JPS5910799Y2 - Electrical component mounting equipment - Google Patents
Electrical component mounting equipmentInfo
- Publication number
- JPS5910799Y2 JPS5910799Y2 JP4020179U JP4020179U JPS5910799Y2 JP S5910799 Y2 JPS5910799 Y2 JP S5910799Y2 JP 4020179 U JP4020179 U JP 4020179U JP 4020179 U JP4020179 U JP 4020179U JP S5910799 Y2 JPS5910799 Y2 JP S5910799Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- partition plate
- electrical components
- electrical component
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】 本考案は、電気部品取付け装置に関する。[Detailed explanation of the idea] The present invention relates to an electrical component mounting device.
従来、電気部品たとえば要放熱電気部品としてのトラン
ジスタはプリント基板に組込まれて使用されているが、
オーディオ機器などに使用されるトランジスタはその放
熱を促進するために放熱器を付設するのが常である。Conventionally, electrical components such as transistors, which require heat dissipation, have been incorporated into printed circuit boards.
Transistors used in audio equipment and the like are usually provided with a heat sink to promote heat dissipation.
そして、この放熱器は通常かさばるものであるから、基
板上にトランジスタなどの電気部品を組込み、はんだ付
けした後放熱器を取付けるようにして作業能率を図って
いる。Since this heatsink is usually bulky, electrical parts such as transistors are assembled on the board, soldered, and then the heatsink is attached to improve work efficiency.
しかしながら、トランジスタが複数個基板に組込まれて
いるようなものの場合には、放熱器とトランジスタを接
触固定するには、放熱器を基板あるいはシャーシに取付
けるいずれの場合にも、トランジスタをねじで取付けた
り、トランジスタを押え板で押えたりしており、複数の
トランジスタのそれぞれのねし孔を放熱器のねし孔に合
致させることに手数がかかる。However, in the case of a device in which multiple transistors are assembled on a board, in order to secure contact between the heatsink and the transistor, whether the heatsink is attached to the board or the chassis, the transistor must be attached with screws. In this case, the transistors are held down by a holding plate, and it takes time and effort to align the holes of each of the plurality of transistors with the holes of the heatsink.
そして調整を要し、作業性が悪い。It requires adjustment and has poor workability.
また、放熱器取付け後、複数のトランジスタのうち1個
が故障しても、この故障のトランジスタを取替えるため
に放熱器を取はずす必要があり、この際、基板の取付け
位置が狭いスペースに電気部品を多数装着している個所
であると、トランジスタのねじの取付け、取はずしには
、これらの電気部品がじゃまになり、作業性が悪いか、
また、たとえばラジオ受信器のようにトランジスタと熱
の影響を受けやすい高周波用部品が同一基板上に取付け
られていると、トランジスタの放熱器からの熱によりバ
リコンの容量が変化するなど、一般に言われる温度ドリ
フトの問題が生じ、目盛ずれなどの原因になっている。In addition, even if one of the multiple transistors fails after installing the heatsink, the heatsink must be removed in order to replace the failed transistor. If a large number of electrical components are installed in a location, these electrical components may get in the way when installing or removing transistor screws, resulting in poor workability.
Additionally, it is generally said that when transistors and high-frequency components that are sensitive to heat are mounted on the same board, such as in a radio receiver, the capacitance of the variable capacitor changes due to the heat from the transistor's heatsink. Problems with temperature drift have occurred, causing scale misalignment.
本考案は、このような点に鑑みなされたもので、区画板
に押え部を設け、この区画板に放熱器を取付け、この放
熱器と押え部により要放熱部品を挾着するようにし、こ
のようにして各区画を遮熱てきるようにするとともに、
要放熱電気部品と放熱器の接触固定を容易にしようとす
るものである。The present invention was devised in view of these points. A holding part is provided on the partition plate, a radiator is attached to this partition plate, and a component requiring heat radiation is clamped between the radiator and the holding part. In this way, each compartment can be insulated from heat, and
This is intended to facilitate the contact and fixation of electrical components that require heat radiation and a radiator.
