JP2002026556A - Heat radiating structure of transmitting/receiving unit - Google Patents
Heat radiating structure of transmitting/receiving unitInfo
- Publication number
- JP2002026556A JP2002026556A JP2000203083A JP2000203083A JP2002026556A JP 2002026556 A JP2002026556 A JP 2002026556A JP 2000203083 A JP2000203083 A JP 2000203083A JP 2000203083 A JP2000203083 A JP 2000203083A JP 2002026556 A JP2002026556 A JP 2002026556A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating component
- hole
- transmitting
- receiving unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、携帯電話機に使用
される送受信ユニットの放熱構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation structure of a transmitting / receiving unit used in a portable telephone.
【０００２】[0002]
【従来の技術】従来の送受信ユニットの放熱構造を図５
に基づいて説明すると、金属板を折り曲げして形成され
た箱形のカバー２１は、周囲に複数個の孔２１ａを有す
る矩形状の上面壁２１ｂと、この上面壁２１ｂの四方か
ら折り曲げされて形成された側面壁２１ｃと、この側面
壁２１ｃの端部から折り曲げられて形成された取付部２
１ｄと、上面壁２１ｂと側面壁２１ｃとによって形成さ
れた空洞の収納部２１ｅとを有する。2. Description of the Related Art FIG.
The box-shaped cover 21 formed by bending a metal plate is formed by bending a rectangular upper wall 21b having a plurality of holes 21a around it and by bending the upper wall 21b from all sides. Side wall 21c and an attachment portion 2 formed by bending the end of the side wall 21c.
1d, and a hollow storage portion 21e formed by the upper wall 21b and the side wall 21c.
【０００３】プリント基板からなる回路基板２２の上面
には、抵抗、コンデンサ等の種々の電気部品２３と、パ
ワーアンプ等の発熱部品２４が搭載されると共に、下面
には、回路基板２２からの引き出し用のコネクタ２５が
設けられている。そして、この回路基板２２は、カバー
２１の収納部２１ｅ内に収納され、電気部品２３と発熱
部品２４とがカバー２１によって覆われて、電気的にシ
ールドされた状態で、カバー２１に取り付けられてい
る。Various electric components 23 such as a resistor and a capacitor and a heat generating component 24 such as a power amplifier are mounted on an upper surface of a circuit board 22 composed of a printed circuit board. Connector 25 is provided. The circuit board 22 is housed in the housing 21 e of the cover 21, and the electric component 23 and the heat-generating component 24 are covered by the cover 21 and attached to the cover 21 in an electrically shielded state. I have.
【０００４】このような構成を有する従来の送受信ユニ
ットは、携帯電話機のマザー基板２６上に載置され、取
付部２１ｄをネジ止め、或いは半田付けによりマザー基
板２６に取り付けられ、そして、送受信ユニットがマザ
ー基板２６に取り付けられた際、コネクタ２５がマザー
基板２６に設けられたコネクタ２７に接続されて、送受
信ユニットがマザー基板２６上の電気回路に接続される
ようになっている。A conventional transmitting / receiving unit having such a configuration is mounted on a motherboard 26 of a portable telephone, and the mounting portion 21d is attached to the motherboard 26 by screwing or soldering. When attached to the motherboard 26, the connector 25 is connected to the connector 27 provided on the motherboard 26, and the transmitting / receiving unit is connected to an electric circuit on the motherboard 26.
【０００５】そして、このような状態で送受信ユニット
が使用された際、発熱部品２４によって収納部２１ｅ内
の空気が熱せられ、熱せられた空気が孔２１ａを通して
カバー２１外に放熱されるようになるが、カバー２１内
の空気の対流が悪く、放熱性が悪いものであった。When the transmitting / receiving unit is used in such a state, the air in the storage section 21e is heated by the heat generating component 24, and the heated air is radiated to the outside of the cover 21 through the hole 21a. However, the convection of the air in the cover 21 was poor, and the heat dissipation was poor.
