JPH0233476U - - Google Patents
Info
- Publication number
- JPH0233476U JPH0233476U JP11136288U JP11136288U JPH0233476U JP H0233476 U JPH0233476 U JP H0233476U JP 11136288 U JP11136288 U JP 11136288U JP 11136288 U JP11136288 U JP 11136288U JP H0233476 U JPH0233476 U JP H0233476U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- conductive hole
- foil pad
- solder resist
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Description
第１図ａ，ｂは本考案の一実施例の表面実装部
品実装用のパターンの斜視図および本考案の一実
施例のリフロー後のＡＢ断面斜視図、第２図は従
来の印刷配線板の表面実装部品実装用のパターン
の斜視図、第３図ａ，ｂは従来の印刷配線板に予
備半田ペーストを施した第２図のＡＢ線断面斜視
図および第３図ａのリフロー後の断面斜視図、第
４図は改良された従来例の表面実装部品実装用の
パターンの斜視図である。
１……銅箔パツド、２……（表裏）導通孔、２
ａ……（表裏）導通孔ランド、３……紫外線硬化
性半田レジスト、３ａ……熱硬化性半田レジスト
、４……半田ペースト、５……帯状の半田レジス
ト。
Figures 1a and b are perspective views of a pattern for mounting surface mount components according to an embodiment of the present invention, and a perspective view of an AB cross section after reflow of an embodiment of the present invention, and Figure 2 is a perspective view of a pattern for mounting surface mount components according to an embodiment of the present invention. A perspective view of a pattern for mounting surface mount components, Figures 3a and 3b are a cross-sectional perspective view taken along line AB in Figure 2 with preliminary solder paste applied to a conventional printed wiring board, and Figure 3a is a cross-sectional perspective view after reflow. FIG. 4 is a perspective view of an improved conventional pattern for mounting surface mount components. 1...Copper foil pad, 2...(front and back) conductive hole, 2
a... (front and back) conductive hole land, 3... ultraviolet curable solder resist, 3a... thermosetting solder resist, 4... solder paste, 5... strip-shaped solder resist.
Claims (1)
の銅箔パツドと、該銅箔パツドと直結して前記絶
縁層の表裏面に設けられた導通孔及び導通孔ラン
ドと、前記銅箔パツドと前記導通孔及び導通孔ラ
ンドとを仕切る紫外線硬化性半田レジストとを含
み、銅箔パツドのみが半田レジストより露出して
いることを特徴とする印刷配線板。 A copper foil pad for mounting a surface mount component formed on the surface of an insulating layer, a conductive hole and a conductive hole land that are directly connected to the copper foil pad and provided on the front and back surfaces of the insulating layer, and the copper foil pad. A printed wiring board comprising an ultraviolet curable solder resist that partitions the conductive hole and the conductive hole land, and wherein only the copper foil pad is exposed from the solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136288U JPH0233476U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136288U JPH0233476U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233476U true JPH0233476U (en) | 1990-03-02 |
Family
ID=31349338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11136288U Pending JPH0233476U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233476U (en) |
-
1988
- 1988-08-24 JP JP11136288U patent/JPH0233476U/ja active Pending