JPH10173390A - Electronic apparatus - Google Patents

Electronic apparatus

Info

Publication number
JPH10173390A
JPH10173390A JP8346553A JP34655396A JPH10173390A JP H10173390 A JPH10173390 A JP H10173390A JP 8346553 A JP8346553 A JP 8346553A JP 34655396 A JP34655396 A JP 34655396A JP H10173390 A JPH10173390 A JP H10173390A
Authority
JP
Japan
Prior art keywords
housing
printed circuit
circuit board
frame
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8346553A
Other languages
Japanese (ja)
Inventor
Nobuyuki Suzuki
伸幸 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP8346553A priority Critical patent/JPH10173390A/en
Priority to KR1019970067215A priority patent/KR100286466B1/en
Priority to MXPA97010032A priority patent/MXPA97010032A/en
Publication of JPH10173390A publication Critical patent/JPH10173390A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/04Metal casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/03Covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Abstract

PROBLEM TO BE SOLVED: To enhance the thermal radiation effect to the outside by covering one surface of a printed board with a housing, contacting the bottom of the housing to a conductive pattern, and sandwiching the printed board between a frame disposed at the other surface of the board and housing. SOLUTION: A printed board at the side of an apparatus has mounting legs 4f soldered to the board. A housing 1 and cover 4b of a frame 4 form an electric shield in use. Heat on one side of a hot printed board 2 esp. due to the operation of power amplifiers radiates to the outside through a high-thermal conductivity Al housing 1. The heat of the hot printed board 2 due to operation of power amplifiers, etc., conducts peripheral conductive patterns 2b and radiates to the outside through the housing 1 and frame contacts to the patterns 2b, thus enhancing the thermal radiation effect.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、移動電話機の無線
回路ユニットなどの電子機器に関し、特に、電気的なシ
ールドと放熱効果の良好なものを提供せんとするもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a radio circuit unit of a mobile telephone, and more particularly to an electronic device having good electric shielding and heat radiation effect.

【0002】[0002]

【従来の技術】従来のこの種の電子機器は、図9ー図1
0に示すように、導電性の半田付け可能な鉄板から成る
筺体30は、箱状のカバー部31と、カバー部31から
下方に延びた取付脚32と、該取付脚32に設けられた
折り曲げ部33とを有している。また、プリント基板3
4には、その回路パターン(図示せず)にパワーアンプ
35等の電気部品(図示省略)が接続されて電子回路が
構成されている。そして、図9の点線部分にパワーアン
プ35が取り付けられ、このパワーアンプ35を取り付
けたプリント基板34面側をカバー部31で覆って、筺
体30の取付脚32の折り曲げ部33を、プリント基板
34の裏面の導電体36に係止して取り付けられ、この
取付脚32を、セット側のプリント基板(図示せず)等
に半田付で取り付けられるようになっている。
2. Description of the Related Art FIG.
As shown in FIG. 0, a housing 30 made of a conductive solderable iron plate includes a box-shaped cover portion 31, a mounting leg 32 extending downward from the cover portion 31, and a bent portion provided on the mounting leg 32. Part 33. Also, the printed circuit board 3
4, an electronic circuit is formed by connecting an electric component (not shown) such as a power amplifier 35 to the circuit pattern (not shown). Then, a power amplifier 35 is attached to the dotted line portion in FIG. 9, and the surface of the printed circuit board 34 to which the power amplifier 35 is attached is covered with the cover 31, and the bent portion 33 of the mounting leg 32 of the housing 30 is attached to the printed circuit board 34. The mounting leg 32 is attached to a conductor 36 on the back side of the set by soldering to a printed circuit board (not shown) on the set side or the like.

