JPS6316480U - - Google Patents
Info
- Publication number
- JPS6316480U JPS6316480U JP11047286U JP11047286U JPS6316480U JP S6316480 U JPS6316480 U JP S6316480U JP 11047286 U JP11047286 U JP 11047286U JP 11047286 U JP11047286 U JP 11047286U JP S6316480 U JPS6316480 U JP S6316480U
- Authority
- JP
- Japan
- Prior art keywords
- foil pad
- conductive foil
- solder resist
- conductive
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の半田レジス
ト印刷後の斜視図およびそのリフロー後のＡ―Ａ
′線の破断面を示した斜視図、第２図は従来印刷
配線板の表面実装型部品実装用のパターン平面図
、第３図は第２図を改良した従来の高密度パター
ンの平面図、第４図ａ，ｂは予備半田ペースト印
刷時の第３図Ａ―Ａ′線の破断面を示す斜視図お
よびリフロー後の状態を示す斜視図である。
１，１１…銅箔パツド、２，１２…印刷配線板
、３…表裏導通孔、４…非半田レジスト部、５…
半田レジスト、５ａ…帯状の半田レジスト、６，
６′…回路パターン、７…予備半田レジスト。
Figures 1a and 1b are perspective views of an embodiment of the present invention after printing a solder resist, and A-A after its reflow.
Fig. 2 is a plan view of a pattern for mounting surface-mounted components on a conventional printed wiring board; Fig. 3 is a plan view of a conventional high-density pattern improved from Fig. 2; FIGS. 4a and 4b are a perspective view showing a fractured surface taken along the line AA' in FIG. 3 when preliminary solder paste is printed, and a perspective view showing the state after reflow. DESCRIPTION OF SYMBOLS 1, 11...Copper foil pad, 2,12...Printed wiring board, 3...Top and back conductive holes, 4...Non-solder resist portion, 5...
Solder resist, 5a...band-shaped solder resist, 6,
6'...Circuit pattern, 7...Preliminary solder resist.
Claims (1)
記導体箔パツドの一端と直結するランドつき表裏
導通孔と、前記導体箔パツドと表裏導通孔との接
続部の上面を覆つて形成された半田レジストより
なる分断部とを含むことを特徴とする印刷配線板
。 A conductive foil pad arranged on the front and back surfaces of the insulating layer, a front and back conductive hole with a land that is directly connected to one end of the conductive foil pad, and a top surface of the connecting portion between the conductive foil pad and the front and back conductive hole are formed. What is claimed is: 1. A printed wiring board comprising a dividing section made of solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11047286U JPS6316480U (en) | 1986-07-17 | 1986-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11047286U JPS6316480U (en) | 1986-07-17 | 1986-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316480U true JPS6316480U (en) | 1988-02-03 |
Family
ID=30989503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11047286U Pending JPS6316480U (en) | 1986-07-17 | 1986-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316480U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234463B2 (en) * | 1982-03-31 | 1987-07-27 | Nippon Kokan Kk |
-
1986
- 1986-07-17 JP JP11047286U patent/JPS6316480U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234463B2 (en) * | 1982-03-31 | 1987-07-27 | Nippon Kokan Kk |