JP2522916Y2 - Heat sink structure - Google Patents
Heat sink structureInfo
- Publication number
- JP2522916Y2 JP2522916Y2 JP1989048430U JP4843089U JP2522916Y2 JP 2522916 Y2 JP2522916 Y2 JP 2522916Y2 JP 1989048430 U JP1989048430 U JP 1989048430U JP 4843089 U JP4843089 U JP 4843089U JP 2522916 Y2 JP2522916 Y2 JP 2522916Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- heat
- fins
- sink structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は集積回路の冷却構造、主に空冷冷却装置にお
ける集積回路より発生する熱を機器外部へ効率良く排出
する冷却構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a cooling structure for an integrated circuit, and more particularly to a cooling structure for efficiently discharging heat generated from the integrated circuit in an air-cooled cooling device to the outside of a device.
〔従来の技術〕 従来、この種の冷却構造は集積回路の熱放出面に同一
のヒートシンクを取り付けていた。2. Description of the Related Art Conventionally, in this type of cooling structure, the same heat sink is attached to a heat emitting surface of an integrated circuit.
上述した従来のヒートシンク構造では、プリント配線
板上に実装した複数個の集積回路の発熱量が違う場合
に、最も大きい発熱量に合致したヒートシンクを取り付
ける必要があり、実装スペースを損なう欠点を有してい
た。一方、集積回路の発熱量に見合ったヒートシンクを
取り付けた場合は、その種類が多くなるという欠点を有
していた。In the above-described conventional heat sink structure, when a plurality of integrated circuits mounted on a printed wiring board generate different amounts of heat, it is necessary to mount a heat sink that matches the largest amount of heat generated. I was On the other hand, when a heat sink suitable for the heat generation of the integrated circuit is attached, there is a disadvantage that the number of types increases.
本考案の目的は前記課題を解決したヒートシンク構造
を提供することにある。An object of the present invention is to provide a heat sink structure that solves the above-mentioned problem.
本考案のヒートシンク構造は、集積回路を実装した集
積回路ケースの熱放出面に取り付けられ、複数のフィン
を備えた第１のヒートシンクと、この第１のヒートシン
クの前記複数のフィンをかぶせる形状に成形され、前記
第１のヒートシンクの前記複数のフィンを挟み込むとと
もに前記複数のフィンが延出された方向の任意の位置に
固定される第２のヒートシンクとを含む。The heat sink structure of the present invention is mounted on a heat emitting surface of an integrated circuit case on which an integrated circuit is mounted, and is formed into a first heat sink having a plurality of fins and a shape covering the plurality of fins of the first heat sink. And a second heat sink that sandwiches the plurality of fins of the first heat sink and is fixed at an arbitrary position in a direction in which the plurality of fins extend.
次に本考案の一実施例について図面を参照して説明す
る。Next, an embodiment of the present invention will be described with reference to the drawings.
第１図はプリント配線板１に複数個の集積回路ケース
２を実装しその熱放出面に本考案のヒートシンクを取り
付けた図を示し、第２図はその拡大詳細図である。FIG. 1 is a view in which a plurality of integrated circuit cases 2 are mounted on a printed wiring board 1 and a heat sink of the present invention is attached to a heat emitting surface thereof, and FIG. 2 is an enlarged detailed view thereof.
図において、プリント配線板１には、集積回路を収容
した集積回路ケース２が取り付けられている。集積回路
ケース２の熱放出面にはフイン3a,3a…を有する第１の
ヒートシンク３が取り付けられている。さらに、第１の
ヒートシンク３のフイン3aに第２のヒートシンク４が摺
動可能に嵌合して取付けられている。第２のヒートシン
ク４はバネ性を有する構造となっているため、第１のヒ
ートシンク３のフイン3aにはさみ込まれ任意の位置に固
定できるようになっている。ここで、プリント配線板１
に取付けられた集積回路の発熱量が低い場合は第２のヒ
ートシンク４を矢印６の方向に移動させてその高さを低
くして冷却を行い、発熱量が高い場合は矢印７の方向に
移動させ第２のヒートシンク４の高さを高くすることに
より、冷却を行うことができる。In the figure, an integrated circuit case 2 containing an integrated circuit is attached to a printed wiring board 1. A first heat sink 3 having fins 3a, 3a,... Is attached to a heat release surface of the integrated circuit case 2. Further, a second heat sink 4 is slidably fitted and attached to the fin 3a of the first heat sink 3. Since the second heat sink 4 has a structure having a spring property, it is sandwiched between the fins 3a of the first heat sink 3 and can be fixed at an arbitrary position. Here, the printed wiring board 1
If the amount of heat generated by the integrated circuit mounted on the heat sink is low, the second heat sink 4 is moved in the direction of arrow 6 to reduce its height to perform cooling, and if the amount of heat generated is high, it is moved in the direction of arrow 7 The cooling can be performed by increasing the height of the second heat sink 4.
