JPH054577U - Integrated circuit heat dissipation mounting structure - Google Patents
Integrated circuit heat dissipation mounting structureInfo
- Publication number
- JPH054577U JPH054577U JP5081391U JP5081391U JPH054577U JP H054577 U JPH054577 U JP H054577U JP 5081391 U JP5081391 U JP 5081391U JP 5081391 U JP5081391 U JP 5081391U JP H054577 U JPH054577 U JP H054577U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- radiator
- heat dissipation
- circuit board
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【構成】プリント基板１に集積回路２の大きさの穴をあ
けるとともに裏面に放熱器５を設ける。集積回路２の上
部からばね性のある固定ばね３で押圧固定し、集積回路
２の裏面と放熱器５を穴の部分で熱伝導性グリス７によ
り密着させ、さらにプリント基板１と固定ばね３、放熱
器５をねじ４とナット６にて締結固定する。
【効果】放熱器による集積回路裏面の放熱効果だけでな
く、固定ばねによる集積回路上部の放熱効果も得られ
る。
(57) [Summary] [Structure] A hole having the size of the integrated circuit 2 is formed in the printed circuit board 1 and the radiator 5 is provided on the back surface. The fixed spring 3 having a spring property is pressed and fixed from the upper part of the integrated circuit 2, the heat sink 5 is brought into close contact with the back surface of the integrated circuit 2 at the hole portion, and further the printed circuit board 1 and the fixed spring 3, The radiator 5 is fastened and fixed with the screw 4 and the nut 6. [Effect] Not only the heat radiation effect of the back surface of the integrated circuit by the radiator but also the heat radiation effect of the upper portion of the integrated circuit by the fixed spring can be obtained.
Description
【０００１】[0001]
本考案は集積回路の放熱実装構造に関し、特に表面実装における集積回路と放 熱器の実装構造に関する。 The present invention relates to a heat dissipation mounting structure for an integrated circuit, and more particularly to a mounting structure for an integrated circuit and a heat sink in surface mounting.
【０００２】[0002]
従来、この種の集積回路の放熱実装構造は、図２に示すように、プリント基板 １１と集積回路１２の各端子をハンダ付けで固定し、集積回路１２の裏面がプリ ント基板１１と密着することにより放熱していた。 Conventionally, in this type of heat dissipation mounting structure for an integrated circuit, as shown in FIG. 2, the terminals of the printed circuit board 11 and the integrated circuit 12 are fixed by soldering, and the back surface of the integrated circuit 12 is in close contact with the printed circuit board 11. It was radiating heat.
【０００３】[0003]
上述した従来の集積回路の放熱実装構造は、プリント基板と集積回路の裏面の みの放熱を行っているため、放熱性があまり高くなく、また集積回路の小型化に より、集積回路自体に放熱器を取付けることが困難という欠点があった。 In the conventional heat dissipation mounting structure for the integrated circuit described above, heat is dissipated only from the printed circuit board and the back surface of the integrated circuit, so the heat dissipation is not very high. There was a drawback that it was difficult to attach the vessel.
【０００４】[0004]
本考案の集積回路放熱実装構造は、集積回路を搭載し且つこの集積回路より僅 かに大きい貫通穴を有するプリント基板と、このプリント基板の裏面に設けられ 前記貫通穴の部分で前記集積回路の下面と接する放熱器と、前記プリント基板の 表面に設けらればね性によって前記集積回路の上面を押圧して固定する固定ばね と、前記プリント基板を介して前記放熱器と前記固定ばねとを締結するねじ部材 とを備えている。 The integrated circuit heat dissipation mounting structure of the present invention has a printed circuit board on which the integrated circuit is mounted and which has a through hole slightly larger than the integrated circuit and a through hole provided on the back surface of the printed circuit board. A radiator in contact with the lower surface, a fixing spring provided on the surface of the printed circuit board to press and fix the upper surface of the integrated circuit by springiness, and the radiator and the fixed spring are fastened via the printed circuit board. And a screw member.
【０００５】[0005]
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
【０００６】 図１（ａ）及び（ｂ）は本考案の一実施例の斜視図及び断面図である。1A and 1B are a perspective view and a sectional view of an embodiment of the present invention.
