JPH0410356U

JPH0410356U -

Info

Publication number: JPH0410356U
Application number: JP5084990U
Authority: JP
Priority date: 1990-05-15
Filing date: 1990-05-15
Publication date: 1992-01-29

Description

[Brief explanation of the drawing]

第１図は本考案の一具体例を示す両面プリント
基板と三端子レギユレータの斜視図、第２図はそ
の部分拡大断面図である。また、第３図は従来の
放熱構体の一例を示す部分拡大断面図である。１……両面プリント基板、２Ａ，２Ｂ……導電
ランド、２Ｃ……放熱被膜、３……発熱性電子部
品（三端子レギユレータ）、５……絶縁基板、６
……通し穴、７……発熱性電子部品の実装域。 FIG. 1 is a perspective view of a double-sided printed circuit board and a three-terminal regulator showing a specific example of the present invention, and FIG. 2 is a partially enlarged sectional view thereof. Further, FIG. 3 is a partially enlarged sectional view showing an example of a conventional heat dissipation structure. 1... Double-sided printed circuit board, 2A, 2B... Conductive land, 2C... Heat dissipation coating, 3... Heat generating electronic component (three terminal regulator), 5... Insulating board, 6
...through hole, 7...mounting area for heat generating electronic components.

Claims

[Scope of claim for utility model registration] In a double-sided printed circuit board on which electronic components that generate heat when energized are mounted, conductive lands that also serve as heat dissipation surfaces are formed with a predetermined wiring pattern on both the front and back surfaces of an insulating substrate that forms the base material of this double-sided printed circuit board. and drilling a large number of through holes in the insulating substrate around the mounting area of the heat generating electronic component,
A heat dissipation structure for a printed circuit board, characterized in that the inner circumferential surface of the through hole is formed as a heat dissipation portion that communicates with the conductive lands that also serve as heat dissipation surfaces on the front and back sides.