【0003】[0003]

【発明が解決しようとする課題】上述のような従来の電
子機器において、筺体30は電気的なシールドと半田付
けの必要性から、鉄板で形成されているため、鉄板の筺
体30は熱伝導性が悪く、従って、パワーアンプ35に
よる熱の、筺体30を介して外部への放熱効果が悪く、
このため、筺体30内に熱がこもり、電気部品の破損を
招くという問題がある。また、この問題は、プリント基
板34が、複数のプリント基板の積層で構成されたもの
を用いる時、顕著となる。また、パワーアンプ35によ
って加熱されたプリント基板34の熱は、導電体36を
通じて逃げようとするが、導電体34の筺体30への接
触面が小さく、このため、プリント基板34の放熱が不
十分であるという問題があった。さらに、プリント基板
34の裏面は、開放された状態となっているため、電気
的なシールドが得られないものあった。
In the above-mentioned conventional electronic equipment, the housing 30 is formed of an iron plate because of the necessity of electrical shielding and soldering. Therefore, the heat radiating effect of the heat from the power amplifier 35 to the outside through the housing 30 is poor.
For this reason, there is a problem that heat is trapped in the housing 30 and the electric components are damaged. Further, this problem becomes remarkable when the printed circuit board 34 is formed by stacking a plurality of printed circuit boards. Further, the heat of the printed circuit board 34 heated by the power amplifier 35 tends to escape through the conductor 36, but the contact surface of the conductor 34 to the housing 30 is small, so that the heat dissipation of the printed board 34 is insufficient. There was a problem that is. Further, since the back surface of the printed circuit board 34 is in an open state, an electrical shield cannot be obtained.

【0004】[0004]

【課題を解決するための手段】前記課題を解決するため
の第1の解決手段として、アルミニュウムから成ると筺
体と、電気部品が備えられ一方の面の周辺に導電パター
ンを有するプリント基板と、半田付け可能な金属板から
成る枠体とを備え、前記プリント基板の一方の面を前記
筺体で覆うと共に、該筺体の下部を前記導電パターンに
当接させ、前記プリント基板の他面側に配接された前記
枠体と前記筺体とで、前記プリント基板を挟持した構成
とした。また、第2の解決手段として、前記プリント基
板の他面の周辺に導電パターンを設け、該導電パターン
に前記枠体の端部を当接させると共に、前記枠体と前記
筺体とを相互に係止させて組み合わせた構成とした。ま
た、第3の解決手段として、前記枠体に舌片を設け、該
舌片を、前記プリント基板の他面の周辺に設けた導電パ
ターンに弾接させた構成とした。また、第4の解決手段
として、前記プリント基板が、複数のプリント基板を積
層して構成されている構成とした。前記プリント基板の
他面を、カバー部材で覆った構成とした。
As a first means for solving the above-mentioned problems, a housing made of aluminum, a printed circuit board provided with electric components and having a conductive pattern around one surface, and a solder are provided. A frame made of a metal plate that can be attached to the printed circuit board. The printed circuit board is sandwiched between the frame and the housing. Further, as a second solution, a conductive pattern is provided around the other surface of the printed circuit board, an end of the frame is brought into contact with the conductive pattern, and the frame and the housing are interconnected. Stopped and combined. As a third solution, a tongue is provided on the frame, and the tongue is elastically contacted with a conductive pattern provided around the other surface of the printed circuit board. As a fourth solution, the printed circuit board is configured by stacking a plurality of printed boards. The other surface of the printed circuit board was covered with a cover member.

【0005】[0005]

【発明の実施の形態】次に、本発明の一実施例を図1ー
図4に示した電子機器に基づいて説明する。この実施例
において、電子機器は移動電話機の無線回路ユニットを
示しており、熱伝導性の良好なアルミニュウムから成る
箱形の筺体1は、その上面板1aに複数個の放熱用の孔
1bが設けられ、また、周囲の側板1cには、適宜個所
に、凸部1dを有する窪み部1eが設けられている。ま
た、複数のプリント基板を積層して形成されたプリント
基板2は、一方の面と他方の面に回路パターン(図示せ
ず)が形成されていて、パワーアンプ3等の電気部品
(図示せず)が接続されて取り付けられている。図2に
おいて、点線部分Tにはパワーアンプ7が取り付けられ
るようになってる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to the electronic equipment shown in FIGS. In this embodiment, the electronic apparatus is a radio circuit unit of a mobile telephone, and a box-shaped casing 1 made of aluminum having good thermal conductivity is provided with a plurality of holes 1b for heat radiation on an upper surface plate 1a. The peripheral side plate 1c is provided with a depression 1e having a projection 1d at an appropriate position. The printed circuit board 2 formed by laminating a plurality of printed circuit boards has a circuit pattern (not shown) formed on one surface and the other surface, and electric components such as the power amplifier 3 (not shown). ) Is connected and attached. In FIG. 2, a power amplifier 7 is attached to a dotted line portion T.