【０００６】[0006]
【発明が解決しようとする課題】従来の送受信ユニット
の放熱構造は、カバー２１内に収納された発熱部品２４
で熱せられた空気が上面壁２１ｂの周囲に設けられた孔
２１ａを通してカバー２１外に放熱されるため、カバー
２１内の空気の対流が悪く、放熱性が悪いという問題が
ある。The heat radiating structure of the conventional transmitting / receiving unit includes a heat generating component 24 housed in a cover 21.
Since the air heated in step (1) is radiated to the outside of the cover 21 through the holes 21a provided around the upper surface wall 21b, there is a problem that convection of the air in the cover 21 is poor and heat radiation is poor.
【０００７】そこで、本発明は、放熱性が良く、生産性
の良好な送受信ユニットの放熱構造を提供することを目
的とする。Accordingly, an object of the present invention is to provide a heat radiation structure of a transmission / reception unit which has good heat radiation and good productivity.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
の第１の解決手段として、電気部品と発熱部品を搭載し
た回路基板と、前記電気部品と前記発熱部品を覆うよう
に配設されたカバーとを備え、前記カバーの上面壁に
は、前記発熱部品の上面の近傍に第１の孔を設けると共
に、前記カバーの側面壁には、前記発熱部品の側面の近
傍に第２の孔を設けて、前記第１と第２の孔によって、
前記発熱部品によって熱せられた空気を対流させるよう
にした構成とした。According to a first aspect of the present invention, there is provided a circuit board on which an electric component and a heat generating component are mounted, and a circuit board covering the electric component and the heat generating component. A first hole is provided on the upper surface wall of the cover near the upper surface of the heat-generating component, and a second hole is provided on the side wall of the cover near the side surface of the heat-generating component. Provided by the first and second holes,
The air heated by the heat-generating component was made to convect.
【０００９】また、第２の解決手段として、前記第１の
孔が前記発熱部品の上面に対向する位置に形成された構
成とした。また、第３の解決手段として、前記第２の孔
が前記発熱部品の側面に対向する位置に形成された構成
とした。As a second solution, the first hole is formed at a position facing the upper surface of the heat generating component. As a third solution, the second hole is formed at a position facing a side surface of the heat generating component.
【００１０】また、第４の解決手段として、前記発熱部
品が隣り合う二つの前記側面壁で形成される隅部に配置
され、前記二つの側面壁のそれぞれに前記第２の孔を設
けた構成とした。また、第５の解決手段として、前記上
面壁には、切り曲げによって舌片と前記第１の孔が形成
され、前記発熱部品の上面に前記舌片を当接させた構成
とした。According to a fourth aspect of the present invention, the heat-generating component is disposed at a corner formed by two adjacent side walls, and the second hole is provided in each of the two side walls. And As a fifth solution, a tongue and the first hole are formed on the upper surface wall by cutting and bending, and the tongue is brought into contact with the upper surface of the heat generating component.
【００１１】[0011]
【発明の実施の形態】本発明の送受信ユニットの放熱構
造の図面を説明すると、図１は本発明の送受信ユニット
の放熱構造に係る第１実施例を示す要部断面斜視図、図
２は本発明の送受信ユニットの放熱構造に係る第２実施
例を示す要部断面斜視図、図３は本発明の送受信ユニッ
トの放熱構造に係る第３実施例を示す要部断面斜視図、
図４は本発明の送受信ユニットの放熱構造に係る第４実
施例を示す要部断面平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A description will now be given of a drawing of a heat radiation structure of a transmission / reception unit according to the present invention. FIG. 1 is a perspective view showing a first embodiment of a heat radiation structure of a transmission / reception unit according to the present invention, and FIG. FIG. 3 is a perspective view of a main part showing a second embodiment of the heat radiation structure of the transmitting / receiving unit of the present invention; FIG.
FIG. 4 is a cross-sectional plan view of a main part showing a fourth embodiment of the heat radiation structure of the transmitting / receiving unit of the present invention.
