JPS58201349A - Heat dissipation of integrated circuit - Google Patents

Heat dissipation of integrated circuit

Info

Publication number
JPS58201349A
JPS58201349A JP8461482A JP8461482A JPS58201349A JP S58201349 A JPS58201349 A JP S58201349A JP 8461482 A JP8461482 A JP 8461482A JP 8461482 A JP8461482 A JP 8461482A JP S58201349 A JPS58201349 A JP S58201349A
Authority
JP
Japan
Prior art keywords
heat
card frame
heat dissipating
integrated circuit
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8461482A
Other languages
Japanese (ja)
Inventor
Takeo Matsuura
松浦　武雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8461482A priority Critical patent/JPS58201349A/en
Publication of JPS58201349A publication Critical patent/JPS58201349A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Abstract

PURPOSE:To realize small size and light weight of electronic apparatus as a whole by making thick step by step the heat dissipating plates (heat sink) as the plate becomes far from the card frame. CONSTITUTION:A printed wiring board 1 is used as a heat sink and comprises a heat dissipating plates 2 which become thinner step by step as the plate becomes far from the contact part with the card frame 5 mounted. Therefore, the quantity of heat radiating plate 2 when the heat 7 generated from integrated circuit is transferred to the card frame 5 through the heat dissipating plate 2 becomes high as is coming close to the card frame 5. Therefore, the heat dissipating cross section becomes large proportionally, not lowering a heat dissipating efficiency. Moreover, the heat dissipating plate 2 is thinner at the center area and weight is also reduced in proportion to it. Accordingly, weight of an apparatus as a whole can be reduced.

Description

【発明の詳細な説明】 この発明は、プリント配線板に実装された集積回路から
生じる熱を放熱させるための放熱方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a heat dissipation method for dissipating heat generated from an integrated circuit mounted on a printed wiring board.

まず従来のこの樵の方”法について第１図〜第３図金柑
いて藺単に説明する。First, I will briefly explain the traditional woodcutter method using figures 1 to 3.

第１図において、山はプリント配線板、（２）は上記１
リント配Ｎｓ板山の一方の面に取）付けられた厚さが一
定の放熱板であってこの放熱板１２７は端子が上記配線
板山のパターンと接続される集積回路＋３）の下側に位
置する部分（イ）と周縁部（切を除いて長方形状［１Ｊ
ＪＪ）欠いてあり、上記端子は切９欠いた部分（４）を
通ってパターンに接続される。またこの放熱板（２）は
その周縁部（嗜のみがプリント配線板山に固着されてい
る。In Figure 1, the mountain is a printed wiring board, and (2) is the above 1.
A heat sink 127 with a constant thickness is attached to one side of the wiring board mount, and this heat sink 127 is attached to the bottom side of the integrated circuit +3) whose terminals are connected to the pattern of the wiring board mount. The positioning part (a) and the peripheral part (rectangular shape excluding the cut [1J
JJ) is cut out, and the terminal is connected to the pattern through the notched part (4). Further, this heat sink (2) is fixed to the printed wiring board mount only at its periphery.

（５）は上記放熱板（２）とその一方の面に有する配−
板が実装される箱状のカードフレームである。(5) refers to the heat dissipation plate (2) and the arrangement provided on one side thereof.
It is a box-shaped card frame on which a board is mounted.

第２図は牙１図に示すもの＼Ａ−ａｌｌ′ｒｒｋＪであ
シ。Figure 2 is the one shown in Figure 1\A-all'rrkJ.

また第３図は放熱板（２）の一部が振動によプ配＃板は
）から離れている状態を示す図である。Further, FIG. 3 is a diagram showing a state in which a part of the heat sink (2) is separated from the distribution board (2) due to vibration.

