JPS6112275U - High frequency power amplifier - Google Patents
High frequency power amplifierInfo
- Publication number
- JPS6112275U JPS6112275U JP9534584U JP9534584U JPS6112275U JP S6112275 U JPS6112275 U JP S6112275U JP 9534584 U JP9534584 U JP 9534584U JP 9534584 U JP9534584 U JP 9534584U JP S6112275 U JPS6112275 U JP S6112275U
- Authority
- JP
- Japan
- Prior art keywords
- frequency power
- power amplification
- wiring board
- printed wiring
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Amplifiers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例の斜視図、第２図は第１図のＩ
−Ｉ断面図、第３図は第１図の一部切欠図、第４図はＰ
ＡＩＣの斜視図、第５図は従来の高周波電力増幅装置の
一部切欠斜視図である。
２１・・・筐体、２２・・・底面、２３・・・放熱フィ
ン、２４・・・凹部、２５・・−ＰＡＩＣ， ２ ６・
・・プリント配線基板、２７・・・電子部品、２８・・
・ねじ、２９・・・放熱フランジ。Fig. 1 is a perspective view of an embodiment of the present invention, and Fig. 2 is an I of Fig. 1.
-I sectional view, Figure 3 is a partially cutaway view of Figure 1, Figure 4 is P
A perspective view of the AIC, and FIG. 5 is a partially cutaway perspective view of a conventional high frequency power amplification device. 21... Housing, 22... Bottom surface, 23... Radiation fin, 24... Recessed portion, 25... -PAIC, 2 6.
...Printed wiring board, 27...Electronic components, 28...
・Screw, 29... Heat radiation flange.
Claims (3)
装され、他方の面に前記高周波電力増幅用ＩＣモジュー
ルを除く電子部品が実襞されたプリント配線基板と、前
記高周波電力増幅用ＩＣモジュールを収納する収納部を
有するとともに、前記プリント配線基板を固定する固定
部を有する筐体とを具備する高周波電力増幅装置。(1) A printed wiring board with a high-frequency power amplification IC module mounted on one surface and electronic components other than the high-frequency power amplification IC module on the other surface; A high-frequency power amplifying device, comprising: a housing having a housing for storing the printed wiring board; and a housing having a fixing part for fixing the printed wiring board.
閉する凹部であることを特徴とする実用新案登録請求の
範囲第（１）項記載の高周波電力増幅装置。(2) The high-frequency power amplification device according to claim (1), wherein the storage portion is a recessed portion that seals the high-frequency power amplification IC module.
ト配線基板の実装面に対して放熱フランジ面が本直にな
るように取付けられていることを特徴とする実用新案登
録請求の範囲第（１）項または第−（２）項記栽の高周
波電力増幅装置。(3) Utility model registration claim (1), characterized in that the IC module for high frequency power amplification is mounted such that the heat dissipation flange surface is perpendicular to the mounting surface of the printed wiring board. Or a high frequency power amplification device as described in paragraph (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534584U JPS6112275U (en) | 1984-06-27 | 1984-06-27 | High frequency power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534584U JPS6112275U (en) | 1984-06-27 | 1984-06-27 | High frequency power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6112275U true JPS6112275U (en) | 1986-01-24 |
Family
ID=30654428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9534584U Pending JPS6112275U (en) | 1984-06-27 | 1984-06-27 | High frequency power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112275U (en) |
-
1984
- 1984-06-27 JP JP9534584U patent/JPS6112275U/en active Pending
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