JPH0710557Y2 - Noise shield device for printed circuit boards - Google Patents
Noise shield device for printed circuit boardsInfo
- Publication number
- JPH0710557Y2 JPH0710557Y2 JP1989039011U JP3901189U JPH0710557Y2 JP H0710557 Y2 JPH0710557 Y2 JP H0710557Y2 JP 1989039011 U JP1989039011 U JP 1989039011U JP 3901189 U JP3901189 U JP 3901189U JP H0710557 Y2 JPH0710557 Y2 JP H0710557Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- insulating sheet
- shield device
- conductive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】 （イ）産業上の利用分野 本案は、プリント基板に装着した電子部品が、雑音電波
を受けたり、逆に雑音電波を発したりすることを防止せ
んとするものである。[Detailed Description of the Invention] (a) Industrial Application Field The present invention is intended to prevent electronic components mounted on a printed circuit board from receiving noise radio waves or conversely emitting noise radio waves. .
（ロ）従来の技術 電子機器の雑音防止対策としてはシールド板を用いるこ
とが多いが、シールド板使用すると大型化することが避
けられないため、特公昭59−40036号公報に示すよう
に、プリント基板で電子部品を取囲むことによって雑音
電波を防止しようとする考え方も存在する。この方法に
よれば、シールド板を使用することなしにある程度雑音
電波を防止することができるものの、プリント基板を立
体的に取付ける為にやはり大型化することは避けられな
い。(B) Conventional technology As a noise prevention measure for electronic devices, a shield plate is often used, but the use of a shield plate inevitably increases the size. Therefore, as shown in Japanese Examined Patent Publication No. 59-40036, There is also an idea to prevent noise radio waves by surrounding electronic components with a board. According to this method, it is possible to prevent noise radio waves to some extent without using a shield plate, but it is inevitable that the printed board is increased in size in order to be mounted three-dimensionally.
（ハ）考案が解決しようとする課題 本案はプリント基板の立体化を避ける為に従来どうりシ
ールド板を使用しながらも、全体が大型化することのな
いようにせんとするものである。(C) Problems to be solved by the present invention This proposal is to use a shield plate as in the past in order to avoid the three-dimensionalization of the printed circuit board, but to prevent the entire size from increasing.
（ニ）課題を解決するための手段 上記問題点を解決するために、本案は、片面に導電箔を
装着した絶縁シートを、その絶縁面がプリント基板に対
向するように設け、前記プリント基板に取付けた電子部
品のアース側の足を、前記絶縁シートに穿設した透孔よ
り導電箔側に突出してこの導電箔に半田付けすることに
より、前記絶縁シートをシールド板とする。(D) Means for Solving the Problem In order to solve the above-mentioned problems, the present invention provides an insulating sheet having a conductive foil mounted on one surface thereof so that the insulating surface faces the printed circuit board, The grounding side leg of the attached electronic component projects from the through hole formed in the insulating sheet toward the conductive foil side and is soldered to the conductive foil, whereby the insulating sheet serves as a shield plate.
（ホ）作用 このような手段をとることによって、絶縁シートの導電
箔がアース電位となり、雑音を吸収することができる。
又、この絶縁シートは、プリント基板と対向する側が絶
縁面であるから、プリント基板に接触しても問題はな
い。(E) Action By taking such a means, the conductive foil of the insulating sheet becomes the ground potential and noise can be absorbed.
Further, since this insulating sheet has an insulating surface on the side facing the printed circuit board, there is no problem even if it contacts the printed circuit board.