【００１２】次に、本発明の送受信ユニットの放熱構造
の第１実施例を図１に基づいて説明すると、金属板を折
り曲げして形成された箱形のカバー１は、周囲に設けら
れた複数個の孔１ａとこの孔１ａから外れた位置に設け
られた第１の孔１ｆとを有する矩形状の上面壁１ｂと、
この上面壁１ｂの四方から折り曲げされて形成された側
面壁１ｃと、この側面壁１ｃに設けられた第２の孔１ｇ
と、側面壁１ｃの端部から折り曲げられて形成された取
付部１ｄと、上面壁１ｂと側面壁１ｃとによって形成さ
れた空洞の収納部１ｅとを有する。Next, a first embodiment of the heat radiation structure of the transmitting / receiving unit of the present invention will be described with reference to FIG. 1. A box-shaped cover 1 formed by bending a metal plate has a plurality of A rectangular upper surface wall 1b having a plurality of holes 1a and a first hole 1f provided at a position off the holes 1a;
A side wall 1c formed by bending the upper surface wall 1b from all sides, and a second hole 1g provided in the side wall 1c.
And a mounting portion 1d formed by bending the end of the side wall 1c, and a hollow storage portion 1e formed by the upper surface wall 1b and the side wall 1c.
【００１３】プリント基板からなる回路基板２の上面に
は、抵抗、コンデンサ等の種々の電気部品３と、パワー
アンプ等の発熱部品４が搭載されると共に、下面には、
回路基板２からの引き出し用のコネクタ５が設けられて
いる。そして、この回路基板２は、カバー１の収納部１
ｅ内に収納され、電気部品３と発熱部品４とがカバー１
によって覆われて、電気的にシールドされた状態で、カ
バー１に取り付けられている。Various electric components 3 such as a resistor and a capacitor and a heat generating component 4 such as a power amplifier are mounted on an upper surface of a circuit board 2 composed of a printed circuit board.
A connector 5 for drawing out from the circuit board 2 is provided. The circuit board 2 is provided in the housing 1 of the cover 1.
e, the electric component 3 and the heat generating component 4
And is attached to the cover 1 in an electrically shielded state.
【００１４】また、回路基板２がカバー１内に取り付け
られて、発熱部品４がカバー１で覆われた際、第１の孔
１ｆは、発熱部品４の上面と対向した位置にあると共
に、第２の孔１ｇは、発熱部品４の側面と対向した位置
となっている。なお、上記第１の孔１ｆは、発熱部品４
の上面の近傍に設けても良く、また、上記第２の孔１ｇ
は、発熱部品４の側面の近傍に設けても良く、更に、第
１の孔１ｆは、周囲に設けた孔１ａを代用しても良い。When the circuit board 2 is mounted in the cover 1 and the heat-generating component 4 is covered with the cover 1, the first hole 1f is located at a position facing the upper surface of the heat-generating component 4, and The second hole 1 g is located at a position facing the side surface of the heat generating component 4. The first hole 1f is provided with the heat generating component 4
May be provided near the upper surface of the second hole 1g.
May be provided in the vicinity of the side surface of the heat-generating component 4, and the first hole 1f may be replaced by a hole 1a provided in the periphery.
【００１５】このような構成を有する本発明の送受信ユ
ニットは、携帯電話機のマザー基板６上に載置され、取
付部１ｄをネジ止め、或いは半田付けによりマザー基板
６に取り付けられ、そして、送受信ユニットがマザー基
板６に取り付けられた際、コネクタ５がマザー基板６に
設けられたコネクタ７に接続されて、送受信ユニットが
マザー基板６上の電気回路に接続されるようになってい
る。そして、このような状態で送受信ユニットが使用さ
れた際、発熱部品４によって収納部１ｅ内の空気が熱せ
られ、熱せられた空気は第１の孔１ｆを通してカバー１
外に放熱されるが、この時、第２の孔１ｇから外部の冷
たい空気が真バー１内に流れ込み、従って、カバー１内
の空気の対流が良好となり、放熱性が良くなる。The transmitting / receiving unit of the present invention having such a configuration is mounted on the motherboard 6 of the portable telephone, and the mounting portion 1d is attached to the motherboard 6 by screwing or soldering. When is mounted on the motherboard 6, the connector 5 is connected to the connector 7 provided on the motherboard 6, and the transmitting / receiving unit is connected to an electric circuit on the motherboard 6. When the transmission / reception unit is used in such a state, the air in the storage part 1e is heated by the heat-generating component 4, and the heated air is passed through the first hole 1f to cover 1.