次に、本考案の一実施例を図面について説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
1は前面の゛目盛板の背後に設けられているバック板、
2は背面パネルで、これらバック板1および背面パネル
を離間して配設するとともに、これらバック板1および
背面パネル2の間にプリント基板3およびシャーシ4を
このシャーシ4を折曲して形威した区画板5により区画
して配設し、この区画板5によりそれぞれ低放熱部6お
よび高放熱部7を形成する。1 is the back plate installed behind the front scale plate,
Reference numeral 2 denotes a rear panel, and the back plate 1 and the rear panel are arranged apart from each other, and the printed circuit board 3 and chassis 4 are placed between the back plate 1 and the rear panel 2 by bending the chassis 4. The partition plate 5 forms a low heat radiation section 6 and a high heat radiation section 7, respectively.
低放熱部6のプリント基板3には上記区画板5に面した
一側端縁に要放熱電気部品として複数個のトランジスタ
8を放熱面を一側外方に向け同一垂直面に位置して並設
し、一方、他側端には高周波用部品9、中央および前端
には他の電気部品10をそれぞれ取付け、前端の電気部
品10の軸11をバック板1より前方に突出させる。On one edge of the printed circuit board 3 of the low heat dissipation section 6 facing the partition plate 5, a plurality of transistors 8 are arranged as electric components requiring heat dissipation, with the heat dissipation surface facing outward on one side and located on the same vertical plane. On the other hand, a high frequency component 9 is attached to the other end, and other electrical components 10 are attached to the center and front ends, with the shaft 11 of the electrical component 10 at the front end protruding forward from the back plate 1.
また、上記一側部の高放熱部7の上記シャーシ4には、
トランスなどの熱放出性電気部品12が取付けられてい
るとともに、上記区画板5の下方に上記他側部の基板3
側に突出して逆L字形に押え部13を切起し形威し、こ
の押え部13により押え部13の一側部に形或された開
口14に上記トランジスタ8を位置させる。In addition, the chassis 4 of the high heat dissipation section 7 on one side includes:
A heat dissipating electric component 12 such as a transformer is attached, and the substrate 3 on the other side is installed below the partition plate 5.
The holding portion 13 is cut and shaped into an inverted L shape that protrudes to the side, and the transistor 8 is positioned in an opening 14 formed on one side of the holding portion 13 by the holding portion 13.
また、上記区画板5の一側外面に微少な凹凸を付した放
熱面5aを形或するとともに、上端には外向き、両側に
は上記基板3側にそれぞれ折曲片15.16を形或し、
折曲片16を上記前面のバック板1および背面パネル2
にねじ17にて固着し、固定する。Further, a heat dissipation surface 5a with minute irregularities is formed on the outer surface of one side of the partition plate 5, and bent pieces 15 and 16 are formed on the upper end facing outward and on both sides toward the substrate 3 side. death,
The bent piece 16 is attached to the front back plate 1 and the back panel 2.
Fix it with screws 17.
また、18は放熱器で、この放熱器18は、上記開口1
4をおおいさらに周囲を延在させた基部19の両側にね
じ孔20を形或するとともに、一側面に多数のフイン2
1を突設している。Further, 18 is a heat radiator, and this heat radiator 18 is connected to the opening 1.
A screw hole 20 is formed on both sides of the base 19 which covers the base 19 and further extends around the periphery, and a large number of fins 2 are formed on one side.
1 is installed protrudingly.
そして、放熱器18の基部19を区画板5およびトラン
ジスタ8の放熱面に接触させ、押え部13と放熱器18
の基部19との間にトランジスタ8を挾着し、ねじ22
にて放熱器18を区画板5に固着する。Then, the base 19 of the heatsink 18 is brought into contact with the partition plate 5 and the heatsink surface of the transistor 8, and the presser part 13 and the heatsink 18
The transistor 8 is clamped between the base 19 of the
The heat radiator 18 is fixed to the partition plate 5 at.