【0006】また、プリント基板2の側部には、筺体1
の窪み部1eと対応した位置に切り欠き部2aが設けら
れると共に、プリント基板2の両面の外周周辺には、回
路パターンと接続されてアースとなる導電パターン2b
が形成されている。そして、この導電パターン2bは、
筺体1の側板2cの下部と対向する位置に形成されてい
る。
A housing 1 is provided on the side of the printed circuit board 2.
A notch 2a is provided at a position corresponding to the concave portion 1e, and a conductive pattern 2b, which is connected to a circuit pattern and serves as a ground, is
Are formed. And this conductive pattern 2b
It is formed at a position facing the lower part of the side plate 2c of the housing 1.

【0007】導電性があり半田付け可能な鉄板等の金属
板から成る枠体4は、放熱用の複数個の孔4aを有する
平板状のカバー部材4bと、このカバー部材4bの周辺
から上方に折り曲げられ、筺体1の凸部1dに係合する
凹部4cを有する腕部4dと、プリント基板2の他面に
設けられた導電パターン2bと対向して、枠体4の周辺
に、一部を切り起こしによって設けられたバネ性のある
舌片4eと、下方に突出した取付脚4fとを備えてい
る。
A frame 4 made of a conductive and solderable metal plate such as an iron plate has a flat cover member 4b having a plurality of holes 4a for heat dissipation, and a cover member 4b extending upward from the periphery of the cover member 4b. The arm 4 d having a concave portion 4 c engaged with the convex portion 1 d of the housing 1 and the conductive pattern 2 b provided on the other surface of the printed board 2 are opposed to each other, and a part thereof is provided around the frame 4. It has a tongue piece 4e having a spring property provided by cutting and raising, and a mounting leg 4f protruding downward.

【0008】そして、筺体1は、プリント基板2の一面
に取り付けられたパワーアンプ3を含む電気部品を覆う
ようにして、側板1cの下部を導電パターン2bに当接
させ、また、枠体4でプリント基板2の他面を覆うよう
にして、その腕部4dを、プリント基板2の切り欠き部
2aと筺体1の窪み部1eとに、プリント基板2の他面
側から挿入し、図1、図3に示すように、腕部4dの凹
部4cを凸部1dに係止させて、枠体4と筺体1とが相
互に係止されて組み合わされ、プリント基板2を挟持し
ている。この時、図3、図4に示すように、枠体4の舌
片4e、及びその周辺部は、プリント基板2の他面の導
電パターン2bに当接すると共に、舌片4eのバネ性に
より、筺体1がプリント基板2側に引き寄せられて、筺
体1の下部と導電パターン2bとの接触を強めている。
The housing 1 covers the electric components including the power amplifier 3 mounted on one surface of the printed circuit board 2 so that the lower part of the side plate 1c abuts on the conductive pattern 2b. The arm 4d is inserted into the notch 2a of the printed circuit board 2 and the recess 1e of the housing 1 from the other surface of the printed circuit board 2 so as to cover the other surface of the printed circuit board 2, as shown in FIG. As shown in FIG. 3, the concave portion 4c of the arm portion 4d is locked to the convex portion 1d, and the frame 4 and the housing 1 are locked and combined with each other to sandwich the printed circuit board 2. At this time, as shown in FIGS. 3 and 4, the tongue piece 4e of the frame 4 and its peripheral portion abut on the conductive pattern 2b on the other surface of the printed circuit board 2, and due to the spring property of the tongue piece 4e, The housing 1 is drawn to the printed circuit board 2 side, and the contact between the lower part of the housing 1 and the conductive pattern 2b is strengthened.

