JPH0214232Y2 - - Google Patents
Info
- Publication number
- JPH0214232Y2 JPH0214232Y2 JP11652585U JP11652585U JPH0214232Y2 JP H0214232 Y2 JPH0214232 Y2 JP H0214232Y2 JP 11652585 U JP11652585 U JP 11652585U JP 11652585 U JP11652585 U JP 11652585U JP H0214232 Y2 JPH0214232 Y2 JP H0214232Y2
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- impermeable
- layer
- plate
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔考案の目的〕
（産業上の利用分野）
本考案は、電磁波もしくは磁気から電気回路を
保護するための電磁波シールド板に関し、特に電
気製品に組む込まれる電気絶縁性の電磁波シール
ド板に関する。[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) The present invention relates to an electromagnetic wave shielding plate for protecting electrical circuits from electromagnetic waves or magnetism, and is particularly applicable to electrically insulating materials incorporated into electrical products. Regarding electromagnetic shielding plates.
（従来の技術）
従来、電磁波シールド板としては、アルミニウ
ム、銅、鉄、銀、金等の金属板を加工し、電気絶
縁性を付与するためにこの金属板の一方の面ある
いは両面にプラスチツクフイルムを積層したもの
が知られている。例えば、実開昭59−112998号公
報には、金属板とこの金属板の両面に重ねた絶縁
材からなる２枚のフイルムから構成され、金属板
が除去された周辺部のフイルム同志が熱圧着によ
り接合されている電磁波シールド板が開示されて
いる。(Prior art) Conventionally, electromagnetic shielding plates have been made by processing metal plates such as aluminum, copper, iron, silver, and gold, and then coating one or both sides of the metal plate with a plastic film to provide electrical insulation. A laminated type is known. For example, Japanese Utility Model Application Publication No. 59-112998 discloses that the film is composed of two films made of a metal plate and an insulating material laminated on both sides of the metal plate, and the films in the periphery from which the metal plate has been removed are bonded together by thermocompression. An electromagnetic shielding plate is disclosed which is bonded by.
また、より薄い金属箔を電磁波不透過性材料と
して使用し、この金属箔の両面を硬質のプラスチ
ツク板で積層することによつて電気絶縁性とした
電磁波シールド板も知られている。 Also known is an electromagnetic shielding plate that uses thinner metal foil as an electromagnetic wave-impermeable material and has hard plastic plates laminated on both sides of the metal foil to provide electrical insulation.
しかしながら、よりコンパクト化を追求される電
気製品、例えば、ビデオテツキ、ビデオカメラテ
レビ、トランシーバー、チユーナー、オーデイオ
機器、コンピユーター等に電磁波シールド板を組
み込むような場合には、ターミナルのための穴を
加工したり、周辺を複雑な形状に切断する必要が
あり、しかも加工した金属板を絶縁性材上に正確
に位置ぎめして張り合わさなければならないとい
う製造工程上の問題点があつた。However, when incorporating electromagnetic shielding plates into electrical products that require more compactness, such as video cameras, video cameras, televisions, transceivers, tuners, audio equipment, computers, etc., holes for terminals must be machined. However, there were problems in the manufacturing process in that the periphery had to be cut into a complicated shape, and the processed metal plate had to be precisely positioned and pasted onto the insulating material.
（問題点を解決するための手段）
本考案は電磁波シールド効果を有する層をシル
クスクリーン印刷により設けることにより、金属
板を加工することの問題点を解決したものであ
る。すなわち、本考案は、絶縁性プラスチツク
板、電磁波不透過性の接着材層、絶縁性プラスチ
ツク板からなる所定形状およびスルーホールを有
する積層物であつて、該積層物の周辺部および該
スルーホールの周辺部は、縁から所定の巾だけ上
記電磁波不透過性層が除去されてなり、上記電磁
波不透過性の接着材層は、シルクスクリーン印刷
により所定の形状に形成してあるこをを特徴とす
る上記電磁波シールド板である。
(Means for Solving the Problems) The present invention solves the problems of processing metal plates by providing a layer having an electromagnetic wave shielding effect by silk screen printing. That is, the present invention provides a laminate having a predetermined shape and a through hole, comprising an insulating plastic plate, an electromagnetic wave-impermeable adhesive layer, and an insulating plastic plate, the laminate having a predetermined shape and a through hole. The peripheral portion is formed by removing the electromagnetic wave-impermeable layer by a predetermined width from the edge, and the electromagnetic wave-impermeable adhesive layer is formed into a predetermined shape by silk screen printing. This is the electromagnetic shielding plate mentioned above.
