JPH01174990U - - Google Patents
Info
- Publication number
- JPH01174990U JPH01174990U JP7219288U JP7219288U JPH01174990U JP H01174990 U JPH01174990 U JP H01174990U JP 7219288 U JP7219288 U JP 7219288U JP 7219288 U JP7219288 U JP 7219288U JP H01174990 U JPH01174990 U JP H01174990U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat dissipation
- heat
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims 4
Description
第１図〜第４図は何れも本考案の実施例を示し
、第１図は音響機器の要部組立分解図、第２図は
要部断面図、第３図はブラケツトの要部拡大図、
第４図は他の実施例を示す要部断面図であり、第
５図〜第６図は何れも従来例を示す要部断面図で
ある。
４……アンプ用プリント基板、６……パワーＩ
Ｃ、７……ブラケツト、８……ヒートシンク。
Figures 1 to 4 all show embodiments of the present invention; Figure 1 is an exploded view of the main parts of the audio equipment, Figure 2 is a sectional view of the main parts, and Figure 3 is an enlarged view of the main parts of the bracket. ,
FIG. 4 is a sectional view of a main part showing another embodiment, and FIGS. 5 and 6 are sectional views of main parts showing a conventional example. 4...Printed circuit board for amplifier, 6...Power I
C, 7...Bracket, 8...Heat sink.
Claims (1)
て、 プリント基板と、このプリント基板上に取付け
られた電子部品とこの電子部品から発する熱を電
子部品本体外に放出する放熱体とを備え、 この放熱体の一方の面には、放熱フインを形成
し、他の一方の面には前記電子部品を保持するた
め、前記放熱体上より突出する突出部を放熱体と
一体に形成したことを特徴とする音響機器の放熱
体構造。[Scope of claim for utility model registration] In audio equipment such as tape recorders and tuners, there is a printed circuit board, an electronic component mounted on the printed circuit board, and a heat radiator that radiates heat generated from the electronic component outside the electronic component body. A heat dissipation fin is formed on one surface of the heat dissipation body, and a protrusion that protrudes from above the heat dissipation body is formed integrally with the heat dissipation body on the other surface to hold the electronic component. A heat sink structure for audio equipment characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988072192U JPH0625991Y2 (en) | 1988-05-31 | 1988-05-31 | Audio equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988072192U JPH0625991Y2 (en) | 1988-05-31 | 1988-05-31 | Audio equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01174990U true JPH01174990U (en) | 1989-12-13 |
| JPH0625991Y2 JPH0625991Y2 (en) | 1994-07-06 |
Family
ID=31297366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988072192U Expired - Lifetime JPH0625991Y2 (en) | 1988-05-31 | 1988-05-31 | Audio equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625991Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0369293U (en) * | 1989-11-07 | 1991-07-09 | ||
| WO2017098621A1 (en) * | 2015-12-10 | 2017-06-15 | 新電元工業株式会社 | Electronic component unit and heat conductive placement member |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5496855U (en) * | 1977-12-20 | 1979-07-09 | ||
| JPS552149U (en) * | 1978-06-20 | 1980-01-09 | ||
| JPS56154055U (en) * | 1980-04-11 | 1981-11-18 | ||
| JPS5793196U (en) * | 1980-11-28 | 1982-06-08 | ||
| JPS59117194U (en) * | 1983-01-28 | 1984-08-07 | 株式会社日立製作所 | Mounting device for heat generating parts |
| JPS6156497A (en) * | 1984-07-19 | 1986-03-22 | 富士通株式会社 | Mounting structure of transistor on printed board |
| JPS6346899U (en) * | 1986-09-10 | 1988-03-30 | ||
| JPS6359339U (en) * | 1986-10-06 | 1988-04-20 |
-
1988
- 1988-05-31 JP JP1988072192U patent/JPH0625991Y2/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5496855U (en) * | 1977-12-20 | 1979-07-09 | ||
| JPS552149U (en) * | 1978-06-20 | 1980-01-09 | ||
| JPS56154055U (en) * | 1980-04-11 | 1981-11-18 | ||
| JPS5793196U (en) * | 1980-11-28 | 1982-06-08 | ||
| JPS59117194U (en) * | 1983-01-28 | 1984-08-07 | 株式会社日立製作所 | Mounting device for heat generating parts |
| JPS6156497A (en) * | 1984-07-19 | 1986-03-22 | 富士通株式会社 | Mounting structure of transistor on printed board |
| JPS6346899U (en) * | 1986-09-10 | 1988-03-30 | ||
| JPS6359339U (en) * | 1986-10-06 | 1988-04-20 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0369293U (en) * | 1989-11-07 | 1991-07-09 | ||
| WO2017098621A1 (en) * | 2015-12-10 | 2017-06-15 | 新電元工業株式会社 | Electronic component unit and heat conductive placement member |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625991Y2 (en) | 1994-07-06 |
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