ところでこのような構成によると、集積回路（３）から
生じた熱を放熱板（２）の中を伝４させてカードフレー
ム（５）へ十分に移動させる際に集積回路（３）から生
じる熟ｔが大きい場合や、集積回路（３）からカードフ
レーム（５）に至る放熱板（２）の距離が長い場合には
放熱板（２）の厚みを増〃０させる必要がある。そのた
めきびしい１皺制限が要求される航空磯梧載用電チａｉ
ｉ器に使用するような場合には問題がある。By the way, according to such a configuration, when the heat generated from the integrated circuit (3) is transmitted through the heat sink (2) and sufficiently transferred to the card frame (5), the heat generated from the integrated circuit (3) is absorbed. When t is large or when the distance of the heat sink (2) from the integrated circuit (3) to the card frame (5) is long, it is necessary to increase the thickness of the heat sink (2). For this reason, strict one-wrinkle restrictions are required for the airborne electric chi
There is a problem when using it in an i-device.

また一方振動等の荷重が加わる環境で使用される１合は
１駿の大きい放熱＆（２）が第３図のように配−板（１
）の厚さ方向に離れて集積回路（３）の端子等が損傷す
る恐れ□がある。On the other hand, when used in an environment where loads such as vibrations are applied, there is a large heat dissipation & (2) on the distribution board (1) as shown in Figure 3.
) There is a risk that the terminals, etc. of the integrated circuit (3) may be damaged if separated in the thickness direction.

この発明はこのような従来の方法における間鴎点の改１
Ｆを図るためになされたもので以下図に示す実施例によ
ってこの発明ｔ−詳述する。This invention is a modification of the conventional method.
The present invention will be described in detail with reference to embodiments shown in the figures below.

第４図〜才６図において、山〜（５）は従来のものと同
様であるが放熱板（２）の形状が異なっている。すなわ
ち放熱体として開用され且つ上記放熱板（２）を有する
プリント配線板が実装されるカードフレームとの接触部
から遠ざかるに従って放熱板（２）の厚さを階段状に薄
くしである。従って集積回路から生じた熱ｉ７１を放熱
板（２）の中を伝達させてカードフレーム＋５）へ移動
させている時の放熱板（２）内の熱酸は第６図に示すよ
うにカードフレーム（５）に近づくにつｎて大きくなる
ので放熱ｌｔｈ面積もそれに比例して大きく必要とする
ことに合致しているので放熱効果が低Ｆすることはない
。In Figures 4 to 6, the peaks (5) are similar to those of the conventional type, but the shape of the heat sink (2) is different. That is, the heat sink (2) is used as a heat sink, and the thickness of the heat sink (2) is made thinner in a stepwise manner as it moves away from the contact portion with the card frame on which the printed wiring board having the heat sink (2) is mounted. Therefore, when the heat i71 generated from the integrated circuit is transferred through the heat sink (2) and transferred to the card frame +5), the thermal acid inside the heat sink (2) is transferred to the card frame as shown in Figure 6. As n increases as it approaches (5), the heat dissipation area lth also needs to be proportionally larger, so that the heat dissipation effect does not become low F.

しかも放Ｍ　＆　ｔ２＋の厚みは一様でなく中央部分が
薄いため重量もこれに比例して減少するので振動が加わ
った場合の、放熱板（２）がプリント配線板山から離れ
る力も減少し集積回路（３）の端子等が（Ｊｌｌｓする
のを防止出来るばかシでなく、＠器全体としての重量を
＠坂出来る利点がある。Moreover, since the thickness of the heat sink M & t2+ is not uniform and the center part is thin, the weight decreases in proportion to this, so when vibration is applied, the force that causes the heat sink (2) to separate from the printed wiring board mountain is also reduced, making it easier to integrate. It has the advantage of not only being able to prevent the terminals of the circuit (3) from being damaged, but also reducing the weight of the entire device.