The heat is radiated to the outside. At this time, cold external air flows into the true bar 1 from the second hole 1g, so that the convection of the air in the cover 1 is improved and the heat radiation is improved.
【００１６】また、図２は本発明の第２実施例を示し、
この第２実施例は、第１実施例における取付部１ｄと、
コネクタ５を無くして、箱形のカバー１を回路基板２上
に半田付けして取付し、このカバー１で電気部品３と発
熱部品４を覆うと共に、回路基板２をマザー基板６上に
載置して、回路基板２に設けたサイド電極２ａをマザー
基板６に半田接続するようにしたものである。その他の
構成は、第１実施例と同様であり、同一部品に同一番号
を付し、ここではその説明を省略する。FIG. 2 shows a second embodiment of the present invention.
The second embodiment is different from the first embodiment in that:
The connector 5 is eliminated, and the box-shaped cover 1 is mounted on the circuit board 2 by soldering. The electric component 3 and the heat-generating component 4 are covered with the cover 1 and the circuit board 2 is placed on the mother board 6. Then, the side electrodes 2a provided on the circuit board 2 are connected to the mother board 6 by soldering. Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals, and description thereof is omitted here.
【００１７】また、図３は本発明の第２実施例を示し、
この第３実施例は、上面壁１ｂを切り曲げすることによ
って舌片１ｈと第１の孔１ｆとが形成され、この舌片１
ｈを発熱部品４の上面に当接されたものである。このよ
うな構成においては、第１と第２の孔１ｆ、１ｇによっ
て、空気の対流が良くなるると共に、舌片１ｈからの発
熱部品４の放熱も併用できて、一層、放熱性が良くな
る。その他の構成は、第１実施例と同様であり、同一部
品に同一番号を付し、ここではその説明を省略する。FIG. 3 shows a second embodiment of the present invention.
In the third embodiment, the tongue 1h and the first hole 1f are formed by cutting and bending the upper wall 1b.
h is in contact with the upper surface of the heat generating component 4. In such a configuration, the first and second holes 1f and 1g improve the convection of air, and can also radiate heat from the tongue piece 1h to the heat-generating component 4, further improving the heat radiation. . Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals, and description thereof is omitted here.
【００１８】また、図４は本発明の第４実施例を示し、
この第４実施例は、発熱部品４が隣り合う二つの側面壁
１ｃで形成される隅部に配置され、二つの側面壁１ｃの
それぞれに第２の孔１ｇを設けたものである。このよう
な構成においては、二つの第２の孔１ｇから空気の流入
ができて、一層、空気の対流が良くなって、一層、放熱
性が良くなる。その他の構成は、第１実施例と同様であ
り、同一部品に同一番号を付し、ここではその説明を省
略する。FIG. 4 shows a fourth embodiment of the present invention.
In the fourth embodiment, a heat-generating component 4 is disposed at a corner formed by two adjacent side walls 1c, and a second hole 1g is provided in each of the two side walls 1c. In such a configuration, the air can flow in from the two second holes 1g, the convection of the air is further improved, and the heat dissipation is further improved. Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals, and description thereof is omitted here.
【００１９】[0019]
【発明の効果】本発明の送受信ユニットの放熱構造にお
いて、カバー１の上面壁１ｂには、発熱部品４の上面の
近傍に第１の孔１ｆを設けると共に、カバー１の側面壁
１ｃには、発熱部品４の側面の近傍に第２の孔１ｇを設
けて、第１と第２の孔１ｆ、１ｇによって、発熱部品４
によって熱せられた空気を対流させるようにしたため、
従来に比して、空気の対流を良くできて、放熱性の良好
な送受信ユニットの放熱構造を提供できる。In the heat radiation structure of the transmitting / receiving unit according to the present invention, a first hole 1f is provided in the upper surface wall 1b of the cover 1 near the upper surface of the heat-generating component 4, and a side wall 1c of the cover 1 is provided. A second hole 1g is provided in the vicinity of the side surface of the heat-generating component 4, and the first and second holes 1f, 1g allow the heat-generating component 4 to be formed.