【０００７】 プリント基板１に集積回路２の大きさの穴をあけるとともに裏面に放熱器５を 設ける。集積回路２の上部からばね性のある固定ばね３で押圧固定し、集積回路 ２の裏面と放熱器５を穴の部分で熱伝導性グリス７により密着させ、さらにプリ ント基板１と固定ばね３、放熱器５をねじ４とナット６にて締結固定している。A hole having the size of the integrated circuit 2 is formed in the printed board 1 and a radiator 5 is provided on the back surface. The integrated circuit 2 is pressed and fixed from above by a fixed spring 3 having a spring property, the back surface of the integrated circuit 2 and the radiator 5 are brought into close contact with each other by the heat conductive grease 7 at the hole portion, and further, the printed board 1 and the fixed spring 3 are attached. The radiator 5 is fastened and fixed with screws 4 and nuts 6.
【０００８】 このような構成により、放熱器５による集積回路２の裏面の放熱性を高めると ともに、集積回路２を固定する固定ばね３と放熱器５がねじ４で固定されて熱が 伝わることにより、集積回路２の上部の熱が放熱されることになる。With such a configuration, the heat dissipation of the back surface of the integrated circuit 2 by the radiator 5 is improved, and the fixing spring 3 for fixing the integrated circuit 2 and the radiator 5 are fixed by the screw 4 to transmit heat. As a result, the heat of the upper part of the integrated circuit 2 is radiated.
【０００９】[0009]
以上説明したように本考案は、集積回路の裏面に放熱器を取付け、さらに上部 を固定ばねで固定することにより、集積回路の裏面の放熱だけでなく、固定ばね による上部の放熱効果が得られ、十分な放熱性を有する。 As described above, according to the present invention, by mounting the radiator on the back surface of the integrated circuit and further fixing the upper part with the fixing spring, not only the back surface of the integrated circuit but also the upper part can be radiated by the fixing spring. , With sufficient heat dissipation.
【図１】本考案の一実施例を示す、同図（ａ）は斜視
図、同図（ｂ）は断面図である。1A and 1B are a perspective view and a sectional view, respectively, showing an embodiment of the present invention.
【図２】従来の集積回路放熱実装構造の正面図である。FIG. 2 is a front view of a conventional integrated circuit heat dissipation mounting structure.
１，１１ プリント基板 ２，１２ 集積回路 ３ 固定ばね ４ ねじ ５ 放熱器 ６ ナット ７ 熱伝導性グリス 1,11 Printed circuit board 2,12 Integrated circuit 3 Fixed spring 4 Screw 5 Radiator 6 Nut 7 Thermal conductive grease
Claims (1)
僅かに大きい貫通穴を有するプリント基板と、このプリ
ント基板の裏面に設けられ前記貫通穴の部分で前記集積
回路の下面と接する放熱器と、前記プリント基板の表面
に設けらればね性によって前記集積回路の上面を押圧し
て固定する固定ばねと、前記プリント基板を介して前記
放熱器と前記固定ばねとを締結するねじ部材とを備える
ことを特徴とする集積回路放熱実装構造。Claims for utility model registration 1. A printed circuit board on which an integrated circuit is mounted and which has a through hole slightly larger than the integrated circuit, and the integrated circuit at the through hole provided on the back surface of the printed circuit board. A radiator in contact with the lower surface of the circuit; a fixing spring provided on the surface of the printed circuit board to press and fix the upper surface of the integrated circuit by springiness; and the radiator and the fixed spring via the printed circuit board. An integrated circuit heat dissipation packaging structure comprising: a screw member to be fastened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5081391U JPH054577U (en) | 1991-07-02 | 1991-07-02 | Integrated circuit heat dissipation mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5081391U JPH054577U (en) | 1991-07-02 | 1991-07-02 | Integrated circuit heat dissipation mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH054577U true JPH054577U (en) | 1993-01-22 |
Family
ID=12869208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5081391U Pending JPH054577U (en) | 1991-07-02 | 1991-07-02 | Integrated circuit heat dissipation mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054577U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101307871B1 (en) * | 2011-11-02 | 2013-09-12 | 동아전장주식회사 | Controller for motor |
| JP2014139986A (en) * | 2013-01-21 | 2014-07-31 | Hitachi Automotive Systems Ltd | Electronic controller |
-
1991
- 1991-07-02 JP JP5081391U patent/JPH054577U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101307871B1 (en) * | 2011-11-02 | 2013-09-12 | 동아전장주식회사 | Controller for motor |
| JP2014139986A (en) * | 2013-01-21 | 2014-07-31 | Hitachi Automotive Systems Ltd | Electronic controller |
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