JPS6242273U - - Google Patents
Info
- Publication number
- JPS6242273U JPS6242273U JP13306485U JP13306485U JPS6242273U JP S6242273 U JPS6242273 U JP S6242273U JP 13306485 U JP13306485 U JP 13306485U JP 13306485 U JP13306485 U JP 13306485U JP S6242273 U JPS6242273 U JP S6242273U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- view
- heat
- surface mount
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１実施例を示す抵抗３０の
取付前の斜視図、第２図は同じく抵抗取付後の断
面図、第３図は上記抵抗３０を含む回路図である
。第４図及び第５図は本考案の第２実施例を示す
前記第１図及び第２図に対応する斜視図及び断面
図である。第６図及び第７図は本考案の第３実施
例を示す前記第１図及び第２図に対応する斜視図
及び断面図である。第８図及び第９図は本考案の
第４実施例を示す前記第１図及び第２図に対応す
る斜視図及び断面図である。第１０図は本考案の
第５実施例を示す抵抗取付後の斜視図である。第
１１図及び第１２図は本考案の第６実施例を示す
抵抗取付後の斜視図及び断面図である。第１３図
及び第１４図は本考案の第７実施例を示す抵抗取
付後の正面図及び斜視図である。第１５図は従来
例の１つを示す斜視図である。
〔主要部分の符号の説明〕、２０……基板、２
２……長孔、２４，２６……配線用パターン、３
０……チツプ抵抗（表面搭載素子）、３２，３４
……電極、６４，６６……別の導体パターン。
FIG. 1 is a perspective view showing a first embodiment of the present invention before a resistor 30 is installed, FIG. 2 is a sectional view after the resistor is installed, and FIG. 3 is a circuit diagram including the resistor 30. FIGS. 4 and 5 are a perspective view and a sectional view corresponding to FIGS. 1 and 2, showing a second embodiment of the present invention. FIGS. 6 and 7 are a perspective view and a sectional view corresponding to FIGS. 1 and 2, showing a third embodiment of the present invention. FIGS. 8 and 9 are a perspective view and a sectional view corresponding to FIGS. 1 and 2, showing a fourth embodiment of the present invention. FIG. 10 is a perspective view of the fifth embodiment of the present invention after the resistor is attached. FIGS. 11 and 12 are a perspective view and a cross-sectional view of a sixth embodiment of the present invention after a resistor is attached. FIGS. 13 and 14 are a front view and a perspective view of a seventh embodiment of the present invention after a resistor is attached. FIG. 15 is a perspective view showing one of the conventional examples. [Explanation of symbols of main parts], 20...Substrate, 2
2... Long hole, 24, 26... Wiring pattern, 3
0... Chip resistance (surface mounted element), 32, 34
... Electrode, 64, 66 ... Another conductor pattern.
Claims (1)
ターンに電子部品である表面搭載素子が搭載され
たプリント基板において、 前記基板上には、前記表面搭載素子に近接して
配設され、該表面搭載素子で発生する熱を伝導に
より放散する前記配線用パターンとは別の導体パ
ターン；又は前記表面搭載素子に近接してあけら
れ、前記表面搭載素子で発生する熱をての中空部
を流れる空気の対流により放散する貫通孔；の何
れか一方が設けられていることを特徴とする表面
搭載素子の放熱構造。[Claims for Utility Model Registration] In a printed circuit board provided with a predetermined wiring pattern and on which a surface-mounted element, which is an electronic component, is mounted, A conductor pattern other than the wiring pattern, which is disposed in the surface mount element and dissipates the heat generated by the surface mount element by conduction; 1. A heat dissipation structure for a surface-mounted element, characterized in that a through-hole is provided in which the heat is dissipated by convection of air flowing through the hollow part of the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13306485U JPS6242273U (en) | 1985-09-02 | 1985-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13306485U JPS6242273U (en) | 1985-09-02 | 1985-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242273U true JPS6242273U (en) | 1987-03-13 |
Family
ID=31033035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13306485U Pending JPS6242273U (en) | 1985-09-02 | 1985-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242273U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281463A (en) * | 1988-09-16 | 1990-03-22 | Hitachi Ltd | Cooled mounting structure of semiconductor device and method of cooling |
| JP2011155134A (en) * | 2010-01-27 | 2011-08-11 | Mitsubishi Electric Corp | Electronic circuit board |
-
1985
- 1985-09-02 JP JP13306485U patent/JPS6242273U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281463A (en) * | 1988-09-16 | 1990-03-22 | Hitachi Ltd | Cooled mounting structure of semiconductor device and method of cooling |
| JP2011155134A (en) * | 2010-01-27 | 2011-08-11 | Mitsubishi Electric Corp | Electronic circuit board |
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