JPS61195179A - Anisotropically conductive adhesive sheet - Google Patents
Anisotropically conductive adhesive sheetInfo
- Publication number
- JPS61195179A JPS61195179A JP3577685A JP3577685A JPS61195179A JP S61195179 A JPS61195179 A JP S61195179A JP 3577685 A JP3577685 A JP 3577685A JP 3577685 A JP3577685 A JP 3577685A JP S61195179 A JPS61195179 A JP S61195179A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin layer
- adhesive sheet
- conductive adhesive
- softening point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、液晶表示装置と駆動モジュールを電気的に接
続するなど、高密度な端子リードを有する2つの電気部
品を電気的に接続する時に用いることのできる異方導電
性接着シートに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is used to electrically connect two electrical components having high-density terminal leads, such as electrically connecting a liquid crystal display device and a drive module. The present invention relates to an anisotropically conductive adhesive sheet that can be used as an anisotropically conductive adhesive sheet.
従来の技術
近年、液晶表示装置の発展はめざましく、それら液晶表
示装置と駆動モジュールを電気的に接続する方法も種々
の検討がなされ、しばしば異方導電性接着シートが用い
られている。2. Description of the Related Art In recent years, the development of liquid crystal display devices has been remarkable, and various methods of electrically connecting these liquid crystal display devices and drive modules have been studied, and anisotropically conductive adhesive sheets are often used.
第3図は従来の異方導電性接着シートを示す断面図であ
る。第3図において、1は熱可塑性樹脂または熱可塑性
樹脂と熱硬化性樹脂とからなる結合剤、2は導電性粉体
であり、この導電性粉体2を結合剤1中に分散させ、シ
ート状に加熱乾燥させて異方導電性接着シート3を得て
いる。第4図はこのような従来の異方導電性接着シート
3を用いて、液晶表示装置と駆動モジュールを接続した
状態を示す断面図である。第4図において、4は液晶表
示装置を構成するガラス基板、6はガラス基板4上に設
けられた透明電極、6は駆動モジュールをつなぐフレキ
シブル基板(以下FPCという)、7は上記ガラス基板
4間に挿入された液晶(図示せず)を封入するためのシ
ール樹脂である。FIG. 3 is a sectional view showing a conventional anisotropically conductive adhesive sheet. In Fig. 3, 1 is a binder made of a thermoplastic resin or a thermoplastic resin and a thermosetting resin, and 2 is a conductive powder.The conductive powder 2 is dispersed in the binder 1, and the sheet is The anisotropically conductive adhesive sheet 3 is obtained by heating and drying the adhesive sheet 3. FIG. 4 is a sectional view showing a state in which a liquid crystal display device and a drive module are connected using such a conventional anisotropically conductive adhesive sheet 3. In FIG. 4, 4 is a glass substrate constituting a liquid crystal display device, 6 is a transparent electrode provided on the glass substrate 4, 6 is a flexible substrate (hereinafter referred to as FPC) that connects the drive module, and 7 is a space between the glass substrates 4. This is a sealing resin for enclosing a liquid crystal (not shown) inserted into the housing.
発明が解決しようとする問題点
上記のような構造では、液晶表示装置の透明電極が第4
図に示すように完全に被覆されず、露出した状態となり
、また透明電極と接続されるFPCの導体部も露出した
状態となり、ゴミなどの付着によるショートや、透明電
極の湿中におけるショート断線などが起るという欠点を
有していた。Problems to be Solved by the Invention In the above structure, the transparent electrode of the liquid crystal display device is
As shown in the figure, it is not completely covered and is exposed, and the conductor part of the FPC connected to the transparent electrode is also exposed, resulting in short-circuits due to adhesion of dust, etc., short-circuit breakage of the transparent electrodes in humidity, etc. It had the disadvantage of causing
本発明はこのような従来の欠点を除去しようとするもの
であり、液晶表示装置の透明電極とFPCの導体部の絶
縁保護を電気的接続と同時に行うことのできる異方導電
性接着シートを提供することを目的とするものである。The present invention aims to eliminate such conventional drawbacks, and provides an anisotropically conductive adhesive sheet that can perform insulation protection of the transparent electrode of a liquid crystal display device and the conductor part of an FPC at the same time as electrical connection. The purpose is to
問題点を解決するための手段
この問題点を解決するために本発明の異方導電性接着シ
ートは、離型効果を有する柔軟性フィルムの一生面に、
絶縁性の第1の合成樹脂層と、この第1の合成樹脂層の
上に導電性粉体を含む上記第1の合成樹脂層よりも軟化
点の高い第2の合成樹脂層を形成したことを特徴とする
ものである。Means for Solving the Problem In order to solve this problem, the anisotropic conductive adhesive sheet of the present invention has a flexible film having a release effect, and
An insulating first synthetic resin layer and a second synthetic resin layer containing conductive powder and having a higher softening point than the first synthetic resin layer are formed on the first synthetic resin layer. It is characterized by:
作 用
この構成により、例えば液晶表示装置とFPCの接続に
おいて、軟化点の高い導電性粉体を含む第2の合成樹脂
層で電気的接続を行い、軟化点の低い絶縁性の第1の合
成樹脂層で液晶表示装置の透明電極とFPCの導体部の
絶縁保護を行うことができることとなる。With this configuration, for example, in connection between a liquid crystal display device and an FPC, electrical connection is made with the second synthetic resin layer containing conductive powder with a high softening point, and the first synthetic resin layer with insulating properties with a low softening point is connected. The resin layer can provide insulation protection for the transparent electrode of the liquid crystal display device and the conductor portion of the FPC.
