JPH11204970A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic equipment wherein a large heat dissipating area is provided and temperature increase in an electronic component is suppressed. SOLUTION: Electronic equipment is provided with a frame body 12 having a side wall 12a, a printed board 11 stored in the frame body 12, covers (an upper cover 13 and a lower cover 14) for covering the frame body 12 and heat sink parts 13b and 100 arranged to face the external plane of the side wall 12a by providing a space. At least a part of the heat sink part 13b is bonded to the frame body 12 or the covers (the upper cover 13 and the lower cover 14).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device which is provided with a magnetic shield and takes heat radiation into consideration, and which is suitable for use in, for example, a transmitting / receiving unit housed in a portable telephone or the like.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional electronic device, for example, a transmitting / receiving unit for a cellular phone, has a box-shaped frame 52 formed by bending a metal plate, and the frame 52 has four side walls 52a. And an opening 52b opened up and down, and a side wall 5
Metal terminals 56 are provided at the four corners 2a. The transmission / reception unit is attached to the main printed circuit board of the main body using the metal terminal 56 to constitute a mobile phone device.

[0005] Further, the printed circuit board 51 having a rectangular shape is provided with a copper foil pattern (not shown) having good thermal conductivity on the upper and lower surfaces thereof, so that a power amplifier IC for transmission, a resistance element, a capacitor, etc. Are provided with lands to which the electronic components 50 are soldered, and circuit patterns to which the electronic components 50 are electrically connected. Further, a circuit pattern is formed around the printed board 51 for grounding. The printed board 51 is housed so as to fit at a substantially middle position in the vertical direction on the inner surface of the side wall 52a, and is electrically connected to the frame 52.

The cover has an upper cover 53 and a lower cover 54, and the upper cover 53 has an electronic component 5.
0, in particular, a cut-and-raised portion 5 formed by being cut and raised inward at a position directly above the transmission power amplifier IC.
5 and a plurality of bent portions 5 formed by bending the periphery
3c is provided. And the upper cover 53 is
It is attached so that the inside of the bent portion 53c fits on the outer surface of the side wall 52a. At that time, the cut-and-raised portion 55 includes
The electric component 50 is in contact.

The lower cover 54 has the same size as the upper cover 53, and the lower cover 54 has a plurality of bent portions 54c formed by bending the periphery in one direction. Then, similarly to the upper cover 53, the lower cover 54 has a bent portion 54c on the outer surface of the side wall 12a.
Are mounted so that the insides of them fit. Thus, the frame 52 and the upper cover 53 that covers the frame 52
And the lower cover 54 constitute a transmission / reception unit that is magnetically shielded.

[0006] Such a transmission / reception unit for a mobile phone comprises:
The heat generated from inside the electronic component 50 is released to the cut-and-raised portion 55 and further to the outside through the upper cover 53 that communicates with the cut-and-raised portion 55 by heat conduction. Further, in order to suppress a rise in temperature due to heat generation of the electronic component 50, the heat of the electronic component 50 is released from the lower cover 54 and the printed circuit board 51 to the frame 52 communicating with the frame copper foil pattern (earth pattern).

[0007]

A conventional electronic device, especially a transmission / reception unit for a portable telephone, cuts and raises heat from an electronic component and radiates it from a cover through a portion, or a copper foil pattern (earth pattern) having good heat conductivity. ) Is released from the frame. However, the use of only the frame or the cover does not provide sufficient heat radiation, and raises the temperature of the electronic component. As a result, there is a problem that the reliability of the electronic component may be reduced or the electronic component may be broken.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device having a structure in which a heat radiation effect is enhanced in order to suppress a temperature rise of an electronic component.

[0009]

Means for Solving the Problems In order to achieve the above object, as a first means for solving the above problems,
A frame having a side wall, a printed circuit board housed in the frame, a cover covering the frame, and a heat radiating plate disposed opposite to the outer surface of the side wall with a space provided. Prepared,
At least a part of the radiator plate is joined to the frame or the cover.

As a second solution, the heat radiating plate is formed integrally with the cover.

As a third solution, the size of the heat radiating plate is provided substantially equal to the size of one of the side walls.

[0012]

FIG. 1 is a perspective view of a portable transmitting / receiving unit according to the present invention. FIG. 2 is a perspective view of the portable transmitting / receiving unit according to the present invention.
FIG. 3 is a sectional view of a transmission / reception unit according to another embodiment of the present invention.

As shown in FIGS. 1 and 2, the transmission / reception unit for a portable telephone has a box-shaped frame 12 formed by bending a metal plate, and this frame 12 is opened up and down with four side walls 12a. In the opening 12a and the outer surface of these side walls 12a,
A cover claw portion 17 formed in a protruding shape in two upper and lower rows, and a side wall 12
and metal terminals 16 extending at the four corners a. The transmission / reception unit is attached to a main printed circuit board or the like of the main body using the metal terminal 16 to constitute a mobile phone device.