以下、本考案を図面に基づいて説明する。 Hereinafter, the present invention will be explained based on the drawings.
第１図は本考案の電磁波シールド板の平面図で
あり、第２図は第１図ａ−a′の断面図を示したも
のである。 FIG. 1 is a plan view of the electromagnetic shielding plate of the present invention, and FIG. 2 is a sectional view taken along line aa' in FIG.
本考案の電磁波シールド板は、絶縁性プラスチ
ツク板１、電磁波不透過性の接着材層２および絶
縁性プラスチツク板１′からる積層物である。積
層物の所定の位置にはターミナルのための、ある
いはシールド板取りつけ用のスルーホール３が設
けてある。積層物の外周部４およびスルーホール
周辺部５は、縁から一定の巾で電磁波不透過性層
が除去されている。電磁波不透過性層の除去部
４，５は、導電性である印刷層からの絶縁を完全
にするために設けられ、巾としては２mm〜１cmが
好ましい。除去部４，５は、絶縁性プラスチツク
板１と１′が熱融着により直接的に接合すること
が好ましい。 The electromagnetic shielding plate of the present invention is a laminate comprising an insulating plastic plate 1, an electromagnetic wave-impermeable adhesive layer 2, and an insulating plastic plate 1'. A through hole 3 for a terminal or for attaching a shield plate is provided at a predetermined position of the laminate. The electromagnetic wave impermeable layer is removed by a certain width from the edge of the outer circumferential portion 4 of the laminate and the peripheral portion 5 of the through hole. The removed portions 4 and 5 of the electromagnetic wave-impermeable layer are provided to completely insulate the electroconductive printed layer, and preferably have a width of 2 mm to 1 cm. It is preferable that the removed parts 4 and 5 are such that the insulating plastic plates 1 and 1' are directly joined by heat fusion.
また、電磁波シールド板の電位を回路のアース
ラインと等しくするために絶縁性板１もしくは
１′の一部から接着材層２を露出させ、この露出
部６をアースラインに接続するように形成しても
良い。 In addition, in order to equalize the potential of the electromagnetic shielding plate with the earth line of the circuit, the adhesive layer 2 is exposed from a part of the insulating plate 1 or 1', and this exposed portion 6 is formed so as to be connected to the earth line. It's okay.
本考案において絶縁性のプラスチツク板１，
１′は、硬質塩化ビニル樹脂、ポリエステル樹脂、
ポリカーボネート樹脂、アクリル樹脂等の樹脂フ
イルムであつて、厚さ0.1〜１mm程度のものが使
用される。 In the present invention, an insulating plastic board 1,
1' is hard vinyl chloride resin, polyester resin,
A resin film made of polycarbonate resin, acrylic resin, etc. and having a thickness of about 0.1 to 1 mm is used.
本考案において電磁波不透過性の接着材層２
は、導電性の皮膜を形成することのできる導電性
インキをシルクスクリーン印刷により、所定形状
に印刷したものである。導電性インキは、ニツケ
ル、銅、炭素、鉄、銀、金等の導電性の微粉とア
クリル樹脂、ウレタン樹脂、ポリエステル樹脂等
の熱可塑性のバインダー樹脂に配合したものか、
あるいは熱硬化型あるいは紫外線硬化型のモノマ
ーに配合し、スクリーン印刷適性を持たせたもの
である。接着材層２は、導電性インキを絶縁性プ
ラスチツク板１上に直にシルクスクリーン印刷す
ることにより形成することができる。シルクスク
リーン印刷層は予め定められたパターンにベタ印
刷するか、もしくは格子状等の模様に印刷しても
良い。印刷層の厚さは10〜200μが好ましい。 In the present invention, the electromagnetic wave-impermeable adhesive layer 2
is printed in a predetermined shape by silk screen printing with conductive ink that can form a conductive film. Conductive ink is a combination of conductive fine powder such as nickel, copper, carbon, iron, silver, or gold and thermoplastic binder resin such as acrylic resin, urethane resin, or polyester resin.
Alternatively, it is blended with a thermosetting or ultraviolet curable monomer to make it suitable for screen printing. The adhesive layer 2 can be formed by silk screen printing a conductive ink directly onto the insulating plastic plate 1. The silk screen printing layer may be printed solidly in a predetermined pattern, or may be printed in a pattern such as a grid. The thickness of the printed layer is preferably 10 to 200μ.
