JP3048757U - Mounting structure of heat sink to substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily attach a heat sink to a board without twisting a leg for inserting and attaching a heat sink to the board, and to insert other components into the board. The present invention provides a structure for attaching a heat sink to a substrate, which allows the heat sink to be attached to the substrate after the fixing and fixing, and facilitates the work of inserting and attaching other components surrounded by the heat sink. SOLUTION: A leg 2 is provided on a heat sink 1, a substantially C-shaped snap portion 3 is formed on the leg 2, and a heat sink 1 is inserted into a through hole 7 formed in a heat sink mounting portion of a substrate 6. Legs 2
Is inserted until the snap part 3 is positioned on the back side of the substrate, and the heat sink 1 is attached to the substrate 6 in a state where the heat sink 1 is prevented from coming off by the snap part 3.

Description

[Detailed description of the invention] [Technical field to which the invention belongs]

 The present invention relates to a mounting structure in which a heat sink is mounted on a substrate in an upright state.

[Prior art]

 2. Description of the Related Art Conventionally, as a mounting structure in which a heat sink is mounted on a substrate in an upright state, for example, there is a mounting structure shown in FIG. This is achieved by forming a hole 11 in the substrate 10, forming a leg 21 on the heat sink 20, inserting the leg 21 of the heat sink 20 into the hole 11 of the substrate 10, The part located on the back side of the was twisted and fixed. However, as described above, since the legs 21 of the heat sink 20 are twisted and fixed so as not to come off, other components (not shown) are used to prevent other components from falling off due to vibration when the legs 21 are twisted. Before inserting the radiator plate 20 into a hole (not shown) provided in another portion of the substrate 10 and fixing the radiator plate 20, the radiator plate 20 must first be erected and fixed. When inserting and fixing other components to the board, there is a problem that the heat radiating plate 20 hinders the attachment of other components to the board 10. Further, when the heat radiating plate 20 is fixed to the substrate 10 in an upright state, it is necessary to twist and fix the leg portion 21 to prevent the heat radiating plate 20 from coming off. Further, as a conventional structure for attaching a heat sink to a substrate, for example, a heat sink mounting device described in Japanese Utility Model Laid-Open No. 3-77490 and a solid device described in Japanese Patent Application Laid-Open No. 55-88361 are disclosed. There is a mounting structure. As shown in FIGS. 4, 5, and 6, the heat sink mounting device described in Japanese Utility Model Laid-Open No. 3-77490 discloses a metal that can be soldered to a heat sink 105 made of a non-solderable metal. 106 is fixed so as to protrude, and a protruding portion of metal 106 that can be soldered is inserted from a mounting surface of the electronic device into a hole provided in printed wiring board (substrate) 101 and soldered to printed wiring board (substrate) 101. 107. However, this heat sink mounting device requires a solderable metal 106 in addition to the heat sink 105, so that the number of parts is large, the structure is complicated, and the mounting operation is difficult to perform. . As shown in FIGS. 7, 8, and 9, the mounting structure of the solid-state device described in Japanese Patent Application Laid-Open No. 55-88361 is composed of a first metal plate 213 and a first metal plate 213 spaced apart from one side of a flat metal plate 213. Protrusions 211, 212 are provided which extend from one side substantially parallel to one another so that they fit into the first openings 231 of the printed circuit board (substrate) 230 and are soldered. The metal connecting portion 215 is provided in such a manner that the metal connecting portion 215 is engaged with the metal plate 213 at a position between the first and second spaced projections 211 and 212. Extending at an angle relative to the plane of the plate to allow the mounting of the metal plate 213 to the chassis 240, forming a heat conduction path from the entire area of the metal plate 213 to the chassis 240 via the connecting portion 215; Power tiger on metal plate 213 Register and has a structure in which a means for attaching in close relation to the metal plate 213. However, this solid device mounting structure has a problem that the number of parts is large, the structure is complicated, and mounting work is difficult to perform.

[Problems to be solved by the invention]

 The present invention solves the above-mentioned conventional problems, has a simple structure, can be easily attached to the board without twisting the legs for inserting and attaching the heat sink to the board, and furthermore, other components can be mounted. It is an object of the present invention to provide a structure for attaching a heat sink to a board, which allows the heat sink to be attached to the board after being fixed to the board after being fixed to the board, thereby facilitating the work of inserting and mounting other components surrounded by the heat sink. And

[Means for Solving the Problems]

 In order to achieve the above object, the invention according to claim 1 provides a mounting structure in which a radiator plate is mounted on a substrate in an upright state, wherein the radiator plate is provided with legs, and the legs are viewed from the side. A substantially C-shaped snap portion is formed, and the legs of the heat sink are inserted into the through holes formed in the heat sink mounting portion of the board until the snap portion is located on the back surface side of the board, and the heat dissipation is performed. It is characterized in that the plate is attached to the substrate in a state where the plate is fixed by the snap portion and is prevented from coming off. The invention according to claim 2 is characterized in that a notch in a vertical direction having an appropriate dimension is formed in an upper part of an edge of the leg in the main body of the heat sink.

