JPH01123398U - - Google Patents
Info
- Publication number
- JPH01123398U JPH01123398U JP1957888U JP1957888U JPH01123398U JP H01123398 U JPH01123398 U JP H01123398U JP 1957888 U JP1957888 U JP 1957888U JP 1957888 U JP1957888 U JP 1957888U JP H01123398 U JPH01123398 U JP H01123398U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- dissipation fin
- generating component
- heat dissipation
- chassis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の発熱部品のヒートシンクの構
造図、第２図は本考案の説明に供する図、第３図
及び第４図は本考案のその他の実施例を示す図、
第５図は従来の技術である電子装置の放熱装置の
構造図、第６図は従来の技術であるトランジスタ
実装プリント配線板の構造図である。
Ｓ，Ｓ１，Ｓａ，Ｓｂ……シヤーシ、１ａ，１
ｂ，１０……プリント基板、２ａ，２ｂ，２０…
…発熱部品、５ａ，５ｂ，５０……放熱フイン（
放熱板）。
FIG. 1 is a structural diagram of a heat sink of a heat generating component of the present invention, FIG. 2 is a diagram for explaining the present invention, FIGS. 3 and 4 are diagrams showing other embodiments of the present invention,
FIG. 5 is a structural diagram of a conventional heat dissipation device for an electronic device, and FIG. 6 is a structural diagram of a conventional transistor-mounted printed wiring board. S, S 1 , Sa, Sb... Shashi, 1a, 1
b, 10...Printed circuit board, 2a, 2b, 20...
... Heat generating parts, 5a, 5b, 50... Heat dissipation fin (
heat sink).
Claims (1)
付けられた発熱部品の発熱を、該発熱部品に熱的
に結合する放熱フインにより放熱する構成の発熱
部品のヒートシンクにおいて、放熱フインの構造
を前記プリント基板の近傍のシヤーシに低触させ
て見掛け上の放熱フイン面積を増加させ且つ前記
発熱部品との間の接触圧力を調整可能な構造とし
、該放熱フインが低触する部分のシヤーシの構造
を放熱フイン側面形状に沿うように形成して前記
発熱部品との間の接触圧力調整のために放熱フイ
ンがシヤーシに低触部分しながら移動可能とした
こと、を特徴とする発熱部品のヒートシンク。 In a heat sink for a heat generating component configured to radiate heat generated by a heat generating component assembled on a printed circuit board provided inside a chassis by a heat dissipating fin that is thermally coupled to the heat generating component, the structure of the heat dissipating fin is set on the printed circuit board. The heat dissipation fin has a structure in which the heat dissipation fin makes low contact with the chassis in the vicinity of the heat dissipation fin to increase the apparent area of the heat dissipation fin and allows adjustment of the contact pressure between the heat dissipation fin and the heat generating component, and the structure of the chassis in the portion where the heat dissipation fin makes low contact with the heat dissipation fin increases the apparent area of the heat dissipation fin. A heat sink for a heat generating component, characterized in that the heat sink is formed to follow the side shape of the heat generating component and is movable while having a low contact portion with the chassis in order to adjust the contact pressure between the heat sink and the heat generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1957888U JPH01123398U (en) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1957888U JPH01123398U (en) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123398U true JPH01123398U (en) | 1989-08-22 |
Family
ID=31235214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1957888U Pending JPH01123398U (en) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123398U (en) |
-
1988
- 1988-02-17 JP JP1957888U patent/JPH01123398U/ja active Pending