実施例
以下、図面を参照しながら本発明の一実施例について説
明する。Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第2図は本発明の異方導電性接着シートの一実施例を示
す断面図である。第2図において、8は離型処理を施し
た柔軟性フィルム、9は上記フィルム8の一生面に形成
された絶縁性を有する第1の合成樹脂層であり、例えば
軟化点120℃以下のポリエステル樹脂としてバイロン
GK−130〔東洋紡績(株)製〕を用いることができ
る。10は上記第1の合成樹脂層9の上に形成された導
電性粉体11を分散させてなる第2の合成樹脂層であり
、この第2の合成樹脂層10の軟化点は上記第1の合成
樹脂M9のそれよりも高いものとなっている。この第2
の合成樹脂層1oとしては、例えば軟化点が120〜1
80℃のポリエステル樹脂としてバイロンGK−103
(東洋紡績(株)製〕を用いることができ、また導電性
粉体11としては酸化スズT−1〔三菱金属(株)製〕
を用いることができる。この導電性粉体11としては、
金属粉、カーボン粉などを用いることもできる。FIG. 2 is a sectional view showing an embodiment of the anisotropically conductive adhesive sheet of the present invention. In FIG. 2, 8 is a flexible film subjected to mold release treatment, and 9 is a first synthetic resin layer having insulation properties formed on the entire surface of the film 8, such as polyester having a softening point of 120° C. or lower. Vylon GK-130 (manufactured by Toyobo Co., Ltd.) can be used as the resin. 10 is a second synthetic resin layer formed on the first synthetic resin layer 9 and made by dispersing conductive powder 11, and the softening point of this second synthetic resin layer 10 is equal to the softening point of the first synthetic resin layer 9. It is higher than that of synthetic resin M9. This second
For example, the synthetic resin layer 1o has a softening point of 120 to 1
Byron GK-103 as polyester resin at 80℃
(manufactured by Toyobo Co., Ltd.) can be used, and as the conductive powder 11, tin oxide T-1 (manufactured by Mitsubishi Metals Co., Ltd.) can be used.
can be used. As this conductive powder 11,
Metal powder, carbon powder, etc. can also be used.
第1図は上述した本発明の異方導電性接着シートを用い
て、液晶表示装置の引出し用透明電極と引出し用FPC
を接続した状態を示す断面図である。第1図において、
12は液晶表示装置を構成するガラス基板、13は上記
ガラス基板12上に設けられた引出し用透明電極、14
は引出し用FPC(フレキシブル基板)であり、例えば
38μm厚のポリエチレンテレフタレートに市販導電ペ
ーストをスクリーン印刷により条状に形成したものでよ
く、蒸着法などにより形成された金属膜も導体部として
使用できる016は液晶を封入するためのシール樹脂、
16は接続する際に用いる加熱圧着ツールである。FIG. 1 shows a transparent electrode for a lead-out of a liquid crystal display device and an FPC for a lead-out using the anisotropically conductive adhesive sheet of the present invention described above.
FIG. 3 is a cross-sectional view showing a connected state. In Figure 1,
12 is a glass substrate constituting a liquid crystal display device; 13 is a transparent lead-out electrode provided on the glass substrate 12; 14
016 is an FPC (flexible board) for drawers, and may be formed by screen printing commercially available conductive paste on polyethylene terephthalate with a thickness of 38 μm, for example, and a metal film formed by vapor deposition or the like can also be used as the conductor part. is a sealing resin for enclosing the liquid crystal,
Reference numeral 16 denotes a heat compression bonding tool used for connection.
