JPS6268266U - - Google Patents
Info
- Publication number
- JPS6268266U JPS6268266U JP15864585U JP15864585U JPS6268266U JP S6268266 U JPS6268266 U JP S6268266U JP 15864585 U JP15864585 U JP 15864585U JP 15864585 U JP15864585 U JP 15864585U JP S6268266 U JPS6268266 U JP S6268266U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- board
- circuit board
- heat
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
その要部の断面図、第３図は従来構造の斜視図で
ある。
１，１１……基板、１２……プリント回路、３
，１３……放熱パターン、４，１４……電子部品
、５……（第２の）放熱パターン、６……スルー
ホール、７……導電体。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of its essential parts, and FIG. 3 is a perspective view of a conventional structure. 1, 11... Board, 12... Printed circuit, 3
, 13... heat radiation pattern, 4, 14... electronic component, 5... (second) heat radiation pattern, 6... through hole, 7... conductor.
Claims (1)
であつて、プリント回路を形成する基板の表面及
び裏面の夫々に放熱パターンを形成し、これら両
放熱パターンを前記基板を貫通するスルーホール
を通して相互に接続したことを特徴とするプリン
ト回路板。 ２ 放熱パターンはプリント回路を構成する導電
膜の一部を用いて構成してなる実用新案登録請求
の範囲第１項記載のプリント回路板。[Claims for Utility Model Registration] 1. A printed circuit board on which a heat-generating electronic component is attached, in which a heat radiation pattern is formed on each of the front and back surfaces of the board on which the printed circuit is formed, and both of these heat radiation patterns are A printed circuit board characterized by being interconnected through through holes that penetrate the board. 2. The printed circuit board according to claim 1, wherein the heat dissipation pattern is formed using a part of a conductive film constituting the printed circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15864585U JPS6268266U (en) | 1985-10-18 | 1985-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15864585U JPS6268266U (en) | 1985-10-18 | 1985-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6268266U true JPS6268266U (en) | 1987-04-28 |
Family
ID=31082330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15864585U Pending JPS6268266U (en) | 1985-10-18 | 1985-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6268266U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009095372A (en) * | 2007-10-12 | 2009-05-07 | Sammy Corp | Board for display and game machine |
-
1985
- 1985-10-18 JP JP15864585U patent/JPS6268266U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009095372A (en) * | 2007-10-12 | 2009-05-07 | Sammy Corp | Board for display and game machine |
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