JPH0140232Y2 - - Google Patents
Info
- Publication number
- JPH0140232Y2 JPH0140232Y2 JP1983197816U JP19781683U JPH0140232Y2 JP H0140232 Y2 JPH0140232 Y2 JP H0140232Y2 JP 1983197816 U JP1983197816 U JP 1983197816U JP 19781683 U JP19781683 U JP 19781683U JP H0140232 Y2 JPH0140232 Y2 JP H0140232Y2
- Authority
- JP
- Japan
- Prior art keywords
- foil
- present
- housing
- electrical
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000002648 laminated material Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000009408 flooring Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Floor Finish (AREA)
Description
【考案の詳細な説明】
本考案は電磁波シールド性を有する床敷材に関
する。[Detailed Description of the Invention] The present invention relates to a flooring material having electromagnetic wave shielding properties.
既に周知の如く、近年のエレクトロニクスの発
展に伴なつて多くの電気・電子機器が使われるよ
うになり、これら電気・電子機器自体又は他の機
械装置から発生する電磁波の他の電気・電子機器
への影響が問題となつている。同時に各種機器類
の合成樹脂化が進んでいるため、合成樹脂の導電
性化、電磁気シールド性付与が要望されている。 As is already well known, with the development of electronics in recent years, many electrical and electronic devices are being used, and electromagnetic waves generated from these electrical and electronic devices themselves or other mechanical devices can be transmitted to other electrical and electronic devices. The impact of this is becoming a problem. At the same time, as the use of synthetic resins for various types of equipment is progressing, there is a demand for synthetic resins to be electrically conductive and provide electromagnetic shielding properties.
この要望に対処するため、本考案者等は高導電
率の金属薄板又は箔を用いたシート状の電磁波シ
ールド材料について検討を重ねて来た。その成果
の一部分は、例えば、実開昭58−29983号公報、
あるいは実開昭58−66693号公報に見るように、
既に公知である。 In order to meet this demand, the inventors of the present invention have repeatedly investigated sheet-shaped electromagnetic shielding materials using thin metal plates or foils with high conductivity. Some of the results are, for example, published in Utility Model Application Publication No. 58-29983,
Or, as seen in Japanese Utility Model Application Publication No. 58-66693,
It is already publicly known.
これらのシート状の電磁波シールド材料は、導
電性カーボンブラツクや金属フイラーを混合した
塗料型もしくは成型用樹脂型の材料に比べて優れ
た電磁波シールド性能を持つこと(特に、特願昭
58−93737号に記載された電磁波遮蔽材料は、厚
さ100μのもので、1mm以上の銅板や鉄板に匹適
する)、及び可撓性があること、切断が容易であ
ること、深さ1〜2cm程度の容器状に深絞り成型
できることなどの加工性の点で銅板や鉄板等に比
べても優れていた。そこでこれらの電磁波シール
ド材料は、電気・電子機器のハウジングの内面や
外面に貼着したり、電磁波シールドルームの壁面
や天井に貼着したりして使用するのには適してい
たが、高導電性金属薄板又は箔をプラスチツクフ
イルムや紙もしくは布等と積層した積層材料より
構成されているので、電気・電子機器のハウジン
グの底部外面に貼着してもこのハウジングの衝撃
に対する保護には役に立たなかつた。また、シー
ルドルームの床敷材として用いた場合には、いか
にも冷え冷えとして、なじみ難いものがあつた。 These sheet-shaped electromagnetic wave shielding materials have superior electromagnetic wave shielding performance compared to paint-type or molding resin-type materials mixed with conductive carbon black or metal fillers (in particular, the
The electromagnetic wave shielding material described in No. 58-93737 has a thickness of 100μ and is suitable for copper plates or iron plates of 1 mm or more), is flexible, easy to cut, and has a depth of 1 to 1 mm. It was superior to copper plates, iron plates, etc. in terms of workability, such as being able to be deep-drawn into a container shape of about 2 cm. Therefore, these electromagnetic shielding materials were suitable for use by pasting them on the inner and outer surfaces of the housings of electrical and electronic equipment, or on the walls and ceilings of electromagnetic shielding rooms, but they were highly conductive. It is made of a laminated material in which a thin metal plate or foil is laminated with plastic film, paper, cloth, etc., so even if it is attached to the bottom outer surface of the housing of electrical/electronic equipment, it is useless to protect the housing from impact. Ta. Furthermore, when it was used as a floor covering for a shielded room, it was extremely cold and difficult to get used to.
