JP6570149B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device including a heat dissipation structure that enables improvement in device assembly workability and reduction in thickness.

  A large number of circuit boards are densely mounted in a housing of an electronic device such as a communication device, a video device, and a broadcast device, and a semiconductor device, a CPU (Central Processing Unit), and an FET (Field Effect Transistor) on each circuit substrate. Since an electronic component that emits high heat, such as an effect transistor or a power amplifier, is mounted, a cooling device for cooling the electronic device is required. Electronic components that emit high heat, such as semiconductor devices, CPUs, power amplifiers, etc., have a narrow effective operating temperature range, and therefore it is necessary to cool each electronic component individually rather than cooling the entire electronic device. For this reason, conventionally, a metal material such as aluminum having good thermal conductivity has been used as the casing of the electronic device, and the internal temperature of the electronic component that emits high heat mounted in the casing does not exceed the limit temperature. There is an electronic device having a heat dissipation structure that releases heat generated from a component to the outside through a casing.

  For example, in Patent Document 1, a frame body made of a metal plate and having an opening, a printed circuit board disposed in the frame body and attached with a heat generating component, and soldered to the inside of the frame body, An inner cover made of a metal plate having a tongue piece portion and a hole formed, and an outer cover made of a metal plate arranged to cover the opening of the frame body and having a tongue piece portion formed by cutting and raising And the tongue piece of the inner cover is brought into contact with the heat generating component, and the tongue piece of the outer cover is brought into contact with the tongue piece of the inner cover through the hole of the inner cover. An electronic device characterized by the above is disclosed.

Japanese Patent Laid-Open No. 11-233982

  Here, a conventional electronic device having a heat dissipation structure in which a unit on which an electronic component that generates high heat is mounted is housed in a housing composed of a case and a cover, and heat generated from the heat generating electronic component is released to the outside through the housing. An example will be described with reference to FIG. FIG. 3 is an explanatory diagram for explaining a configuration of an electronic apparatus having a conventional heat dissipation structure and an assembling procedure. FIG. 3A shows a configuration of the substrate unit (1) and the substrate unit (1). FIG. 3B is a diagram showing the configuration of the substrate unit (2) and the state in which the substrate unit (2) is attached to the case, and FIG. (c) is a figure which shows the state finally attached to the cover to the case.

  As shown in FIG. 3C, the conventional electronic device 100 includes a case 110 and a cover 120 that form a casing, and a substrate unit (1) 130 and a substrate unit (2) 140 housed in the casing. The heat dissipation structure is configured to release heat generated from the heat generating electronic components mounted on the board unit (1) 130 and the board unit (2) 140 to the outside through the housing. In FIG. 3, the case 110 is drawn as if it were formed from two side walls and a bottom surface, but actually there are side walls on the front side and the back side of the paper, All surroundings shall be assumed.

  As shown in FIG. 3A, the board unit (1) 130 includes a circuit board (1) 132, a heat generating component 134, and a heat generating component 136. The heat generating component 134 and the heat generating component 136 are circuit boards (1). 1) Soldered to 132. As shown in FIG. 3B, the board unit (2) 140 includes a circuit board (2) 142, a heat generating component 144, and a heat generating component 146, and the heat generating component 144 and the heat generating component 146 are circuit boards ( 2) Soldered to 134. As shown in FIGS. 3A and 3B, the board unit (1) 130 and the board unit (2) 140 are connected by a wiring cable 150 for signal transmission and power transmission. In this example, both ends of the wiring cable 150 are directly soldered to the circuit board (1) 132 and the circuit board (2) 142, respectively, but may be connected via a connector.

  As shown in FIG. 3A, the cover 120 is formed with a plurality of heat dissipating fins 120a on the outer side, and faces the heat generating component 134 and the heat generating component 136 of the board unit (1) 130 on the inner side. A convex surface portion 120b and a convex surface portion 120c are formed at positions, respectively, and a fixing column 122 for attaching the substrate unit (1) 130 is formed. The height of the convex surface portion 120b and the convex surface portion 120c of the cover 120 is set so that the heat generating component 134 and the heat generating component 136 of the substrate unit (1) 130 are fixed when the substrate unit (1) 130 is attached to the fixing column 122 of the cover 120. The height is set to be in close contact with each other.