Convection of the air heated by
As compared with the related art, it is possible to improve the convection of the air and provide a heat radiation structure of the transmission / reception unit having good heat radiation.
【００２０】また、この放熱構造は、カバー１の上面壁
１ｂと側面壁１ｃに孔１ｆ、１ｇを開けるだけでよく、
従って、生産性が良く、安価な送受信ユニットの放熱構
造が得られる。In addition, this heat radiation structure only needs to make holes 1f and 1g in the upper wall 1b and the side wall 1c of the cover 1.
Therefore, the heat radiation structure of the transmission / reception unit with good productivity and low cost can be obtained.
【００２１】また、第１の孔１ｆが発熱部品４の上面に
対向する位置に形成されたため、熱せられた空気のカバ
ー１外への流出性が良く、放熱性の良好なものが得られ
る。Further, since the first hole 1f is formed at a position facing the upper surface of the heat-generating component 4, the heated air can flow out of the cover 1 with good heat radiation.
【００２２】また、第２の孔１ｇが発熱部品４の側面に
対向する位置に形成されたため、外部の冷たい空気が発
熱部品４に当たりながら第１の孔１ｆへの導かれるた
め、発熱部品４を効率よく冷やすことができる。Since the second hole 1g is formed at a position facing the side surface of the heat-generating component 4, external cold air hits the heat-generating component 4 and is guided to the first hole 1f. It can be cooled efficiently.
【００２３】また、発熱部品４が隣り合う二つの側面壁
１ｃで形成される隅部に配置され、二つの側面壁１ｃの
それぞれに第２の孔１ｇを設けたため、二つの第２の孔
１ｇから空気の流入ができて、一層、空気の対流が良く
なって、一層、放熱性が良くなる。Further, since the heat-generating component 4 is disposed at a corner formed by two adjacent side walls 1c and the second hole 1g is provided in each of the two side walls 1c, the two second holes 1g are provided. , The convection of the air is further improved, and the heat dissipation is further improved.
【００２４】また、上面壁１ｂには、切り曲げによって
舌片１ｈと第１の孔１ｆが形成され、発熱部品４の上面
に舌片１ｈを当接させたため、第１と第２の孔１ｆ、１
ｇによって、空気の対流が良くなるると共に、舌片１ｈ
からの発熱部品４の放熱も併用できて、一層、放熱性が
良くなる。Further, the tongue 1h and the first hole 1f are formed in the upper surface wall 1b by cutting and bending, and the tongue 1h is brought into contact with the upper surface of the heat generating component 4, so that the first and second holes 1f are formed. , 1
g improves the convection of the air and the tongue piece 1h
The heat radiation of the heat-generating component 4 can also be used together, and the heat radiation is further improved.
【図１】本発明の送受信ユニットの放熱構造に係る第１
実施例を示す要部断面斜視図。FIG. 1 is a first view showing a heat radiation structure of a transmission / reception unit of the present invention.
The principal part sectional perspective view which shows an Example.
【図２】本発明の送受信ユニットの放熱構造に係る第２
実施例を示す要部断面斜視図。FIG. 2 shows a second embodiment of the heat radiation structure of the transmitting / receiving unit of the present invention.
The principal part sectional perspective view which shows an Example.
【図３】本発明の送受信ユニットの放熱構造に係る第３
実施例を示す要部断面斜視図。FIG. 3 is a third view showing a heat radiation structure of the transmitting / receiving unit according to the present invention;
The principal part sectional perspective view which shows an Example.
【図４】本発明の送受信ユニットの放熱構造に係る第４
実施例を示す要部断面平面図。FIG. 4 is a fourth view showing the heat radiation structure of the transmitting / receiving unit of the present invention.