【0009】そして、このような構成を有する電子機器
は、セット側のプリント基板(図示せず)にその取付脚
4fを半田付けして取り付けられ、使用時、筺体1、及
び枠体4のカバー部材4bによって電気的なシールドを
行い、また、特に、パワーアンプ3によって発熱したプ
リント基板2の一面側の熱は、熱伝導性の良いアルミニ
ュウムの筺体1を介して外部に放熱され、また、パワー
アンプ3等で熱くなったプリント基板2の熱は、周辺の
導電パターン2bに伝わり、この導電パターン2bに接
触した筺体1、及び枠体4を通じて外部に放熱されるよ
うになっている。また、プリント基板2の他面側には、
比較的、発熱の小さい電気部品を配置しているので、半
田付け可能な金属板の枠体4による放熱で、足りるもの
である。
The electronic device having such a configuration is mounted on a printed circuit board (not shown) on the set side by soldering its mounting legs 4f. When used, the cover of the housing 1 and the frame 4 is used. Electrical shielding is performed by the member 4b. In particular, heat on one side of the printed circuit board 2 generated by the power amplifier 3 is radiated to the outside through the aluminum housing 1 having good thermal conductivity. The heat of the printed circuit board 2 heated by the amplifier 3 and the like is transmitted to the peripheral conductive pattern 2b, and is radiated to the outside through the housing 1 and the frame 4 which are in contact with the conductive pattern 2b. On the other side of the printed circuit board 2,
Since the electric components that generate relatively little heat are arranged, heat radiation by the frame 4 of the metal plate that can be soldered is sufficient.

【0010】また、図5ー図8は本発明の電子機器の他
の実施例を示し、ここでは、前記実施例と同一部分には
同一符号を付し、詳細な説明は省略する。この実施例に
おいては、アルミニュウムから成る筺体1は、孔1bを
有する上面板1aと、側板1cと、凸部1dを有し、側
板1cから下方に突出した腕部1fとを備えている。ま
た、プリント基板2には、パワーアンプ3等の電気部品
が取り付けられ、切り欠き部2aと、導電パターン2b
とが前記実施例と同様に形成されている。
FIGS. 5 to 8 show another embodiment of the electronic apparatus of the present invention. Here, the same parts as those of the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In this embodiment, the housing 1 made of aluminum includes an upper surface plate 1a having a hole 1b, a side plate 1c, and an arm 1f having a convex portion 1d and projecting downward from the side plate 1c. An electric component such as a power amplifier 3 is attached to the printed circuit board 2, and a notch 2a and a conductive pattern 2b are provided.
Are formed in the same manner as in the above embodiment.

【0011】また、導電性の半田付け可能な鉄板等の金
属板から成る枠体4は、周辺に切り起こしされて形成さ
れた舌片4eと、取付脚4fと、掛け止め部4gと、凹
部4hを有する袖部4jとを備えている。また、この実
施例では、鉄板から成るカバー部材5が枠体4と別部材
で構成され、このカバー部材5には、孔5aを有する板
状部5bと、凸部5cを有する腕部5dとを備えてい
る。
The frame 4 made of a metal plate such as a conductive solderable iron plate is provided with a tongue piece 4e formed by cutting and raising the periphery, a mounting leg 4f, a latch 4g, and a recess. And a sleeve 4j having a sleeve 4h. Further, in this embodiment, the cover member 5 made of an iron plate is formed as a separate member from the frame body 4. The cover member 5 includes a plate-shaped portion 5b having a hole 5a and an arm portion 5d having a convex portion 5c. It has.

