JPH0349433Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a mounting structure for high-frequency heat-generating electronic components such as isolators used in radio equipment and the like.

[Technical background of the invention]

Radio equipment uses high-frequency heat-generating electronic components such as isolators. Figures 3 and 4 are
This figure shows a mounting structure for such a high frequency heat generating electronic component.

In the illustrated radio device, a housing 2 having a heat sink 1 is provided with a mounting seat 2a for a high-frequency heat generating electronic component 3 and a mounting seat 2b for a printed wiring board 4. Further, the printed wiring board 4 has a notch 4a formed therein. In this radio, the printed wiring board 4 is fastened to the housing 2 with screws 5a and 5b, and the high-frequency heat-generating electronic component 3 is fastened to the housing 2 with screws 5c. One terminal 3a of the heat generating electronic component 3 is connected to the conductive pattern of the printed wiring board 4, and the other terminal 3b and the jack 6 are connected to each other.
and are connected via the terminal rod 7. In addition, in this radio device, the shield plate 8 is then attached with the screw 5d.
is fastened to the housing 2.

In such a radio device, the high frequency heat generating electronic component 3 is in direct contact with the housing 2 via the mounting seat 2a, and the heat of the electronic component 3 is easily radiated from the heat sink 1.

[Problems with background technology]

By the way, in such electronic devices such as radios, the high frequency heat generating electronic component 3 is easily affected by external electromagnetic waves, so the electronic component 3,
It is necessary to keep the ground patterns 4b formed on the back surfaces of the casing 2 and the printed wiring board 4 at the same ground potential.

However, in the above mounting structure,
Since the high-frequency heat-generating electronic component 3 and the ground pattern 4b of the printed wiring board 4 are connected via the housing 2, the ground line between them becomes long, causing a potential difference on the ground line, etc. , there is a risk that the earthing effect will deteriorate.

[Purpose of invention]

An object of the present invention is to provide a mounting structure for high-frequency heat-generating electronic components that can enhance the grounding effect without reducing the heat dissipation effect of the high-frequency heat-generating electronic components.

[Summary of the idea]

That is, in the present invention, a high-frequency heat-generating electronic component is provided on one side of a printed wiring board, and an insertion hole and a through-hole are provided in a portion of the printed wiring board that faces the high-frequency heat-generating electronic component. A grounding pattern connected to the through hole is formed on the other surface, and a base portion to be inserted into the through hole is provided at a portion of the heat dissipating member corresponding to the through hole of the printed wiring board, and the through hole is connected to the through hole. One edge of the opening is brought into contact with the high frequency heat generating electronic component, and the other opening edge is brought into contact with the heat radiating member, and the base and the high frequency heat generating electronic component are connected to each other through the insertion hole. The above purpose is achieved by bringing them into contact.

[Example of idea]

The present invention will be described below with reference to embodiments shown in the drawings. FIGS. 1 and 2 show an electronic device to which the mounting structure for a high-frequency heat-generating electronic component according to the present invention is applied, and exemplify the mounting structure for an isolator 23 in a radio device. A housing (heat radiating member) 11 of this radio device includes a heat sink 12 at the bottom. Attachment seats 14 for the printed wiring board 13 are formed on the upper surface of this housing 11, and in the center of one of the attachment seats 14, as shown in FIG. 2a, a base portion 15 is formed. has been done. These mounting seats 14 have female screw holes 1.
6 and 17 are formed. The printed wiring board 13 is
It is provided with a pedestal insertion hole 18 of a size corresponding to the pedestal 15 of the mounting seat 14, and the pedestal insertion hole 1
A plurality of through holes 22, 22... are provided around the 8, and screw insertion holes 19, 20 are provided at appropriate locations.
It is equipped with A ground pattern 21 is formed on the lower surface of the printed wiring board 13 so as to include a base insertion hole 18, a plurality of through holes 22, 22, . . . , and screw insertion holes 19, 20. Therefore, the ground pattern 21 is connected to the through hole 22.

Below, the assembly work of each of the above-mentioned elements will be explained, and the configuration will also be explained in more detail.

The printed wiring board 13 on which other electronic components (not shown) except the isolator 23 are mounted is placed on the housing 11, and then the screw insertion holes 19 of the printed wiring board 13 are placed.
Screw the screws 24 and 25 inserted into the female screw holes 16 of the mounting seat 14 of the housing 11, and then attach the printed wiring board 1.
3 to the housing 11. Then, the base 15 of the casing 11 is accommodated in the base insertion hole 18 of the printed wiring board 13, and the upper surface of the base 15 is located on substantially the same plane as the upper surface of the printed wiring board 13. Also, at this time, the ground pattern 21 formed on the lower surface of the printed wiring board 13 comes into contact with the housing 11 via the mounting seat 14 .

