JPS6156497A - Mounting structure of transistor on printed board - Google Patents
Mounting structure of transistor on printed boardInfo
- Publication number
- JPS6156497A JPS6156497A JP15074584A JP15074584A JPS6156497A JP S6156497 A JPS6156497 A JP S6156497A JP 15074584 A JP15074584 A JP 15074584A JP 15074584 A JP15074584 A JP 15074584A JP S6156497 A JPS6156497 A JP S6156497A
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- printed circuit
- circuit board
- mounting
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子１通信装置等の電子回路を構成するプリ
ント基板へトランジスタを取付ける構造に係り、とくに
放熱を要するトランジスタをプリント基板へ取付ける構
造に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a structure for attaching a transistor to a printed circuit board constituting an electronic circuit such as an electronic communication device, and particularly to a structure for attaching a transistor that requires heat dissipation to a printed circuit board. It is related to.
電子１通信装置等に用いられる電子回路はユニット化さ
れてプリント基板に実装されている。そして近年、装置
の小形化の要望が強いため、個々のプリント基板への高
密度実装が余儀な（されている、そこで比較的大きなス
ペースを占有するパワートランジスタの取付構造を改善
することが必要である。Electronic circuits used in electronic communication devices and the like are unitized and mounted on printed circuit boards. In recent years, there has been a strong demand for smaller devices, which has forced high-density mounting onto individual printed circuit boards.Therefore, it is necessary to improve the mounting structure of power transistors, which occupy a relatively large amount of space. be.
従来のプリント基板へのトランジスタの取付構造は、プ
リント基板とシールド板間にスペーサを兼備した放熱板
を取着し、この放熱板のプリント基板側にトランジスタ
を水平となるように取付けられていた。The conventional structure for mounting a transistor on a printed circuit board is to attach a heat dissipation plate that also serves as a spacer between the printed circuit board and a shield plate, and to install the transistor horizontally on the printed circuit board side of the heat dissipation plate.
第２図は、従来のプリント基板へのトランジスタの取付
構造を説明するための（ａ）は要部平面図。FIG. 2(a) is a plan view of a main part for explaining a conventional mounting structure of a transistor on a printed circuit board.
山）は要部正面図である。(mountain) is a front view of the main part.
ガラスエポキシ樹脂等からなるプリント基板１と、放熱
の良好な金属たとえばアルミニウム等からなるシールド
板２間に、シールド板２と同様放熱の良好な金属たとえ
ばアルミニウム等からなり、スペーサを兼備した放熱板
３をそれぞれ取付ねじ５．７で螺着し、該放熱板３のプ
リント基板１側にトランジスタ４を、取付ねじ５とナツ
ト６で固定しトランジスタ４から発注する熱は、放熱板
３とシールド板２から放熱される構造である。Between a printed circuit board 1 made of glass epoxy resin or the like and a shield plate 2 made of a metal with good heat dissipation, such as aluminum, there is a heat sink 3 made of a metal with good heat dissipation, such as aluminum, like the shield plate 2, and which also serves as a spacer. are screwed on with mounting screws 5 and 7 respectively, and the transistor 4 is fixed to the printed circuit board 1 side of the heat sink 3 with the mounting screws 5 and nuts 6. The structure is such that heat is radiated from the
上記のプリント基板へのトランジスタの取付構造にあっ
ては、トランジスタ４をプリント基板１に対して水平に
取着しているので、高出力用であるトランジスタ４が、
他の実装部品にくらべて大きい面積を占有するので、限
定されたプリント基板１の高密度実装を妨げるという問
題点がある。In the structure for mounting the transistor on the printed circuit board described above, since the transistor 4 is mounted horizontally to the printed circuit board 1, the transistor 4, which is for high output,
Since it occupies a larger area than other mounting components, there is a problem in that it prevents high-density mounting on the limited printed circuit board 1.
本発明は、上記の問題点を解決して高密度実装を可能に
したプリント基板へのトランジスタの取付構造を提供す
るもので、その手段は、トランジスタをプリント基板と
シールド板間に設けられた放熱板の垂直面に取着し、前
記トランジスタのリード端子側に、前記プリント基板に
接続する端子を具備してなるサブプリント基板を設けた
ことによってなされる。The present invention provides a mounting structure for transistors on a printed circuit board that solves the above problems and enables high-density mounting. This is accomplished by providing a sub-printed board attached to the vertical surface of the board and provided with terminals connected to the printed board on the lead terminal side of the transistor.
１ 〔作用〕
上記のプリント基板へのトランジスタの取付構造は、放
熱板のプリント基板に対する垂直面にトランジスタを取
着した構造であるから、トランジスタのプリント坂を占
める面積が数分の−に減少して、実装密度を向上せしめ
、効率的なものである。1 [Function] Since the above structure for mounting the transistor on the printed circuit board is such that the transistor is mounted on the surface of the heat sink perpendicular to the printed circuit board, the area occupied by the printed slope of the transistor is reduced to a fraction of a second. This improves packaging density and is efficient.
以下図面を参照しながら本発明に係るプリント基板への
トランジスタの取付構造の実施例について詳細に説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of a structure for mounting a transistor on a printed circuit board according to the present invention will be described in detail below with reference to the drawings.