【0012】そして、筺体1は、プリント基板2の一面
を覆うようにして、側板1cの下部を導電パターン2b
に当接させ、また、枠体4を、プリント基板2の他面側
から筺体1の腕部1fに、その掛け止め部4gを合わせ
て、凸部1dで係止する。すると、図8に示すように、
枠体4の舌片4e、及びその周辺がプリント基板2の他
面の導電パターン2bに当接すると共に、舌片4eのバ
ネ性により、筺体1の下部がプリント基板2側に引き寄
せられて、筺体1と導電パターン2bとの接触を強めて
いる。次に、カバー部材5を、プリント基板2の他面側
から枠体4に合わせ、その凸部5cを枠体4の凹部4h
に嵌合して取付、カバー部材5でプリント基板2の他面
側を覆うようにしている。
The housing 1 covers one surface of the printed circuit board 2 so that the lower part of the side plate 1c is connected to the conductive pattern 2b.
The frame 4 is locked to the arm 1f of the housing 1 from the other surface side of the printed circuit board 2 with the latching portion 4g, and the projection 1d. Then, as shown in FIG.
The tongue piece 4e of the frame 4 and its periphery abut the conductive pattern 2b on the other surface of the printed circuit board 2, and the lower part of the housing 1 is drawn toward the printed circuit board 2 by the spring property of the tongue piece 4e. 1 and the conductive pattern 2b. Next, the cover member 5 is fitted to the frame 4 from the other surface side of the printed circuit board 2, and the convex portion 5 c is set to the concave portion 4 h of the frame 4.
The cover member 5 covers the other surface of the printed circuit board 2.

【0013】このような実施例においても、前述した実
施例と同様に、放熱作用と、シールド作用を行うもので
ある。また、この実施例のように、カバー部材5を、枠
体4と別部材にすることによって、カバー部材5が、鉄
板、或いはアルミニュウム等、必要に応じてその材料を
選択できると共に、シールドを必要としないときは、カ
バー部材5を取り外したものとすれば良く、融通性を持
たすことが出来る。
[0013] In this embodiment as well, the heat radiation function and the shielding function are performed similarly to the above-described embodiment. Further, as in this embodiment, by forming the cover member 5 as a separate member from the frame 4, the cover member 5 can be made of a material such as an iron plate or aluminum if necessary, and a shield is required. If not, it is sufficient that the cover member 5 is removed, and flexibility can be provided.

【0014】[0014]

【発明の効果】本発明の電子機器においては、熱伝導性
の良いアルミニュウムの筺体を、プリント基板の周辺に
設けた導電パターンに当接したものであるため、筺体内
の熱の放熱が良く、且つ、プリント基板の熱を導電パタ
ーンを通じて放熱し得て、電気部品の破損のない電子機
器を提供できる。また、プリント基板の他面に設けた導
電パターンに、枠体の端部を当接することによって、更
に、プリント基板の放熱効果を向上することが出来る。
また、筺体と枠体とを相互に係止するこにより、筺体の
取付が容易になると共に、筺体のアースが枠体を通じて
行うことが出来て、他の部品を必要とせず、その構成が
簡単となる。また、枠体に舌片を設けることによって、
筺体の導電パターンへの接触を強くでき、熱の伝導と、
アースのための接触を確実に出来る。また、複数のプリ
ント基板を積層して形成されたプリント基板を用いるも
は、大きな放熱を必要とし、このようなものにおいて、
特に、顕著な効果を発揮することが出来る。更に、カバ
ー部材を用いることにより、プリント基板の他面におけ
るシールド効果と、放熱効果が得られ、性能の良好な電
子機器を提供できる。
According to the electronic apparatus of the present invention, since the aluminum casing having good heat conductivity is brought into contact with the conductive pattern provided around the printed circuit board, the heat radiation inside the casing is good. In addition, it is possible to radiate the heat of the printed circuit board through the conductive pattern, and to provide an electronic device in which the electric component is not damaged. In addition, by contacting the end of the frame with the conductive pattern provided on the other surface of the printed board, the heat dissipation effect of the printed board can be further improved.
In addition, since the housing and the frame are locked to each other, the mounting of the housing is facilitated, and the housing can be grounded through the frame, so that other components are not required and the configuration is simple. Becomes Also, by providing a tongue piece on the frame,
The contact with the conductive pattern of the housing can be strengthened,
Contact for grounding can be ensured. Also, the use of a printed circuit board formed by laminating a plurality of printed circuit boards requires a large amount of heat radiation, and in such a case,
In particular, a remarkable effect can be exhibited. Further, by using the cover member, a shielding effect and a heat radiation effect on the other surface of the printed circuit board can be obtained, and an electronic device having good performance can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明における電子機器の斜視図。FIG. 1 is a perspective view of an electronic device according to the invention.