今、第2図のように構成された異方導電性接着シートを
上記FPC14に160℃、3oK4/cd。Now, the anisotropically conductive adhesive sheet configured as shown in FIG. 2 is placed on the FPC 14 at 160°C and 3oK4/cd.
6秒で仮固定した後、上記柔軟性フィルム8をはがし、
液晶表示装置の引出し用透明電極13へ相対するFPC
14の導体部を位置合せし、FPC14の一端部をガラ
ス基板12に160C、30に4/cIIF、4s秒で
加熱圧着ツール16を用いて加熱圧着した。この圧着で
、軟化点の低い絶縁性の第1の合成樹脂層9が流れ出し
、第1図に示すようにこの第1の合成樹脂層9が接続部
周辺の透明電極13の表面を被覆し保護しているの°が
顕微鏡により観察された。もちろん、上記第1の合成樹
脂層9はFPC14の一端部以外では、そのFPC14
の必要箇所に第2の合成樹脂層10と共に固定されてい
る。一方、導電性粉体10を分散させ7’(第2の合成
樹脂層10により、透明電極13とFPC14の導体部
との電気的接続、および透明電極13とFPC14との
機械的接続が得られた。After temporarily fixing for 6 seconds, peel off the flexible film 8,
FPC facing transparent electrode 13 for extraction of liquid crystal display device
14 conductor parts were aligned, and one end of the FPC 14 was heat-pressed to the glass substrate 12 at 160C, 30:4/cIIF, and 4 seconds using the heat-pressure bonding tool 16. By this crimping, the insulating first synthetic resin layer 9 with a low softening point flows out, and as shown in FIG. 1, this first synthetic resin layer 9 covers and protects the surface of the transparent electrode 13 around the connection part. It was observed using a microscope. Of course, the first synthetic resin layer 9 is formed on the FPC 14 other than at one end of the FPC 14.
It is fixed together with the second synthetic resin layer 10 at necessary locations. On the other hand, the conductive powder 10 is dispersed 7' (the second synthetic resin layer 10 provides an electrical connection between the transparent electrode 13 and the conductor part of the FPC 14, and a mechanical connection between the transparent electrode 13 and the FPC 14). Ta.
そして、湿中負荷〔40℃×76%RH,DCav)6
oo時間でも、透明電極13の断線、ショート社主じな
いことが確認された。And humidity load [40℃×76%RH, DCav)6
Even at the oo time, it was confirmed that the transparent electrode 13 was not disconnected and the short circuit was not caused.
また、本発明の異方導電性接着シートを用いてFPC表
面へラミネート(80’C、2m /min )し、パ
ターン表面の絶縁抵抗を測定するとlX10”Ω以上の
数値が得られ、パターン表面の絶縁被覆を行うことがで
きた。Furthermore, when the anisotropically conductive adhesive sheet of the present invention was laminated onto the surface of an FPC (80'C, 2m/min) and the insulation resistance of the pattern surface was measured, a value of 1 x 10''Ω or more was obtained, and the insulation resistance of the pattern surface was measured. We were able to apply insulation coating.
以上の説明より明らかなように本発明の異方導電性接着
シートの特徴は、第1の1合成樹脂層の軟化点と第2の
合成樹脂層の軟化点とに差を有することであり、上述し
たように第2の合成樹脂層の軟化点を第1の合成樹脂層
のそれよりも高いものとしている。また、第1の合成樹
脂層は軟化点が8C)C未満になると製品に使用した時
の耐久性に問題が生じ易く、同様に第2の合成樹脂層は
軟化点が180℃を超えると加圧加熱時の熱が他の電気
部品に影響を及ぼし易いことが確認された。そして、そ
の中で発明者らの研究の結果、第1と第2の合成樹脂層
は軟化点の差が10〜30’Cあるものが良好な結果を
示すことが明らかとなった。As is clear from the above description, the feature of the anisotropic conductive adhesive sheet of the present invention is that there is a difference in the softening point of the first synthetic resin layer and the softening point of the second synthetic resin layer, As mentioned above, the softening point of the second synthetic resin layer is higher than that of the first synthetic resin layer. In addition, if the first synthetic resin layer has a softening point of less than 8C), problems tend to occur in durability when used in products, and similarly, if the second synthetic resin layer has a softening point of over 180C, it will not be heated. It was confirmed that the heat during pressure heating tends to affect other electrical components. As a result of research conducted by the inventors, it has become clear that the first and second synthetic resin layers having a difference in softening point of 10 to 30'C show good results.