第１図は、本発明に係るプリント基板へのトランジスタ
の取付構造の一実施例を説明するための（ａ）は要部平
面図、（ｂ）は要部正面図で、第２図と同等の部分につ
いては同一符号を付している。1A and 1B are a plan view of the main part and a front view of the main part, respectively, for explaining an embodiment of the mounting structure of a transistor on a printed circuit board according to the present invention, which is equivalent to FIG. The same reference numerals are given to the parts.
ガラスエポキシ樹脂等からなるプリント基板１と、放熱
の良好な金属たとえばアルミニウム等からなるシールド
板２間に、シールド板２と同様放熱の良好な金属たとえ
ばアルミニウム等からなり、スペーサを兼備した放熱板
８を取付ねじ７で螺着し、該放熱板８のプリント基板ｌ
とシールド板２ １間の垂直面にトランジスタ４を
、取付ねじ５とナツト６で固定し、トランジスタ４から
発生する熱は、放熱板８とシールド板２から放熱される
構造である。そして放熱板８に螺着したトランジスタ４
のリード端子側に、プリント基板１のパターンと接続す
る複数の端子１０を具備してなるサブプリント板９を付
設した構造である。Between the printed circuit board 1 made of glass epoxy resin or the like and the shield plate 2 made of a metal with good heat dissipation, such as aluminum, there is a heat dissipation plate 8 made of a metal with good heat dissipation, such as aluminum, like the shield plate 2, and which also serves as a spacer. Screw on the mounting screws 7, and attach the printed circuit board l of the heat sink 8.
The transistor 4 is fixed to the vertical plane between the transistor 4 and the shield plate 21 with mounting screws 5 and nuts 6, and the heat generated from the transistor 4 is radiated from the heat sink plate 8 and the shield plate 2. And the transistor 4 screwed onto the heat sink 8
It has a structure in which a sub-printed board 9 comprising a plurality of terminals 10 connected to the pattern of the printed board 1 is attached to the lead terminal side of the board.
なお、本実施例ではトランジスタ４を３個付設した説明
をしたが、３個に限らず使用するトランジスタ数に応じ
た放熱板８を形成すればよい。Although the present embodiment has been described in which three transistors 4 are provided, the number of heat sinks 8 is not limited to three and may be formed in accordance with the number of transistors used.
以上の説明から明らかなように、本発明に係るプリント
基板へのトランジスタの取付構造によれば、スペースフ
ァクタが良好となり、高密度実装に寄与するところが大
であり、装置の小形化が期待できる。As is clear from the above description, the structure for mounting a transistor on a printed circuit board according to the present invention has a good space factor, greatly contributes to high-density mounting, and can be expected to reduce the size of the device.
第１図は、本発明に係るプリント基板へのトランジスタ
の取付構造の一実施例を説明するための（ａｌは要部平
面図、（ｂ）は要部正面図、第２図は、従来のプリント
基板へのトランジスタの取付構造を説明するための（ａ
）は要部平面図。
中）は要部正面図である。
図中、１はプリント基板、２はシールド板、３゜８は放
熱板、４はトランジスタ、５，７は取付ねじ、６はナツ
ト、９はサブプリント基、板、１０は端子、をそれぞれ
示す。
＠１ｉｌｌｌ
（Ｑ）
第２図
（Ｑ）FIG. 1 is a diagram illustrating an embodiment of a structure for mounting a transistor on a printed circuit board according to the present invention (Al is a plan view of the main part, (b) is a front view of the main part, and FIG. 2 is a conventional one). (a) to explain the mounting structure of the transistor on the printed circuit board
) is a plan view of the main part. (Middle) is a front view of the main part. In the figure, 1 is a printed circuit board, 2 is a shield plate, 3°8 is a heat sink, 4 is a transistor, 5 and 7 are mounting screws, 6 is a nut, 9 is a sub-printed circuit board, and 10 is a terminal. . @1ill (Q) Figure 2 (Q)
Claims (1)
た放熱板の垂直面に取着し、前記トランジスタのリード
端子側に、前記プリント基板に接続する端子を具備して
なるサブプリント基板を設けたことを特徴とするプリン
ト基板へのトランジスタの取付構造。A transistor is attached to a vertical surface of a heat sink provided between a printed circuit board and a shield plate, and a sub-printed circuit board is provided on the lead terminal side of the transistor with a terminal connected to the printed circuit board. Features a structure for mounting transistors on printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15074584A JPS6156497A (en) | 1984-07-19 | 1984-07-19 | Mounting structure of transistor on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15074584A JPS6156497A (en) | 1984-07-19 | 1984-07-19 | Mounting structure of transistor on printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6156497A true JPS6156497A (en) | 1986-03-22 |
Family
ID=15503487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15074584A Pending JPS6156497A (en) | 1984-07-19 | 1984-07-19 | Mounting structure of transistor on printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6156497A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01174990U (en) * | 1988-05-31 | 1989-12-13 |
-
1984
- 1984-07-19 JP JP15074584A patent/JPS6156497A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01174990U (en) * | 1988-05-31 | 1989-12-13 |
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