（ヘ）実施例 以下図に基いて説明すると、（１）は上ケース（２）と
下ケース（３）よりなる本体ケースで、上ケースから一
体に円筒状のボス（４）（４）を垂設し、該ボスに下ケ
ース（３）側から螺子（５）を螺合することによって上
ケース（２）と下ケース（３）とを結合している。
（６）は上面に電子部品（７）（７）を装着すると共に
下面にプリント配線をしたプリント基板で、前記ボス
（４）（４）に嵌合することにより、該ボスと一体に形
成したリブ（８）（８）…と前記下ケース（３）との間
に挟持される。（９）はシールド板となる絶縁シート
で、その片面に銅箔（10）をプリントしている。他方の
面は絶縁面のままで、この絶縁面が前記プリント基板
（６）に対向している。而して、この絶縁シート（９）
には透孔（11）（11）が穿設されており、前記プリント
基板（６）に装着した電子部品（７）（７）のアース側
の足（12）（12）がこの透孔（11）（11）を貫通して突
出しており、この突出部分を前記銅箔（10）に半田付け
している。従って前記電子部品（７）（７）のアース側
の足（12）（12）はプリント基板（６）の裏面でプリン
ト配線（13）に半田付けされると共に、絶縁シートの銅
箔（10）にも半田付けされている。一方前記電子部品
（７）（７）のプラス側の足（14）（14）はプリント基
板（６）のプリント配線（15）に半田付けされているの
みで絶縁シート（９）を貫通しない。(F) Example To explain with reference to the drawings below, (1) is a main body case composed of an upper case (2) and a lower case (3), and cylindrical bosses (4) and (4) are integrally formed from the upper case. The upper case (2) and the lower case (3) are joined by vertically arranging and screwing a screw (5) onto the boss from the lower case (3) side.
(6) is a printed circuit board having electronic parts (7) and (7) mounted on the upper surface and printed wiring on the lower surface, and formed integrally with the bosses (4) and (4) by fitting them. It is sandwiched between the ribs (8) (8) ... And the lower case (3). (9) is an insulating sheet that serves as a shield plate, and has a copper foil (10) printed on one side thereof. The other surface remains an insulating surface, and this insulating surface faces the printed circuit board (6). Then, this insulation sheet (9)
Through holes (11) and (11) are formed in the through holes, and the ground side feet (12) and (12) of the electronic components (7) and (7) mounted on the printed circuit board (6) are formed in the through holes (11). 11) Penetrating through (11) and protruding, and the protruding portion is soldered to the copper foil (10). Therefore, the feet (12) (12) on the ground side of the electronic components (7) (7) are soldered to the printed wiring (13) on the back surface of the printed circuit board (6), and the copper foil (10) of the insulating sheet is also attached. Is also soldered. On the other hand, the positive side legs (14) (14) of the electronic components (7) (7) are only soldered to the printed wiring (15) of the printed circuit board (6) and do not penetrate the insulating sheet (9).
他の実施例である第３図では、絶縁シート（９）に突片
（16）（16）を形成し、この突片の先端まで銅箔（10）
を延長して装着している。一方プリント基板（６）に
は、電子部品のアース側の足（12）（12）を半田付けし
ているプリント配線部分（13）に透孔（17）（17）を穿
設しており、この透孔に前記絶縁シートの突片（16）
（16）を差し込んで半田付けする。In FIG. 3 which is another embodiment, the protruding pieces (16) and (16) are formed on the insulating sheet (9) and the copper foil (10) is formed up to the tip of the protruding piece.
Is extended and installed. On the other hand, in the printed circuit board (6), through holes (17) and (17) are formed in the printed wiring portion (13) where the feet (12) (12) on the ground side of the electronic component are soldered, The insulating sheet projection (16) is provided in the through hole.
Insert (16) and solder.
（ト）考案の効果 以上の如く本案は、絶縁シートの片面に設けた導電箔
を、プリント基板のアース側プリント配線部分に半田付
けしているので、絶縁シートがシールド板となって雑音
電波の影響を排除することができる。又、この絶縁シー
トは、絶縁面をプリント基板側にしているのでプリント
基板に接触しても問題はなく、シールド機能を持たせた
為に機器が大型化するようなことはない。更に、プリン
ト基板と絶縁シートの間を接続するのにリード線を用い
る必要がなく、接続作業が容易である。(G) Effect of the invention As described above, according to the present invention, the conductive foil provided on one surface of the insulating sheet is soldered to the printed wiring portion on the ground side of the printed circuit board. The influence can be eliminated. Further, since this insulating sheet has the insulating surface on the printed circuit board side, there is no problem even if it comes into contact with the printed circuit board, and the device does not become large because it has a shielding function. Further, it is not necessary to use a lead wire to connect between the printed board and the insulating sheet, and the connecting work is easy.
