partial sectional view showing one embodiment of the printed wiring board of the present invention, Fig. 2 is a partial sectional view showing another embodiment of the printed wiring board of the invention, and Fig. 3 is a conventional one for mounting surface mount components. FIG. 3 is a partial cross-sectional view of the printed wiring board. 1...Insulating substrate, 2a, 2b...Pad, 3...
...Solder resist, 4...Conductor pattern, W
...Pad width, L...Solder/resist relief width, W'...Solder/resist printing width.
Claims (1)
個のパツドと、前記パツドの端部をそれぞれ覆う
パツド導体厚より厚膜のソルダー・レジストとか
ら成り、前記パツド幅がソルダー・レジストの逃
げ幅よりも広幅にそれぞれ設定されていることを
特徴とするプリント配線板。 It consists of an insulating substrate, a plurality of pads formed on the insulating substrate, and a solder resist that is thicker than the pad conductor and covers the ends of the pads, and the width of the pad is the relief width of the solder resist. A printed wiring board characterized by being set wider than the width of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12642888U JPH0247086U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12642888U JPH0247086U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247086U true JPH0247086U (en) | 1990-03-30 |
Family
ID=31377943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12642888U Pending JPH0247086U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247086U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04214694A (en) * | 1990-09-10 | 1992-08-05 | Toshiba Corp | Printed wiring board and manufacture thereof |
-
1988
- 1988-09-27 JP JP12642888U patent/JPH0247086U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04214694A (en) * | 1990-09-10 | 1992-08-05 | Toshiba Corp | Printed wiring board and manufacture thereof |