以上述べた如く高密度実装を必要とするこの偵の電子機
器で１通常多く使用されしかもＩ駿的に比較的大きな割
合を占める放熱板（２）の重ｔを軽減することにより、
これらを収納するカードフレーム（５）等のＳ度も減少
させることが出来るので′屯十機器全体の小形、＠置化
が図れる。As mentioned above, by reducing the weight of the heat sink (2), which is usually used in large numbers in electronic devices that require high-density packaging, and which occupies a relatively large proportion of the space,
Since the S degree of the card frame (5) etc. that houses these items can also be reduced, the entire device can be made smaller and more compact.

なお、実施例で述べた放熱板（２）の形状は一丙１゛あ
プ、従ってこれらを変化させた時も同様であることは云
うまでもない。It should be noted that the shapes of the heat sinks (2) described in the embodiments are all the same, so it goes without saying that the same will be true even when these are changed.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図〜第３図は従来の放熱板を便用した果績回路放熱
方法の一例を示す図、第４図〜才６図はこの発明による
集積回路欣然方法を説明するための図であり。 は）はプリント配置ｉｌ板、（２）は／ｄ、４６．１３
１ｆｌ楽ｍ回路、（４）は放熱板を形成するための切り
欠き部、＋５）はカードフレーム、（６）は放熱板の厚
みの変化都。 （７）は熱流である。 なお１図中同一あるいは相当部分には同一符号を付しで
ある。 代理人　　篇　野　信　− １１１図 ｒ 蕗４図１FIGS. 1 to 3 are diagrams showing an example of a conventional circuit heat dissipation method using a heat sink, and FIGS. 4 to 6 are diagrams for explaining an integrated circuit cooling method according to the present invention. . ) is printed arrangement il board, (2) is /d, 46.13
1fl Rakum circuit, (4) is a notch for forming a heat sink, +5) is a card frame, and (6) is a change in the thickness of the heat sink. (7) is the heat flow. It should be noted that the same or corresponding parts in FIG. 1 are denoted by the same reference numerals. Agent Nobu Nobu - Figure 111r Fuki 4 Figure 1

Claims (1)

【特許請求の範囲】[Claims] プリント配線板に取り付けられる果＆回路の端子が通る
切り欠きを有する放熱板をその一方の面に有するプリン
ト配線板をカードフレームに実装し、上記集積回路から
生じる熱を放熱板を介してカードフレームに放熱するよ
うにした集積回路の放熱方法において、上記放熱板の厚
みをカードフレームと接する部分から遠ざかるほどｐｆ
ｆ段状に薄くしであることを特徴とする集積回路の放熱
方法。A printed wiring board having a heat dissipation plate on one side of which has a notch through which the circuit terminals pass through is mounted on the card frame, and the heat generated from the integrated circuit is transferred to the card frame through the heat dissipation plate. In the integrated circuit heat dissipation method, the thickness of the heat dissipation plate increases as the distance from the part in contact with the card frame increases.
A method for dissipating heat from an integrated circuit, characterized in that it is thinned in f-stages.
JP8461482A 1982-05-19 1982-05-19 Heat dissipation of integrated circuit Pending JPS58201349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8461482A JPS58201349A (en) 1982-05-19 1982-05-19 Heat dissipation of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8461482A JPS58201349A (en) 1982-05-19 1982-05-19 Heat dissipation of integrated circuit

Publications (1)

Publication Number Publication Date
JPS58201349A true JPS58201349A (en) 1983-11-24

Family

ID=13835567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8461482A Pending JPS58201349A (en) 1982-05-19 1982-05-19 Heat dissipation of integrated circuit

Country Status (1)

Country Link
JP (1) JPS58201349A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US7804688B2 (en) 1992-05-20 2010-09-28 Seiko Epson Corporation Apparatus including processor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device
US7345883B2 (en) 1992-05-20 2008-03-18 Seiko Epson Corporation Processing device
US7359202B2 (en) 1992-05-20 2008-04-15 Seiko Epson Corporation Printer apparatus
US7583505B2 (en) 1992-05-20 2009-09-01 Seiko Epson Corporation Processor apparatus
US7804688B2 (en) 1992-05-20 2010-09-28 Seiko Epson Corporation Apparatus including processor

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