導電性の印刷を施された絶縁性のプラスチツク
板１を他のプラスチツク板１′と積層するには、
熱可塑性のバインダー樹脂を用いた場合には熱圧
着することにより、また、硬化性のバインダーを
用いた場合にはバインダーが未硬化のうちに２枚
のプラスチツク板を重ねて、紫外線、熱等を作用
させればよい。 To laminate an insulating plastic board 1 with conductive printing with another plastic board 1',
When a thermoplastic binder resin is used, it is heat-compressed, or when a curable binder is used, two plastic plates are placed on top of each other while the binder is still uncured, and exposed to ultraviolet rays, heat, etc. Just let it work.
厚さ0.5mmの硬質塩化ビニル樹脂シートの一方
の面に、熱可塑性ポリエステルをバインダーとす
るニツケル粉含有（ニツケル含有率はインキ固形
分の80重量％）導電性インキを用いて乾燥皮膜
50μになるようにシルクスクリーン印刷法により
ベタ印刷層し、この上に厚さ0.1mmの硬質塩化ビ
ニル樹脂シートを積層し、導電性印刷層と熱圧着
して電磁波シールド板を得た。
Dry film on one side of a 0.5 mm thick hard vinyl chloride resin sheet using conductive ink containing nickel powder (nickel content is 80% by weight of ink solids) with thermoplastic polyester as a binder.
A solid printed layer with a thickness of 50 μm was formed by silk screen printing, and a hard vinyl chloride resin sheet with a thickness of 0.1 mm was laminated on this layer, and the electromagnetic shielding plate was obtained by thermocompression bonding with the conductive printed layer.
この構成からなる電磁波シールド板は、500Mz
において50dbの電磁波シールド効果が得られた。 The electromagnetic wave shielding plate with this configuration is 500Mz
An electromagnetic shielding effect of 50db was obtained.
本考案の電磁波シールド板は、電磁波不透過性
層あるいは絶縁性材料の接着材をシルクスクリー
ン印刷により形成するため、金属板もしくは金属
箔を加工する必要がなく、製造工程上有利であ
る。また、電磁波不透過性層を複雑なパターンと
することも容易である。
The electromagnetic shielding plate of the present invention has an electromagnetic wave impermeable layer or an insulating material adhesive formed by silk screen printing, so there is no need to process a metal plate or metal foil, which is advantageous in terms of manufacturing process. Furthermore, it is easy to form the electromagnetic wave-opaque layer into a complicated pattern.
第１図は本考案の電磁波シールド板の平面図、
第２図は第１図のａ−a′における断面図である。
１，１′……絶縁性プラスチツク板、２……電
磁波不透過性の接着材層、３……スルーホール、
４，５……電磁波不透過性層の除去部。
Figure 1 is a plan view of the electromagnetic shielding plate of the present invention.
FIG. 2 is a sectional view taken along line a-a' in FIG. 1, 1'... Insulating plastic plate, 2... Electromagnetic wave impermeable adhesive layer, 3... Through hole,
4, 5... Removal part of electromagnetic wave impermeable layer.
Claims (1)
材層、絶縁性プラスチツク板からなる所定形状お
よびスルーホールを有する積層物であつて、該積
層物の周辺部および該スルーホールの周辺部は、
縁から所定の巾だけ上記電磁波不透過性層が除去
されてなり、上記電磁波不透過性の接着材層は、
導電性の粉体をバインダー樹脂に配合した無溶剤
型の導電性インキをシルクスクリーン印刷により
所定の形状に印刷してなることを特徴とする上記
電磁波シールド板。 A laminate comprising an insulating plastic plate, an electromagnetic wave-impermeable adhesive layer, and an insulating plastic plate having a predetermined shape and a through hole, the periphery of the laminate and the periphery of the through hole comprising:
The electromagnetic wave-impermeable layer is removed by a predetermined width from the edge, and the electromagnetic wave-impermeable adhesive layer is
The above-mentioned electromagnetic shielding plate is made by printing a solvent-free conductive ink containing conductive powder in a binder resin into a predetermined shape by silk screen printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11652585U JPH0214232Y2 (en) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11652585U JPH0214232Y2 (en) | 1985-07-31 | 1985-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6226099U JPS6226099U (en) | 1987-02-17 |
| JPH0214232Y2 true JPH0214232Y2 (en) | 1990-04-18 |
Family
ID=31001198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11652585U Expired JPH0214232Y2 (en) | 1985-07-31 | 1985-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0214232Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710557Y2 (en) * | 1989-03-31 | 1995-03-08 | 三洋電機株式会社 | Noise shield device for printed circuit boards |
| SE518428C2 (en) * | 1998-04-27 | 2002-10-08 | Ericsson Telefon Ab L M | Custom conductive layer |
-
1985
- 1985-07-31 JP JP11652585U patent/JPH0214232Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226099U (en) | 1987-02-17 |
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