なお、第1.第2の合成樹脂層としては、上記実施例で
も用いた熱可塑性樹脂としてのポリエステル樹脂が適し
ていることが確認された。In addition, 1. It was confirmed that polyester resin, which is a thermoplastic resin used in the above examples, is suitable for the second synthetic resin layer.
発明の効果
以上の説明から明らかなように、本発明の異方導電性接
着シートを用いることにより、軟化点の高い導電性粉体
を含む第2の合成樹脂層で例えば液晶表示装置と引出し
用FPCの接続において電気的接続を行い、同時に軟化
点の低い絶縁性の第1の合成樹脂層で液晶表示装置の透
明電極とFPCの導体部の絶縁保護を行うことができる
こととなる。例えば、従来の異方導電性接着シートを用
いた場合には、湿中負荷(40℃×95%RH。Effects of the Invention As is clear from the above explanation, by using the anisotropically conductive adhesive sheet of the present invention, the second synthetic resin layer containing conductive powder with a high softening point can be used for, for example, liquid crystal display devices and drawers. Electrical connection can be made when connecting the FPC, and at the same time, the transparent electrode of the liquid crystal display device and the conductor portion of the FPC can be insulated and protected using the insulating first synthetic resin layer with a low softening point. For example, when a conventional anisotropically conductive adhesive sheet is used, a humidity load (40°C x 95%RH) is applied.
DCaV)100時間で70〜80%の透明電極に断線
シ目−トが生じ、これを防止するために従来では、液晶
表示全体を密閉するかまたは接着部以外の透明電極を絶
縁被覆しなければならなかった。しかしながら、本発明
の異方導電性接着シートを用いることにより、電気的接
続と同時に透明電極の絶縁保護被膜をつくることができ
、液晶表示装置の信頼上の向上1作業工程の削減および
経費の削減などの効果が得られる。さらに、FPCの導
体表面を本発明の異方導電性接着シートで被覆すること
により、FPC表面の絶縁保護が行え、ごみなどによる
ショートを防止する効果が得られるものである。DCaV) After 100 hours, 70 to 80% of the transparent electrodes will break, and in order to prevent this, conventional methods have required either sealing the entire liquid crystal display or covering the transparent electrodes other than the bonded areas with insulation. did not become. However, by using the anisotropic conductive adhesive sheet of the present invention, it is possible to create an insulating protective film for transparent electrodes at the same time as electrical connection, thereby improving the reliability of liquid crystal display devices. 1. Reducing work steps and costs. Effects such as this can be obtained. Furthermore, by covering the conductor surface of the FPC with the anisotropically conductive adhesive sheet of the present invention, insulation protection of the FPC surface can be performed, and an effect of preventing short circuits caused by dust or the like can be obtained.
第1図は本発明の異方導電性接着シートを用いた液晶表
示装置とFPCの接続状態を示す断面図、第2図は本発
明の異方導電性接着シートの一実施例を示す断面図、第
3図は従来の異方導電性接着シートを示す断面図、第4
図は同接着シートを用いた液晶表示装置とFPCの接続
状態を示す断面図である。
8・・・・・・柔軟性フィルム、9・・・・・・第1の
合成樹脂層、1o・・・・・・第2の合成樹脂層、11
・・・・・・導電性粉体。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名11
、−8導を寸生に諺ト
第2図
lFIG. 1 is a sectional view showing a connection state between a liquid crystal display device and an FPC using the anisotropically conductive adhesive sheet of the present invention, and FIG. 2 is a sectional view showing an embodiment of the anisotropically conductive adhesive sheet of the present invention. , Figure 3 is a sectional view showing a conventional anisotropically conductive adhesive sheet, Figure 4 is a cross-sectional view showing a conventional anisotropically conductive adhesive sheet.
The figure is a cross-sectional view showing a connection state between a liquid crystal display device and an FPC using the same adhesive sheet. 8... Flexible film, 9... First synthetic resin layer, 1o... Second synthetic resin layer, 11
・・・・・・Conductive powder. Name of agent: Patent attorney Toshio Nakao and 1 other person11
, Figure 2 of the proverb based on the -8 guide.
Claims (2)
縁性の第1の合成樹脂層と、この第1の合成樹脂層の上
に導電性粉体を含む上記第1の合成樹脂層よりも軟化点
の高い第2の合成樹脂層を形成したことを特徴とする異
方導電性接着シート。(1) An insulating first synthetic resin layer on one main surface of a flexible film having a mold release effect, and the above-mentioned first synthetic resin containing conductive powder on the first synthetic resin layer. An anisotropically conductive adhesive sheet comprising a second synthetic resin layer having a higher softening point than the first layer.