本考案はこのように事情に鑑みてなされたもの
で、電気・電子機器のハウジングの底部外面に貼
着して、優れた電磁波シールド性能と共に、豊か
なクツシヨン性によるハウジングの保護が可能な
保護材料を提供することを目的としている。ま
た、本考案の保護材料は、ハウジングの底部外面
に接着する代わりに、このハウジングを設置すべ
き床に敷いても良いし、シールドルームの床敷材
として用いても良い。 The present invention was developed in light of the above circumstances, and is a protective material that can be attached to the bottom outer surface of the housing of electrical and electronic equipment to protect the housing with excellent electromagnetic shielding performance and rich cushioning properties. is intended to provide. Furthermore, instead of being adhered to the outer surface of the bottom of the housing, the protective material of the present invention may be spread on the floor on which the housing is installed, or may be used as a floor covering for a shielded room.
すなわち、本考案は高導電性を有する金属薄板
又は箔、又はこの金属薄板又は箔を含む積層材料
の表面に、起毛状シートを接着し、裏面に接着剤
層を介してシーラント層を設けることを特徴とす
る電磁波シールド性を有する保護材料である。 That is, the present invention involves adhering a raised sheet to the surface of a highly conductive metal thin plate or foil, or a laminated material containing this metal thin plate or foil, and providing a sealant layer on the back side via an adhesive layer. It is a protective material with a characteristic electromagnetic wave shielding property.
本考案において、高導電性金属薄板又は箔とし
ては、厚さ9μ以上の電解銅箔、又は15〜150μの
電気鋳造法により作成した純度99.95%以上の電
鋳鉄箔又はこの電鋳鉄箔の片面又は両面を金、
銀、銅、錫、鉛、亜鉛、クロム、ニツケル等の異
種金属でメツキして成るフオイルが好ましいが、
この外、アニール加工した圧延鉄箔も使用でき
る。 In the present invention, the highly conductive metal thin plate or foil is an electrolytic copper foil with a thickness of 9μ or more, an electroformed iron foil with a purity of 99.95% or more made by electroforming with a thickness of 15 to 150μ, or one side of this electrocast iron foil or gold on both sides,
Preferably, the foil is plated with different metals such as silver, copper, tin, lead, zinc, chromium, nickel, etc.
In addition, annealed rolled iron foil can also be used.
また、高導電性金属薄板又は箔を含む積層材料
としては、上記電解銅箔とメツキされた又はメツ
キされていない電鋳鉄箔とを、間に絶縁性シート
を介在させて積層した積層体が使用できる。 In addition, as a laminated material containing a highly conductive metal thin plate or foil, a laminate is used in which the electrolytic copper foil and plated or unplated electrocast iron foil are laminated with an insulating sheet interposed between them. can.
また、起毛状シートとしては起毛布の外、フエ
ルト等が使用できる。 Further, as the raised sheet, in addition to raised cloth, felt or the like can be used.
以下、図面を参照して本考案を説明する。図面
はいずれも本考案の実施例を示すもので、第1図
は保護材料の断面図である。 Hereinafter, the present invention will be explained with reference to the drawings. The drawings all show embodiments of the present invention, and FIG. 1 is a sectional view of the protective material.
第1図において、1は上記起毛状シート、3は
高導電性を有する金属薄板又は箔、又はこの金属
薄板又は箔を含む積層材料(以下「金属材料」と
呼ぶ)を示している。2はこの両者を積層するた
めの接着剤層であつて、ウレタン系接着剤、エポ
キシ系接着剤などから成る。 In FIG. 1, 1 indicates the above-mentioned raised sheet, 3 indicates a highly conductive metal thin plate or foil, or a laminated material (hereinafter referred to as "metal material") containing this metal thin plate or foil. Reference numeral 2 denotes an adhesive layer for laminating these two layers, and is made of a urethane adhesive, an epoxy adhesive, or the like.