[Embodiment of the invention]

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front vertical sectional view showing a mounting structure of a heat sink to a substrate according to the embodiment, and FIG. 2 is a side vertical sectional view thereof. As shown in FIGS. 1 and 2, the mounting structure of the heat radiating plate to the substrate according to the present embodiment has a leg portion 2 provided on the heat radiating plate 1, and the leg portion 2 has a substantially C-shaped snap when viewed from the side. The part 3 is formed. Further, in the upper part of the edge of the leg 2 in the main body 4 of the heat radiating plate 1, a vertical notch 5 having an appropriate dimension is formed. The substrate 6 has a through hole 7 into which the leg 2 of the heat sink 1 is inserted. When the leg 2 of the radiator plate 1 formed as described above is inserted into the through hole 7 of the substrate 6, the substantially C-shaped snap part 3 of the leg 2 in a side view comes into contact with the back surface 8 of the substrate 6, The radiator plate 1 is installed upright with the radiator plate 1 secured. In this manner, the heat radiating plate 1 can be attached to the substrate 6 in an upright state only by inserting the leg 2 of the heat radiating plate 1 into the through hole 7 of the substrate 6, so that the leg 2 is inserted as in the conventional case. The heat radiation plate 1 can be easily attached to the substrate 6 without having to twist the leg 2 later. Further, since no extra parts are required, the number of parts can be reduced, the structure is simple, and the apparatus can be provided at low cost. Moreover, the heat radiating plate 1 can be mounted on the substrate 6 after other components are inserted into the substrate 6 and fixed, so that the operation of inserting and mounting other components surrounded by the heat radiating plate 1 can be easily performed.

[Effect of the invention]

 As described above, according to the invention of claim 1, when the legs of the heat sink are inserted into the through holes of the substrate, the substantially C-shaped snap portions of the legs when viewed from the side come into contact with the back surface of the substrate. Since it can be mounted upright in contact with the board, it has a simple structure, and can be easily attached to the board without twisting the legs for inserting and attaching the heat sink to the board. Moreover, the radiator plate can be attached to the substrate after other components are inserted and fixed to the substrate, and the work of inserting and attaching other components surrounded by the radiator plate can be easily performed. According to the invention described in claim 2, since the vertical notch of an appropriate size is formed in the upper part of the edge of the leg in the main body of the heat sink, the leg can have spring properties. In addition, it is possible to prevent the heat sink from tilting or falling. Furthermore, the cuts can partially lower the thermal conductivity of the legs, so that when the legs are soldered to the substrate, heat is less likely to escape from the legs and the soldering is facilitated.

[Brief description of the drawings]

FIG. 1 is a front vertical sectional view showing a state in which a radiator plate is mounted upright on a substrate using a mounting structure according to an embodiment of the present invention.

FIG. 2 is a side longitudinal sectional view of the mounting structure shown in FIG.

FIG. 3 is a front vertical sectional view showing a first example of a conventional mounting structure of a heat sink to a substrate.

FIG. 4 is a front view showing a second example of a conventional structure for attaching a heat sink to a substrate.

FIG. 5 is a side view of a second conventional mounting structure.

FIG. 6 is an exploded front view of a second conventional mounting structure.

FIG. 7 is a perspective view of a mounting plate used in a conventional mounting structure for a solid-state device such as a transistor.

FIG. 8 is a partially cutaway side view of a conventional solid-state device mounting structure.

FIG. 9 is a front view of a conventional solid-state device mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Leg part 3 Approximately C-shaped snap part in side view 4 Main part 5 Notch 6 Substrate 7 Through-hole

Claims (2)

[Utility model registration claims] 1. A mounting structure in which a radiator plate is mounted on a substrate in an upright state. A leg portion is provided on the radiator plate, and a substantially C-shaped snap portion is formed on the leg portion in a side view. In a state where the legs of the heat sink are inserted into the through holes formed in the heat sink mounting portion until the snap portion is located on the back surface side of the substrate, the heat sink is prevented from falling off by the snap portion and the board is fixed. A structure for attaching a heat sink to a substrate, wherein the heat sink is attached to a substrate. 2. A heat sink plate according to claim 1, wherein a vertical notch of an appropriate dimension is formed in an upper portion of an edge portion of said leg portion in a body portion of said heat sink. Mounting structure.