JPH0415892U - - Google Patents
Info
- Publication number
- JPH0415892U JPH0415892U JP5672990U JP5672990U JPH0415892U JP H0415892 U JPH0415892 U JP H0415892U JP 5672990 U JP5672990 U JP 5672990U JP 5672990 U JP5672990 U JP 5672990U JP H0415892 U JPH0415892 U JP H0415892U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation plate
- plate
- electronic circuit
- convex part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例の正面図および側面図、第３図ａ〜ｃはそれぞ
れ第１図に示す放熱板２１および放熱フイン２２
ならびにこれらを組立てたものの斜視図である。
１……印刷配線板、２……放熱体、３……発熱
部品、２１……放熱板、２２……放熱フイン、４
……高熱伝導材。
1 and 2 are respectively a front view and a side view of an embodiment of the present invention, and FIGS. 3 a to 3 c are respectively a heat dissipation plate 21 and a heat dissipation fin 22 shown in FIG. 1.
FIG. 2 is a perspective view of an assembly of these components. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Heat sink, 3... Heat generating component, 21... Heat sink, 22... Heat sink, 4
...High thermal conductivity material.
Claims (1)
在に取り付けられる１または２以上の放熱フイン
とを含むことを特徴とする電子回路パツケージの
放熱構造。 (2) 放熱フインは凸部（または凹溝）を放熱板
の凹溝（または凸部）にはめ込んで前記放熱板に
取り付けられ、前記放熱フインは前記放熱板に高
熱伝導材により接着固定された実用新案登録請求
の範囲第１項記載の電子回路パツケージの放熱構
造。[Claims for Utility Model Registration] (1) A heat dissipation structure for an electronic circuit package, comprising a heat dissipation plate and one or more heat dissipation fins each of which is detachably attached to the heat dissipation plate. (2) The heat dissipation fin is attached to the heat dissipation plate by fitting the convex part (or groove) into the concave groove (or convex part) of the heat dissipation plate, and the heat dissipation fin is adhesively fixed to the heat dissipation plate with a high heat conductive material. A heat dissipation structure for an electronic circuit package according to claim 1 of the registered utility model claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5672990U JPH0415892U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5672990U JPH0415892U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415892U true JPH0415892U (en) | 1992-02-07 |
Family
ID=31580813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5672990U Pending JPH0415892U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415892U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030030090A (en) * | 2001-10-08 | 2003-04-18 | 엘지전자 주식회사 | Heat sink |
-
1990
- 1990-05-30 JP JP5672990U patent/JPH0415892U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030030090A (en) * | 2001-10-08 | 2003-04-18 | 엘지전자 주식회사 | Heat sink |
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