【図2】本発明における電子機器の分解斜視図。FIG. 2 is an exploded perspective view of the electronic device according to the invention.

【図3】本発明における電子機器に係り、図1のA−A
線における要部断面図。
FIG. 3 relates to an electronic device according to the present invention,
Sectional drawing of the principal part in a line.

【図4】本発明における電子機器に係り、図1のB−B
線における要部断面図。
FIG. 4 relates to an electronic device according to the present invention,
Sectional drawing of the principal part in a line.

【図5】本発明における他の実施例の電子機器の斜視
図。
FIG. 5 is a perspective view of an electronic apparatus according to another embodiment of the present invention.

【図6】本発明における他の実施例の電子機器の分解斜
視図。
FIG. 6 is an exploded perspective view of an electronic apparatus according to another embodiment of the present invention.

【図7】本発明における他の実施例の電子機器に係り、
図5のC−C線における要部断面図。
FIG. 7 relates to an electronic apparatus according to another embodiment of the present invention.
FIG. 6 is an essential part cross-sectional view along the line CC in FIG. 5;

【図8】本発明における他の実施例の電子機器に係り、
図5のD−D線における要部断面図。
FIG. 8 relates to an electronic apparatus according to another embodiment of the present invention.
FIG. 6 is an essential part cross-sectional view along the line DD in FIG. 5;

【図9】従来の電子機器の分解斜視図。FIG. 9 is an exploded perspective view of a conventional electronic device.

【図10】従来の電子機器の要部断面図。FIG. 10 is a sectional view of a main part of a conventional electronic device.

【符号の説明】[Explanation of symbols]

1 筺体 1a 上面板 1b 孔 1c 側板 1d 凸部 1e 窪み部 1f 腕部 2 プリント基板 2a 切り欠き部 2b 導電パターン 3 パワーアンプ 4 枠体 4a 孔 4b カバー部材 4c 凹部 4d 腕部 4e 舌片 4f 取付脚 4g 掛け止め部 4h 凹部 4j 袖部 5 カバー部材 5a 孔 5b 板状部 5c 凸部 5d 腕部 DESCRIPTION OF SYMBOLS 1 Housing 1a Top plate 1b Hole 1c Side plate 1d Convex part 1e Depressed part 1f Arm part 2 Printed circuit board 2a Notch part 2b Conductive pattern 3 Power amplifier 4 Frame 4a Hole 4b Cover member 4c Concave part 4d Arm part 4e Tongue piece 4f 4g Latch 4h Concave 4j Sleeve 5 Cover 5a Hole 5b Plate 5c Convex 5d Arm