合成樹脂層の軟化点を180℃未満としたことを特徴と
する特許請求の範囲第1項記載の異方導電性接着シート
。(2) Anisotropic conductivity according to claim 1, characterized in that the first synthetic resin layer has a softening point of 80° C. or higher, and the second synthetic resin layer has a softening point of less than 180° C. Adhesive sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3577685A JPS61195179A (en) | 1985-02-25 | 1985-02-25 | Anisotropically conductive adhesive sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3577685A JPS61195179A (en) | 1985-02-25 | 1985-02-25 | Anisotropically conductive adhesive sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61195179A true JPS61195179A (en) | 1986-08-29 |
JPH0527668B2 JPH0527668B2 (en) | 1993-04-21 |
Family
ID=12451290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3577685A Granted JPS61195179A (en) | 1985-02-25 | 1985-02-25 | Anisotropically conductive adhesive sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61195179A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01236588A (en) * | 1988-03-17 | 1989-09-21 | Matsushita Electric Ind Co Ltd | Aeolotropic conductive adhesive body |
EP0893484A3 (en) * | 1997-07-24 | 1999-07-21 | Sony Chemicals Corporation | Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
US6835274B2 (en) * | 1998-08-03 | 2004-12-28 | Sony Corporation | Electrical connecting device and electrical connecting method |
JP2005200521A (en) * | 2004-01-15 | 2005-07-28 | Sony Chem Corp | Adhesive film and method of manufacturing adhesive film |
JP2007182062A (en) * | 2006-01-04 | 2007-07-19 | Ls Cable Ltd | Multilayered anisotropic electroconductive film |
WO2007125993A1 (en) * | 2006-04-27 | 2007-11-08 | Asahi Kasei Emd Corporation | Electroconductive particle placement sheet and anisotropic elctroconductive film |
JP2008034232A (en) * | 2006-07-28 | 2008-02-14 | Asahi Kasei Electronics Co Ltd | Anisotropic conductive film |
JPWO2007123003A1 (en) * | 2006-04-12 | 2009-09-03 | 日立化成工業株式会社 | Adhesive film for circuit connection, circuit member connection structure, and circuit member connection method |
WO2010010743A1 (en) * | 2008-07-22 | 2010-01-28 | シャープ株式会社 | Electronic circuit device, method for manufacturing the same, and display device |
-
1985
- 1985-02-25 JP JP3577685A patent/JPS61195179A/en active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01236588A (en) * | 1988-03-17 | 1989-09-21 | Matsushita Electric Ind Co Ltd | Aeolotropic conductive adhesive body |
EP0893484A3 (en) * | 1997-07-24 | 1999-07-21 | Sony Chemicals Corporation | Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
US6020059A (en) * | 1997-07-24 | 2000-02-01 | Sony Chemicals Corporation | Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
US6835274B2 (en) * | 1998-08-03 | 2004-12-28 | Sony Corporation | Electrical connecting device and electrical connecting method |
JP2005200521A (en) * | 2004-01-15 | 2005-07-28 | Sony Chem Corp | Adhesive film and method of manufacturing adhesive film |
JP4513024B2 (en) * | 2006-01-04 | 2010-07-28 | エルジー イノテック カンパニー リミテッド | Multilayer anisotropic conductive film |
JP2007182062A (en) * | 2006-01-04 | 2007-07-19 | Ls Cable Ltd | Multilayered anisotropic electroconductive film |
JP4775377B2 (en) * | 2006-04-12 | 2011-09-21 | 日立化成工業株式会社 | Adhesive film for circuit connection, circuit member connection structure, and circuit member connection method |
JPWO2007123003A1 (en) * | 2006-04-12 | 2009-09-03 | 日立化成工業株式会社 | Adhesive film for circuit connection, circuit member connection structure, and circuit member connection method |
WO2007125993A1 (en) * | 2006-04-27 | 2007-11-08 | Asahi Kasei Emd Corporation | Electroconductive particle placement sheet and anisotropic elctroconductive film |
US8247701B2 (en) | 2006-04-27 | 2012-08-21 | Asahi Kasei Emd Corporation | Electroconductive particle placement sheet and anisotropic electroconductive film |
JP2008034232A (en) * | 2006-07-28 | 2008-02-14 | Asahi Kasei Electronics Co Ltd | Anisotropic conductive film |
WO2010010743A1 (en) * | 2008-07-22 | 2010-01-28 | シャープ株式会社 | Electronic circuit device, method for manufacturing the same, and display device |
Also Published As
Publication number | Publication date |
---|---|
JPH0527668B2 (en) | 1993-04-21 |
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