The principal part sectional plan view showing an example.
【図５】従来の送受信ユニットの放熱構造に係る要部断
面斜視図。FIG. 5 is a cross-sectional perspective view of a main part of a conventional heat dissipation structure of a transmission / reception unit.
１ カバー １ａ 孔 １ｂ 上面壁 １ｃ 側面壁 １ｄ 取付部 １ｅ 収納部 １ｆ 第１の孔 １ｇ 第２の孔 １ｈ 舌片 ２ 回路基板 ２ａ サイド電極 ３ 電気部品 ４ 発熱部品 ５ コネクタ ６ マザー基板 ７ コネクタ DESCRIPTION OF SYMBOLS 1 Cover 1a Hole 1b Top wall 1c Side wall 1d Mounting part 1e Storage part 1f First hole 1g Second hole 1h Tongue piece 2 Circuit board 2a Side electrode 3 Electric component 4 Heat generating component 5 Connector 6 Mother board 7 Connector
Claims (5)
と、前記電気部品と前記発熱部品を覆うように配設され
たカバーとを備え、前記カバーの上面壁には、前記発熱
部品の上面の近傍に第１の孔を設けると共に、前記カバ
ーの側面壁には、前記発熱部品の側面の近傍に第２の孔
を設けて、前記第１と第２の孔によって、前記発熱部品
によって熱せられた空気を対流させるようにしたことを
特徴とする送受信ユニットの放熱構造。1. A circuit board on which an electric component and a heat-generating component are mounted, and a cover disposed so as to cover the electric component and the heat-generating component. And a second hole is provided in the side wall of the cover near the side surface of the heat-generating component, and the first and second holes heat the heat by the heat-generating component. A radiating structure for the transmitting and receiving unit, wherein the convected air is made to flow.
向する位置に形成されたことを特徴とする請求項１記載
の送受信ユニットの放熱構造。2. The heat radiating structure of a transmitting / receiving unit according to claim 1, wherein said first hole is formed at a position facing an upper surface of said heat generating component.
向する位置に形成されたことを特徴とする請求項１、又
は２記載の送受信ユニットの放熱構造。3. The heat radiating structure for a transmitting / receiving unit according to claim 1, wherein the second hole is formed at a position facing a side surface of the heat generating component.
壁で形成される隅部に配置され、前記二つの側面壁のそ
れぞれに前記第２の孔を設けたことを特徴とする請求項
１から３の何れかに記載の送受信ユニットの放熱構造。4. The device according to claim 1, wherein the heat-generating component is disposed at a corner formed by two adjacent side walls, and the second hole is provided in each of the two side walls. 4. The heat radiation structure of the transmission / reception unit according to any one of items 1 to 3.
と前記第１の孔が形成され、前記発熱部品の上面に前記
舌片を当接させたことを特徴とする請求項１から４の何
れかに記載の送受信ユニットの放熱構造。5. The tongue piece and the first hole are formed in the upper surface wall by cutting and bending, and the tongue piece is brought into contact with the upper surface of the heat generating component. The heat radiation structure of the transmitting / receiving unit according to any one of the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000203083A JP2002026556A (en) | 2000-06-30 | 2000-06-30 | Heat radiating structure of transmitting/receiving unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000203083A JP2002026556A (en) | 2000-06-30 | 2000-06-30 | Heat radiating structure of transmitting/receiving unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002026556A true JP2002026556A (en) | 2002-01-25 |
Family
ID=18700526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000203083A Withdrawn JP2002026556A (en) | 2000-06-30 | 2000-06-30 | Heat radiating structure of transmitting/receiving unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002026556A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017073476A (en) * | 2015-10-08 | 2017-04-13 | 日本電気株式会社 | Heat radiation device and equipment |
-
2000
- 2000-06-30 JP JP2000203083A patent/JP2002026556A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017073476A (en) * | 2015-10-08 | 2017-04-13 | 日本電気株式会社 | Heat radiation device and equipment |
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