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 アルミニュウムから成る筺体と、電気部
品が備えられ一方の面の周辺に導電パターンを有するプ
リント基板と、半田付け可能な金属板から成る枠体とを
備え、前記プリント基板の一方の面を前記筺体で覆うと
共に、該筺体の下部を前記導電パターンに当接させ、前
記プリント基板の他面側に配接された前記枠体と前記筺
体とで、前記プリント基板を挟持したことを特徴とする
電子機器。
1. A printed circuit board comprising: a housing made of aluminum; a printed board provided with an electric component and having a conductive pattern around one surface; and a frame made of a solderable metal plate. While covering the surface with the housing, the lower part of the housing is brought into contact with the conductive pattern, and the printed board is sandwiched between the frame and the housing arranged on the other surface side of the printed board. Electronic equipment characterized.
【請求項2】 前記プリント基板の他面の周辺に導電パ
ターンを設け、該導電パターンに前記枠体の端部を当接
させると共に、前記枠体と前記筺体とを相互に係止させ
て組み合わせたことを特徴とする請求項1記載の電子機
器。
2. A conductive pattern is provided around the other surface of the printed circuit board, an end of the frame is brought into contact with the conductive pattern, and the frame and the housing are mutually locked and combined. The electronic device according to claim 1, wherein:
【請求項3】 前記枠体に舌片を設け、該舌片を、前記
プリント基板の他面の周辺に設けた導電パターンに弾接
させたことを特徴とする請求項1、又は2記載の電子機
器。
3. The frame according to claim 1, wherein a tongue is provided on the frame, and the tongue is elastically contacted with a conductive pattern provided around the other surface of the printed circuit board. Electronics.
【請求項4】 前記プリント基板が、複数のプリント基
板を積層して構成されていることを特徴とする請求項
1、又は2、又は3記載の電子機器。
4. The electronic apparatus according to claim 1, wherein the printed circuit board is formed by laminating a plurality of printed circuit boards.
【請求項5】 前記プリント基板の他面を、カバー部材
で覆ったことを特徴とする請求項1、又は2、又は3、
又は4記載の電子機器。
5. The printed circuit board according to claim 1, wherein the other surface is covered with a cover member.
Or the electronic device according to 4.
JP8346553A 1996-12-11 1996-12-11 Electronic apparatus Pending JPH10173390A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8346553A JPH10173390A (en) 1996-12-11 1996-12-11 Electronic apparatus
KR1019970067215A KR100286466B1 (en) 1996-12-11 1997-12-10 Electronic apparatus
MXPA97010032A MXPA97010032A (en) 1996-12-11 1997-12-10 Electronic apparatus.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8346553A JPH10173390A (en) 1996-12-11 1996-12-11 Electronic apparatus

Publications (1)

Publication Number Publication Date
JPH10173390A true JPH10173390A (en) 1998-06-26

Family

ID=18384216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8346553A Pending JPH10173390A (en) 1996-12-11 1996-12-11 Electronic apparatus

Country Status (3)

Country Link
JP (1) JPH10173390A (en)
KR (1) KR100286466B1 (en)
MX (1) MXPA97010032A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003501814A (en) * 1999-05-26 2003-01-14 リッタル アールイーエス エレクトロニック システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Cover for circuit board
JP2009516909A (en) * 2005-10-10 2009-04-23 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング Electrical equipment
JP2010011200A (en) * 2008-06-27 2010-01-14 Canon Inc Image pickup device
JP2010093219A (en) * 2008-10-13 2010-04-22 Askey Computer Corp Circuit board of communication product, and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020051435A (en) * 2000-12-22 2002-06-29 밍 루 Radiator of electrical equipment
KR100927828B1 (en) 2007-09-13 2009-11-23 주식회사 피플웍스 Communication relay device in which functional blocks are formed integrally

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376400B2 (en) * 1994-06-20 2003-02-10 マスプロ電工株式会社 Electronic device housing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003501814A (en) * 1999-05-26 2003-01-14 リッタル アールイーエス エレクトロニック システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Cover for circuit board
JP2009516909A (en) * 2005-10-10 2009-04-23 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング Electrical equipment
JP2010011200A (en) * 2008-06-27 2010-01-14 Canon Inc Image pickup device
JP2010093219A (en) * 2008-10-13 2010-04-22 Askey Computer Corp Circuit board of communication product, and manufacturing method thereof

Also Published As

Publication number Publication date
KR100286466B1 (en) 2001-05-02
KR19980063972A (en) 1998-10-07
MXPA97010032A (en) 2002-03-07

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