JPS6413172U - - Google Patents
Info
- Publication number
- JPS6413172U JPS6413172U JP10640987U JP10640987U JPS6413172U JP S6413172 U JPS6413172 U JP S6413172U JP 10640987 U JP10640987 U JP 10640987U JP 10640987 U JP10640987 U JP 10640987U JP S6413172 U JPS6413172 U JP S6413172U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- holes
- sides
- conductive paste
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係る二層印刷回路
基板の断面図、第２図は同回路基板の使用例を示
す断面図、第３図は従来の二層印刷回路基板の断
面図、第４図は同回路基板を屈曲した場合の断面
図である。
１……絶縁フイルム、２……穴、３……穴埋め
部、４，５……回路パターン、６，７……ソルダ
ーレジスト層、８……パツド部。
Fig. 1 is a sectional view of a two-layer printed circuit board according to an embodiment of the present invention, Fig. 2 is a sectional view showing an example of the use of the same circuit board, and Fig. 3 is a sectional view of a conventional two-layer printed circuit board. , FIG. 4 is a cross-sectional view of the same circuit board when it is bent. DESCRIPTION OF SYMBOLS 1... Insulating film, 2... Hole, 3... Hole filling part, 4, 5... Circuit pattern, 6, 7... Solder resist layer, 8... Pad part.
Claims (1)
成した絶縁フイルムを用い、その絶縁フイルムの
の穴の部分に導電ペーストによる穴埋め部を設け
、かつ上記絶縁フイルムの両面に導電ペーストで
回路パターンを印刷してなる二層印刷回路基板に
おいて、上記回路パターンの電子部品搭載部であ
るパツド部を、上記穴埋め部と重ならない位置に
設けたことを特徴とする二層印刷回路基板。 Using an insulating film with holes formed at positions where the circuit patterns on both sides are conductive, filling the holes with conductive paste in the holes of the insulating film, and printing circuit patterns with conductive paste on both sides of the insulating film. 1. A two-layer printed circuit board comprising: a pad portion, which is an electronic component mounting portion of the circuit pattern, provided at a position that does not overlap with the hole filling portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10640987U JPS6413172U (en) | 1987-07-13 | 1987-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10640987U JPS6413172U (en) | 1987-07-13 | 1987-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413172U true JPS6413172U (en) | 1989-01-24 |
Family
ID=31339894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10640987U Pending JPS6413172U (en) | 1987-07-13 | 1987-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413172U (en) |
-
1987
- 1987-07-13 JP JP10640987U patent/JPS6413172U/ja active Pending