JPS58180049A - Heat sink device - Google Patents

Abstract

PURPOSE:To enable to display effectively the radiating effect in small space, while to enable also to exchange a transistor easily by a method wherein an opening is provided at the upper part of the transistor equipped part of a heat sink, the heat sink is bent at nearly a right angle at a bending line passing the opening thereof, while taking out or insertion of the transistor is enabled through the opening thereof. CONSTITUTION:After the lead terminals 12 of the transistor 7 fixed to the heat sink 6 are inserted in a printed substrate and are soldered, when a screw 11 fixing the transistor 7 is removed to take out the transistor 7 at need of repair, because the opening 8 is positioning in the upper direction of the transistor 7, the transistor 7 can be taken out easily to the upper side by only removing solder of the lead terminals 12. Because the transistor 7 can be inserted also toward the opening 8 from the right overhead part when the transistor is to be equipped, work is facilitated, and serviceability is enhanced extremely. Moreover, because the heat sink 6 is bent at the bending line 9 passing the opening 8, the collector fin of the transistor 7 comes in contact with the heat sink 6 surely, and highly reliable contact (thermal conduction) can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a transistor heat dissipation device in which the transistor collector is attached so as to be in contact with a heat dissipation plate, and the transistor lead terminal is inserted and connected to a printed circuit board. It is an object of the present invention to provide a heat dissipation device that can effectively exhibit a heat dissipation effect and also allows easy work when replacing a transistor.

Conventionally, a transistor heat sink on a printed circuit board is installed in the cabinet where the printed circuit board is mounted.

If the height is restricted due to the size of the transistor, the size can be extended in the lateral direction of the transistor.

If the heat dissipation area is still insufficient, as shown in FIG. 1, the portion located above the transistor is bent to create a bent portion to secure the necessary area. In FIG. 1, 1 is a heat sink, 2 is a transistor, 3 is a printed circuit board, 4 is a lead terminal of the transistor 2, and 6 is a screw for fixing the transistor 2 to the heat sink 1.

However, when the heat dissipation plate 1 is processed into such a shape, the upper surface of the transistor 2 is covered, which impedes air convection and reduces the heat dissipation effect.

Therefore, in order to allow this air convection to occur, openings are provided on the top side of the heat sink. In addition, in order to improve the heat dissipation effect as much as possible, the material of the heat sink is mostly aluminum. Therefore, since soldering is not possible when fixing this heat sink to a printed circuit board, the heat dissipation plate is attached using a twist stopper.

Under such circumstances, especially when height restrictions are severe, it may be necessary to make the height of the heat sink approximately the same as the height of the transistor.

In this case, unless you remove the heat sink from the printed circuit board,
Since the transistor cannot be removed from the printed circuit board, serviceability becomes extremely poor.

The present invention eliminates this drawback by cutting out the upper end of the transistor attachment part of the heat sink to provide an opening, and bending the heat sink at a substantially right angle along the bending line passing through this opening.
The object of the present invention is to provide a heat radiating device that has a good heat radiating effect and is also excellent in serviceability.

An example of this will be described below with reference to FIGS. 2 to 4.

FIG. 2 shows the final shape of the heat sink 6, and FIG. 3 shows the state of the heat sink 6 before it is bent. This heat sink 6
An opening 8 is provided above the mounting part of the transistor 7,
The heat dissipation plate 6 is bent into an oval shape along a bending line 9 passing through the opening 8. Heat sink 6 at the above folding line 9
When bent at a substantially right angle, the opening 8 is located above the transistor 7, and the transistor 7 is inserted through the opening 8.
The size is such that it can be taken out upwards and also inserted.

In FIGS. 2 and 3, 10 is a ventilation hole for increasing the heat radiation effect, and 11 is a screw for fixing the transistor 7 to the heat sink 6.

Transistor 7 fixed to heat sink 6 as described above
After inserting the lead terminal 12 into a printed circuit board (not shown) and soldering it, when the transistor 7 is removed for repair, the screw 11 fixing the transistor 7 can be removed, and the upper direction of the transistor 7 can be removed. Since the opening 8 is located in the opening 8, the transistor 7 can be easily removed upwardly by removing the solder from the lead terminal 12. Furthermore, in mounting, the transistor 7 can be inserted from directly above toward the opening 8, making the work easier and serviceability greatly improved. In addition, since the heat sink 6 is bent at the bend line 9 passing through the holes, the collector fin of the transistor 7 reliably contacts the heat sink 6.
Highly reliable contact (thermal conduction) can be obtained. Furthermore, since the openings 8 can be formed by press working at the same time as the ventilation holes 10, they will not be an obstacle at all in manufacturing the heat sink plate 6.

Figure 4 shows an example of actual use, in which the heat sink 13 is
Similarly to the figure, a bent portion 15 is provided parallel to the printed circuit board 14, and a bent portion 15 is also provided in the lateral direction of the transistor 7.
A plurality of mounting legs 17 and 17' are installed on these, and a plurality of openings 8' corresponding to the openings 8 in FIGS. It is provided so as to be continuous with a part of the hole 18. Mounting legs 17 , 1 of the heat sink 13 to which the transistor 7 is fixed
7' into the printed circuit board 14, and twist the desired mounting legs 17 on the back side with the jig 19.
Attachment to the printed circuit board 14 is completed.

As explained above, according to the present invention, an opening is provided above the transistor mounting portion of the heat sink, and the heat sink is bent at a substantially right angle along a bending line passing through the opening.
Take out the transistor upward through the hole in the
By making it possible to insert from above,
The heat dissipation effect can be effectively exerted in a small space, and transistors can be easily replaced.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view of a conventional heat dissipation device, Fig. 2 is an exploded perspective view of a heat dissipation device according to an embodiment of the present invention, and Fig. 3 is a transistor attached to a heat dissipation plate before bending in the present invention. FIG. 4 is a front view showing a state in which the device is placed, and FIG. 4 is a perspective view showing a specific embodiment of the present invention. 6.e...heat sink, 7..threat transistor,
8...Opening hole, 9...0...Bending line. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 1θ Figure 3 Figure 4

Claims (1)

[Claims] An opening is provided above the transistor mounting part of the heat sink, and the heat sink is bent approximately at right angles along a bending line passing through this opening, so that the opening in the bent heat sink is positioned above the transistor. and the aperture is sized to allow insertion and removal of a transistor through the aperture.