A rectangular printed circuit board 11 is provided with a copper foil pattern (not shown) on the upper and lower surfaces thereof, and electronic components 10 such as a transmission power amplifier IC, a resistance element, and a capacitor are soldered. The attached lands and circuit patterns to which these electronic components 10 are electrically connected are provided. Further, a circuit pattern is formed around the printed circuit board 11 for grounding.
The printed circuit board 11 is housed so as to fit at a substantially middle position in the vertical direction on the inner surface of the side wall 12a, and is electrically connected to the frame 12.

The cover has an upper cover 13 and a lower cover 14, and the upper cover 13 has a cover 13a.
And a radiator plate 13b. The cover portion 13a has a plurality of regularly arranged holes 18 serving as a screw hole for adjustment of the electronic component 10 which also serves as a heat radiator while also reducing the weight. 1
0, in particular, a cut-and-raised portion 1 formed by being cut and raised inward at a position directly above the transmission power amplifier IC.
5, a bent portion 13c formed by bending the periphery,
In the bent portion 13c, a cover hole 20 that fits with the cover claw 17 is provided.

The heat radiating plate portion 13b is formed on substantially the same plane as the bent portion 13c, slightly extends outward from the upper surface of the upper cover 13, and has its end bent in the same direction as the bent portion 13c. It is formed as large as one side wall 12a. In addition, the radiator plate portion 13b
The locking portion 30 is formed by bending both ends of the elongated heat radiating plate portion 13b located on the lower side inward at right angles. The cover 13a and the heat radiating plate 13b are integrally joined.

The upper cover 13 is attached to the outer surface of the side wall 12a such that the inside of the bent portion 13c fits. When the upper cover 13 is attached, the heat radiating plate 13b is provided substantially in parallel with the side wall 12a by providing a certain space 40 with respect to the outer surface of the side wall 12a. Reference numeral 30 abuts on the side wall 12a and is fixedly joined thereto. At this time, the electric component 10 is in contact with the cut-and-raised portion 15.

The lower cover 14 has a plurality of bent portions 14c formed by bending the periphery in one direction. The lower cover 14 is attached to the outer surface of the side wall 12a such that the inside of the bent portion 14c fits.
Thus, the transmitting / receiving unit constitutes a case in which the magnetic shield is provided by the frame 12, the upper cover 13 covering the frame 12, and the lower cover 14.

To assemble the transmission / reception unit configured as described above, the printed circuit board 11 on which the electronic component 10 is mounted is housed in the frame 12, and the openings 12a, 12
The plurality of cover holes 20 are fitted to the cover claws 17 so that a is covered by the upper cover 13 and the lower cover 14, respectively. At this time, the cut-and-raised portion 1 that is previously cut and raised directly above the transmission power amplifier IC as the electronic component 10.
5 and the cut-and-raised portion 15 is connected to the power amplifier I for transmission.
C is abutted. In addition, since the locking portions 30, 30 which are a part of the heat radiating plate portion 13b provided opposite to the outer surface of the side wall 12a with the space portion 40 provided therebetween are in contact with the side wall 12a of the frame 12, the joining is performed. Fix it.

In such a portable telephone transmitting / receiving unit, heat generated in the electronic component 10 is guided to the cut-and-raised portion 15 by heat conduction, and is further radiated to the outside from the cover 13 communicating with the cut-and-raised portion 15. The heat is radiated through the holes 18 and is cooled by the flow of air with the outside air outside, so that the temperature rise of the electronic component 10 is suppressed. Further, heat of the electronic component 10 is transmitted from the printed board 11 to the frame 12 through a copper foil pattern (earth pattern) having good thermal conductivity, and the heat is released from the frame 12.

Further, since heat is conducted from the upper cover 13 to the heat radiating plate portion 13b having a large heat radiating area, the heat is radiated toward the space 40 and the outer surface by the heat radiating plate portion. In addition, since the radiator plate 13b is provided on the side wall 12a near the transmission power amplifier IC having a large output and a large amount of heat generation as shown in the figure, the heat conduction path is short, and the heat release efficiency is high. Further, the space 40 is cooled by the air flow and the heat radiation by the heat convection in addition to the heat release by the heat conduction, so that the temperature rise of the electronic component 10 is further suppressed.

The heat generated in the electronic component 10 is conducted from the upper cover 13 to the frame 12, and
The heat is also conducted to the locking portion 30 joined to the side wall 12a. The locking portion 30 is fixed to the frame body 12 as a part of the heat radiating plate portion 13b and also functions as a heat conduction path.

FIG. 3 shows a portable transmitting / receiving unit according to another embodiment of the present invention. The same components as those of the portable transmitting / receiving unit described above are denoted by the same reference numerals, and are described in detail. Is omitted.

This portable transmitting / receiving unit is substantially parallel to the side wall 12a of the frame 12 and separate from the upper cover 13.
Radiator plate 1 having substantially the same size as side wall 12a
00 is provided, and a part of the heat sink 100 is soldered to the side wall 12a.