以上説明したように本考案は第１のヒートシンクと第
２のヒートシンクを組合せ、それを集積回路ケースに取
付けることにより、プリント配線板上に実装された集積
回路の発熱量に対応した冷却性能を得ることができ、実
装スペースを有効に使用することができ、また１対のヒ
ートシンクを用意することで対応できるため、ヒートシ
ンクの種類の低減を行うことが可能となる効果を有す
る。As described above, according to the present invention, the first heat sink and the second heat sink are combined and attached to the integrated circuit case to obtain a cooling performance corresponding to the heat generation of the integrated circuit mounted on the printed wiring board. Therefore, the mounting space can be effectively used, and it can be handled by preparing a pair of heat sinks, so that the type of heat sink can be reduced.
第１図は本考案の一実施例を示す図、第２図は同拡大詳
細図である。 １…プリント配線板、２…集積回路ケース ３…第１のヒートシンク ４…第２のヒートシンクFIG. 1 is a view showing an embodiment of the present invention, and FIG. 2 is an enlarged detail view of the same. DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Integrated circuit case 3 ... 1st heat sink 4 ... 2nd heat sink
Claims (1)
出面に取り付けられ、複数のフィンを備えた第１のヒー
トシンクと、 この第１のヒートシンクの前記複数のフィンをかぶせる
形状に成形され、前記第１のヒートシンクの前記複数の
フィンを挟み込むとともに前記複数のフィンが延出され
た方向の任意の位置に固定される第２のヒートシンクと
を含むことを特徴とするヒートシンク構造。A first heat sink having a plurality of fins, the first heat sink having a plurality of fins, the first heat sink being mounted on a heat emitting surface of an integrated circuit case on which an integrated circuit is mounted; And a second heat sink that sandwiches the plurality of fins of the first heat sink and is fixed at an arbitrary position in a direction in which the plurality of fins extend.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989048430U JP2522916Y2 (en) | 1989-04-25 | 1989-04-25 | Heat sink structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989048430U JP2522916Y2 (en) | 1989-04-25 | 1989-04-25 | Heat sink structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02138439U JPH02138439U (en) | 1990-11-19 |
| JP2522916Y2 true JP2522916Y2 (en) | 1997-01-22 |
Family
ID=31565229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989048430U Expired - Lifetime JP2522916Y2 (en) | 1989-04-25 | 1989-04-25 | Heat sink structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522916Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201942U (en) * | 1986-06-13 | 1987-12-23 |
-
1989
- 1989-04-25 JP JP1989048430U patent/JP2522916Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02138439U (en) | 1990-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6269864B1 (en) | Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors | |
| JP2004047998A (en) | Heat radiator having a plurality of fin types | |
| US20020171139A1 (en) | High performance air cooled heat sinks used in high density packaging applications | |
| JP2522916Y2 (en) | Heat sink structure | |
| US6501655B1 (en) | High performance fin configuration for air cooled heat sinks | |
| JP2624362B2 (en) | Heat dissipation and shielding case for semiconductor elements | |
| JPH01133338A (en) | Heat sink | |
| KR19990055507A (en) | Memory module and manufacturing method | |
| JP2862695B2 (en) | Circuit module mounting structure | |
| JPH06181395A (en) | Heat dissipation printed-wiring board | |
| JPS5910790Y2 (en) | package structure | |
| JPS58201349A (en) | Heat dissipation of integrated circuit | |
| JPS5826533Y2 (en) | electronic circuit equipment | |
| JPS5847718Y2 (en) | heat dissipation printed circuit board | |
| JP2002185174A (en) | Heat radiating structure of printed circuit board | |
| JPH0412555A (en) | Semiconductor device | |
| JPH0539658Y2 (en) | ||
| JPH08204371A (en) | Radiating structure of electronic component | |
| JPH054576U (en) | Heat dissipation mounting structure for integrated circuits | |
| JPH0521663A (en) | Cooling structure of integrated circuit | |
| JPH04364767A (en) | Resin-sealed semiconductor device | |
| JPS621251A (en) | Structure of radiator fin | |
| JPH054577U (en) | Integrated circuit heat dissipation mounting structure | |
| JP2003347508A (en) | Stacked type electronic component | |
| JPS63227098A (en) | Heat radiating mounting structure of electronic parts |