また、5は電気・電子機器のハウジングやシー
ルドルームの床面に熱融着するためのシーラント
層であり、このシーラント層5はウレタン系又は
エポキシ系等の接着剤層4を介して金属材料3に
積層されている。なお、このシーラント層5とし
ては、ポリエチレンやポリプロピレン等のポリオ
レフイン系樹脂、エチレン−(メタ)アクリル酸
エステル共重合体やエチレン−酢酸ビニル共重合
体などのポリオレフイン系共重合体、不飽和カル
ボン酸でグラフト変性したポリオレフインやアイ
オノマーなどの変性ポリオレフイン樹脂、ポリ塩
化ビニル、ナイロン、ポリエステルなど、熱可塑
性樹脂ならいずれのものでも使用できる。 Further, 5 is a sealant layer for heat-sealing the housing of electrical/electronic equipment or the floor of a shield room, and this sealant layer 5 is attached to the metal material 3 through an adhesive layer 4 such as urethane or epoxy. are laminated on. The sealant layer 5 may be made of polyolefin resin such as polyethylene or polypropylene, polyolefin copolymer such as ethylene-(meth)acrylate copolymer or ethylene-vinyl acetate copolymer, or unsaturated carboxylic acid. Any thermoplastic resin can be used, including modified polyolefin resins such as graft-modified polyolefins and ionomers, polyvinyl chloride, nylon, and polyester.
本考案は以上のような構成であり、優れた電磁
波シールド性能を有すると共に、起毛状シートの
クツシヨン性によるハウジングの保護が可能とな
り、またシールドルームの床敷材として用いても
あたたかみのあるものである。また、可撓性があ
つて切断が容易である等加工性にも優れている
が、裏面にシーラント層を有するので、電気・電
子機器に適用する際にも、床面に適用する際に
も、一層その施工が容易であるという利点を有す
る。 The present invention has the above-mentioned structure, and not only has excellent electromagnetic shielding performance, but the cushioning properties of the brushed sheet can protect the housing, and it also provides warmth when used as a flooring material for shielded rooms. It is. It also has excellent workability, such as being flexible and easy to cut, but it also has a sealant layer on the back, so it can be used in electrical and electronic equipment as well as on floors. , which has the advantage of being easier to construct.
図面は本考案の実施例を示し、第1図は本考案
の保護材料の断面図である。
1……起毛状シート、2,4……接着剤層、3
……金属材料、5……シーラント層。
The drawings show embodiments of the present invention, and FIG. 1 is a cross-sectional view of the protective material of the present invention. 1...Napped sheet, 2, 4...Adhesive layer, 3
...Metal material, 5...Sealant layer.
Claims (1)
属薄板又は箔を含む積層材料の表面に、起毛状シ
ートを接着し、裏面に接着剤層を介してシーラン
ト層を設けることを特徴とする電磁波シールド性
を有する保護材料。 An electromagnetic shield characterized by adhering a raised sheet to the surface of a highly conductive thin metal plate or foil, or a laminated material containing this thin metal plate or foil, and providing a sealant layer on the back side via an adhesive layer. A protective material with properties.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19781683U JPS60106397U (en) | 1983-12-22 | 1983-12-22 | Protective material with electromagnetic shielding properties |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19781683U JPS60106397U (en) | 1983-12-22 | 1983-12-22 | Protective material with electromagnetic shielding properties |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60106397U JPS60106397U (en) | 1985-07-19 |
JPH0140232Y2 true JPH0140232Y2 (en) | 1989-12-01 |
Family
ID=30756307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19781683U Granted JPS60106397U (en) | 1983-12-22 | 1983-12-22 | Protective material with electromagnetic shielding properties |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60106397U (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5552341U (en) * | 1978-10-05 | 1980-04-07 |
-
1983
- 1983-12-22 JP JP19781683U patent/JPS60106397U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60106397U (en) | 1985-07-19 |
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