The upper cover 13 is provided with four bent portions 13c formed by bending four sides. The bent portion 13c is formed into a substantially rectangular shape by a plurality of bent pieces 13d provided with the cover hole 20 and a parallel portion 13e formed between the bent pieces 13d and formed in parallel with the longitudinal direction of the side wall 12a. Is formed.

The radiating plate portion 100 is notched from the same direction and bent inward at a right angle at a position facing the locking portion 30 and the parallel portion 13e, and then bent at a right angle in a direction opposite to the direction of the continuous bending. A plurality of contact portions 1 formed
10 are provided. The radiator plate portion 100 is provided on the side wall 12.
A predetermined distance, that is, a space portion 40 is provided to the outer surface of “a”, and the contact portion 110 and the locking portion 30 are respectively joined and fixed by soldering.

The lower cover 14 has the same size as the upper cover 13, and the lower cover 14 serves to reduce the weight and also serves as a heat radiator. A plurality of regularly arranged holes 18 serving as holes, a plurality of bent portions 14c formed by bending the periphery in one direction, and a plurality of bent portions 14c;
c, the cover hole 20 to be fitted with the cover claw 17
Are provided. If necessary, printed circuit board 1
A cut-and-raised portion 15 is formed at a position facing the electronic component 10 placed on the lower surface of the electronic component 10. Abut. The lower cover 14 is attached to the outer surface of the side wall 12a such that the inside of the bent portion 13c fits. As described above, the frame 12, the upper cover 13 covering the frame 12, the lower cover 14, and the frame plate 100 constitute a transmitting / receiving unit for a mobile phone.

In order to assemble the portable transmitting / receiving unit thus constructed, the printed circuit board 11 on which the electronic component 10 is mounted is housed in the frame 12, and the opening 12
The upper cover 13 and the lower cover 14 are fitted into the cover claws 17 a and 12 a, respectively. At this time, the cut-and-raised portion 1 that has been previously cut and raised is formed.
5 is the same as in the above-described embodiment in that it is combined so as to contact the electronic component 10.

Further, the engaging portion 30 of the radiating plate portion 100 which has been bent beforehand is brought into contact with the side wall 12a and joined with solder or the like, while the contact portion 110 which has been formed beforehand is connected to the side wall 12a of the frame body 12. , And fixed with solder or the like.

Such a transmitting / receiving unit for a portable telephone is
By heat conduction, heat generated in the electronic component 10 is guided to the cut-and-raised portion 15 and is released to the outside from the upper cover 13 that communicates with the cut-and-raised portion 15. The heat is radiated through the holes 18 and is cooled by the flow of air with the outside air outside, so that the temperature rise of the electronic component 10 is suppressed. Further, heat of the electronic component 10 is transmitted from the printed board 11 to the frame 12 through a copper foil pattern (earth pattern) having good thermal conductivity, and the heat is released from the frame 12.

Since heat is conducted from the upper cover 13 or the printed circuit board 11 to the side wall 12a, the heat is conducted to the radiator plate 100 through the contact portion 100a joined to the side wall 12a. Then, heat is radiated from the surface of the heat radiating plate 100 having a large heat radiating area toward the space 40 and the outer surface. Further, since the heat radiating plate portion 13b has a structure as shown in the drawing, it is cooled by the air flow and the heat radiation by the heat convection in addition to the heat release by the heat conduction, so that the temperature rise of the electronic component 10 can be suppressed. Can be.

[0032]

The electronic device according to the present invention has a radiator plate portion which is partially joined to a frame or a cover, and which is disposed opposite to the outer surface of the side wall with a certain space. A large heat radiation area can be obtained, a sufficient heat radiation effect can be achieved, and a temperature rise of the electronic component can be suppressed.

Further, in the electronic apparatus of the present invention, since the heat radiating plate is formed integrally with the cover, a large heat radiating area can be obtained without disposing a new heat radiating plate, and heat is efficiently radiated. be able to.

By making the heat radiating plate portion the same size as the side wall surface of the frame, a large heat radiating area can be obtained to suppress an increase in the temperature of the electronic component and to improve the space factor of the electronic device. .

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic apparatus of the invention.

FIG. 2 is an exemplary cross-sectional view of the electronic apparatus according to the embodiment of the invention, taken along line 2-2 of FIG. 1;

FIG. 3 is a cross-sectional view illustrating an electronic apparatus according to another embodiment of the present invention, taken along line 2-2 of FIG. 1;

FIG. 4 is a cross-sectional view showing a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Printed circuit board 12 Frame 12a Side wall 13, 14 Cover (upper cover, lower cover) 13b, 100 Heat sink

Claims (3)

[Claims] 1. A frame having a side wall, a printed circuit board housed in the frame, a cover covering the frame, and a space provided with respect to an outer surface of the side wall. An electronic device comprising: a heat radiating plate; and at least a part of the heat radiating plate is joined to the frame or the cover. 2. The electronic device according to claim 1, wherein the heat radiating plate is formed integrally with a cover. 3. The electronic device according to claim 1, wherein the size of the heat radiating plate is substantially equal to the size of one of the side walls.