Next, the isolator 23 is placed on the printed wiring board 13, and the screws 27 inserted through the mounting portion 26 of the isolator 23 and the screw insertion holes 20 of the printed wiring board 13 are inserted into the female screw holes of the mounting seat 14 of the housing 11. 17
The isolator 23 is fastened to the housing 11 by screwing the isolator 23 into the housing 11. Then, the bottom surface of the isolator 23 is brought into close contact with the base part 15 of the housing 11, and is also connected to the ground pattern 21 of the printed wiring board 13 via the through hole 22, and the mounting part 26 of the isolator 23 and the screw 27 It is connected to the ground pattern 21 of the printed wiring board 13 via. In the thus arranged isolator 23, one electrode 28 is connected to a conductive pattern (not shown) of the printed wiring board 13, and the other electrode 29 is connected to the conductive pattern 30 of the printed wiring board 13 and the terminal bar 31. and is connected to the jack 32. Note that in this radio device, the shield plate 34 is then attached to the housing 11 with the screws 33.
is concluded.

The radio device assembled as described above includes an isolator 23, a housing 11, and a printed wiring board 13.
The earth pattern 21 of
and a plurality of through holes 22, 22, etc., which are electrically connected to each other by short lines, so that these three are at the same ground potential, and the influence of external electromagnetic waves on the isolator 23 is reliably prevented. Ru.

Further, the heat generated in the isolator 23 is transferred to the base portion 15 and the plurality of through holes 22, 22, . . .
Since the heat is transmitted to the casing 11 through the heat sink 12 and further radiated through the heat sink 12, the heat radiation effect does not deteriorate.

It should be noted that the order of assembling the radio set shown in the above embodiment is merely an example, and it goes without saying that the order of assembling the radio equipment may be performed in another order.

Further, in the above embodiment, the mounting structure of an isolator in a radio device is shown, but it goes without saying that the present invention can also be applied to the mounting of high-frequency heat-generating electronic components in electronic devices other than radio devices.

[Effect of idea]

As described above, in the mounting structure of the high frequency heat generating electronic component according to the present invention, the high frequency heat generating electronic component is brought into contact with one opening edge of the through hole connected to the ground pattern, and the heat is radiated from the other opening edge. Since the members are in contact with each other, the conduction distance from the electronic component to the earth pattern and the heat radiation member is the length of the through hole. Therefore, the electronic component, the ground pattern, and the heat radiation member are at the same potential, and the electronic component can be reliably grounded.

Furthermore, the heat generated by the high-frequency heat-generating electronic component is efficiently transferred to the heat radiating member via the base and the through hole, so that a sufficient heat radiating effect is ensured.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a radio device that employs the mounting structure for high-frequency heat-generating electronic components according to the present invention, FIG. FIG. 3 is a perspective view of a radio device employing a conventional mounting structure for high-frequency heat-generating electronic components, FIG. 4a is a vertical sectional view of the main part thereof, and FIG. 4b is a plan view of the main part. 11... Housing, 12... Heat sink, 13...
...Printed wiring board, 14...Mounting seat, 15...Base part,
17...Female screw hole, 18...Base insertion hole, 20...
...Screw insertion hole, 21...Earth pattern, 22...
...Through hole, 23...Heat-generating electronic component for high frequency, 26...Mounting part, 27...Screw, 28, 29
...Terminal, 30...Conductor pattern.

Claims (1)

[Claims for Utility Model Registration] A mounting structure for a high frequency heat generating electronic component, in which a high frequency heat generating electronic component is provided on one surface of a printed wiring board, and a heat radiating member is provided on the other surface of the printed wiring board, comprising: An insertion hole and a through hole are provided in a portion of the printed wiring board facing the high frequency heat generating electronic component, and a ground pattern connected to the through hole is formed on the other surface of the wiring board, while the heat dissipating member A base portion to be inserted into the insertion hole is provided at a portion corresponding to the insertion hole of the printed wiring board, one opening edge of the through hole is brought into contact with the high frequency heat generating electronic component, and the other opening edge A mounting structure for a high-frequency heat-generating electronic component, characterized in that the base portion and the high-frequency heat-generating electronic component are brought into contact with each other through the insertion hole.