第１図は本案装置を備えた電気機器の断面図、第２図は
本案装置部分の分解斜視図、第３図は他の実施例であ
る。 （６）…プリント基板、（７）…電子部品、（９）…絶
縁シート、（10）…銅箔（導電箔）、（11）…透孔、
（12）…足、（13）…プリント配線、（16）…突片、
（17）…透孔。FIG. 1 is a sectional view of an electric device equipped with the device of the present invention, FIG. 2 is an exploded perspective view of the device part of the present invention, and FIG. 3 is another embodiment. (6) ... Printed circuit board, (7) ... Electronic component, (9) ... Insulating sheet, (10) ... Copper foil (conductive foil), (11) ... Through hole,
(12) ... foot, (13) ... printed wiring, (16) ... protrusion,
(17) ... Through hole.
Claims (1)
の絶縁面がプリント基板に対向するように設け、前記プ
リント基板に取付けた電子部品のアース側の足を、前記
絶縁シートに穿設した透孔より導電箔側に突出して、こ
の導電箔に半田付けしてなるプリント基板用雑音シール
ド装置。1. An insulating sheet having a conductive foil attached to one surface thereof is provided such that the insulating surface faces a printed circuit board, and a ground side foot of an electronic component mounted on the printed circuit board is punched in the insulating sheet. A noise shield device for a printed circuit board, which projects from the through hole to the conductive foil side and is soldered to the conductive foil.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989039011U JPH0710557Y2 (en) | 1989-03-31 | 1989-03-31 | Noise shield device for printed circuit boards |
| US07/488,831 US5119008A (en) | 1989-03-09 | 1990-03-06 | Battery charging apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989039011U JPH0710557Y2 (en) | 1989-03-31 | 1989-03-31 | Noise shield device for printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02129796U JPH02129796U (en) | 1990-10-25 |
| JPH0710557Y2 true JPH0710557Y2 (en) | 1995-03-08 |
Family
ID=31547527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989039011U Expired - Lifetime JPH0710557Y2 (en) | 1989-03-09 | 1989-03-31 | Noise shield device for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710557Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4639277B2 (en) * | 2001-06-21 | 2011-02-23 | 多摩川精機株式会社 | Optical fiber gyro drive circuit board shield method and shield structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6170999U (en) * | 1984-10-15 | 1986-05-15 | ||
| JPH0214232Y2 (en) * | 1985-07-31 | 1990-04-18 |
-
1989
- 1989-03-31 JP JP1989039011U patent/JPH0710557Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02129796U (en) | 1990-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0710557Y2 (en) | Noise shield device for printed circuit boards | |
| JP2001119118A (en) | Transmitter-mounting structure | |
| JP2000207060A5 (en) | ||
| JPH02955Y2 (en) | ||
| JPH10173390A (en) | Electronic apparatus | |
| KR200210429Y1 (en) | Grounding device for portable cordless phone | |
| JPH03678Y2 (en) | ||
| JP2601371B2 (en) | Mounting bracket for electronic components | |
| JPS6217989Y2 (en) | ||
| JPH0349433Y2 (en) | ||
| JPS6023902Y2 (en) | Terminal device for printed wiring board | |
| JPS5914385U (en) | Unit for electronic communication equipment | |
| JPH0220859Y2 (en) | ||
| JP2541441Y2 (en) | Antenna mounting device | |
| JPH0438554Y2 (en) | ||
| JPS6023996Y2 (en) | Heat generating parts mounting device | |
| JPS5940733Y2 (en) | transformer mounting device | |
| JPS6214718Y2 (en) | ||
| JPS6237340Y2 (en) | ||
| JPH0159881U (en) | ||
| JPH0528084U (en) | PCB grounding structure | |
| JPH0728146B2 (en) | Mounting structure of printed wiring board | |
| JPS6130289U (en) | high frequency electrical equipment | |
| JPH0751828Y2 (en) | Heat dissipation and grounding structure for electronic circuits | |
| JPH0337274Y2 (en) |