本考案によれば、要放熱電気部品を含む熱放出性電気部
品と他の電気部品を区画板により遮熱してそれぞれ配設
し、かつこの区画板に押え部を形或し、放熱器をこの区
画板に取付け、放熱器と押え部の間に要放熱電気部品を
挾着するようにしたから、たとえば複数のトランジスタ
を放熱器に個々に取付ける面倒がなく、また、トランジ
スタの故障の際、放熱器を取はずすのも簡単にでき、そ
の上、放熱器には特別な加工を行なう必要もなく、極め
て便利である。According to the present invention, heat-dissipating electrical components including electrical components that require heat dissipation and other electrical components are respectively disposed while being heat-shielded by a partition plate, and the partition plate is formed with a holding part, and the heat radiator is attached to the heat radiator. Since it is attached to the partition plate and the electrical components that require heat dissipation are clamped between the heat sink and the holding part, there is no need to individually attach multiple transistors to the heat sink, for example. The device can be easily removed, and there is no need to perform any special processing on the radiator, making it extremely convenient.
また、区画板はそれぞれの区画の電気部品の熱を遮断し
、放熱器の位置する一側に熱放出性電気部品、他側に熱
的影響を受けやすい高周波用電気部品を配して熱的影響
を少なくでき、しかも、区画板を熱良導体で形威し、放
熱器との接触面積を大きくすることもでき、熱の分散を
促進して放熱効果を向上できる。In addition, the partition board blocks heat from the electrical components in each section, and heat-emitting electrical components are placed on one side where the radiator is located, and high-frequency electrical components that are easily affected by heat are placed on the other side. In addition, the partition plate can be made of a good thermal conductor to increase the contact area with the heat sink, promoting heat dispersion and improving the heat radiation effect.
第1図は本考案の取付け装置の一実施例の一部を切欠い
た平面図、第2図はその一部の縦断面図である。
5・・・・・・区画板、8・・・・・・要放熱電気部品
としてのトランジスタ、9.10・・・・・.電気部品
、12・・・・・・熱放出性電気部品、13・・・・・
・押え部。FIG. 1 is a partially cutaway plan view of an embodiment of the mounting device of the present invention, and FIG. 2 is a longitudinal sectional view of the portion. 5... Division board, 8... Transistor as an electrical component requiring heat dissipation, 9.10... Electrical parts, 12... Heat-emitting electrical parts, 13...
- Presser foot.
Claims (1)
とを区画板によって一側部と他側部とに区画し、この区
画板の一側部に位置した熱放出性電気部品のうち要放熱
電気部品を区画板に形或した押え部の一側面に配設し、
かつ、区画板の一側面に放熱器を取付けてこの放熱器と
上記区画板の押え部との間に要放熱電気部品を挾着した
ことを特徴とする電気部品取付け装置。Heat dissipating electrical components including heat dissipating electrical components and other electrical components are divided into one side and the other side by a partition plate, and among the heat dissipating electrical components located on one side of the partition plate, Electrical components that require heat dissipation are arranged on one side of a holding part shaped like a partition plate,
An electrical component mounting device characterized in that a heat radiator is attached to one side of the partition plate, and an electrical component requiring heat radiation is clamped between the heat radiator and a holding portion of the partition plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4020179U JPS5910799Y2 (en) | 1979-03-28 | 1979-03-28 | Electrical component mounting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4020179U JPS5910799Y2 (en) | 1979-03-28 | 1979-03-28 | Electrical component mounting equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55141998U JPS55141998U (en) | 1980-10-11 |
JPS5910799Y2 true JPS5910799Y2 (en) | 1984-04-04 |
Family
ID=28908468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4020179U Expired JPS5910799Y2 (en) | 1979-03-28 | 1979-03-28 | Electrical component mounting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5910799Y2 (en) |
-
1979
- 1979-03-28 JP JP4020179U patent/JPS5910799Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS55141998U (en) | 1980-10-11 |
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