  As shown in FIG. 3B, the case 110 has a plurality of heat radiation fins 110a formed on the outer side, and faces the heat generating component 144 and the heat generating component 146 of the board unit (2) 140 on the inner side. A convex surface portion 110b and a convex surface portion 110c are formed at positions, respectively, and a fixing column 112 for attaching the substrate unit (2) 140 is formed. The height of the convex surface portion 110b and the convex surface portion 110c of the case 110 is set so that the heat generating component 144 and the heat generating component 146 of the substrate unit (2) 140 are mounted when the substrate unit (2) 140 is attached to the fixing column 112 of the case 110. The height is set to be in close contact with each other.

  Next, a procedure for assembling the conventional electronic device 100 will be described with reference to FIG. First, the board unit (1) 130 and the board unit (2) 140 are placed side by side, and both ends of the wiring cable 150 are directly soldered to each board unit or connected via connectors, and both units are connected. As shown in FIG. 3 (a), the unit fixing screw 210 is used to fix the board unit (1) 130 to the inner side of the cover 120 through a mounting hole (not shown) provided in the circuit board (1) 132. A female screw part 122 a provided on 122 is screwed. As shown in FIG. 3 (b), the unit fixing screw 210 is used to pass the board unit (2) 140 through the mounting holes (not shown) provided in the circuit board (2) 142 to fix the board unit (2) 140 inside the case 110. A female screw part 112 a provided at 112 is screwed.

  Then, the cover 120 to which the board unit (1) 130 is attached is reversed, and the cover 120 is placed at a predetermined position of the case 110 as shown in FIG. The cover 120 is screwed to the female screw portion 110 d provided on the side wall portion of the case 110 through the mounting hole 120 d provided in the 120.

  However, the assembly of the conventional electronic device 100 is performed in a state where the board unit (1) 130 and the board unit (2) 140 are arranged side by side when they are assembled into the cover 120 and the case 110, respectively, as described above. Therefore, a long wiring cable 150 is required, and there is a problem that handling during assembly work is complicated. Further, during assembly work shown in FIG. 3C, the long wiring cable 150 must be accommodated in the space between the board unit (1) 130 and the board unit (2) 140. In addition, it is necessary to secure a predetermined gap between the substrate unit (1) 130 and the substrate unit (2) 140, so that the thickness of the electronic device 100 increases.

  The present invention has been made in view of such a conventional situation, and an object of the present invention is to provide an electronic device including a heat dissipation structure that can improve the assembly workability and reduce the thickness of the device.

  In order to achieve the above object, an electronic device according to the present invention includes a first unit in which an electronic component is mounted in a casing composed of a case and a cover, and a second unit in which a heat generating electronic component is mounted. In the electronic apparatus having a heat dissipation structure that releases heat generated from the heat-generating electronic component to the outside through the housing, the first unit and the second unit are connected to each other via a connection cable. The first unit is attached to the inside of the case, and the second unit is temporarily fixed to the first unit, and after the cover is fitted to the case, the heat generating electronic component Is attached so as to be in close contact with the inside of the cover.

  In order to achieve the above object, according to the electronic device of the present invention, in the electronic device described above, the cover has a plurality of through holes, and the second unit itself is inserted through the through holes. It is characterized in that it is attached inside by a predetermined fastening means.

  In order to achieve the above object, the electronic device according to the present invention is the above-described electronic device, wherein the predetermined fastening means is formed on the female screw portion of the stud provided on the second unit side. It is a means for screwing with a bolt or a screw having a male screw portion through the through hole.

  In order to achieve the above object, in the electronic device according to the present invention, in the electronic device described above, the predetermined fastening means includes a male screw portion of a stud provided on the second unit side, and It is a means which passes through a through hole and is screwed with a nut having a female screw portion to the male screw portion.

  In order to achieve the above object, an electronic device according to the present invention is characterized in that, in the above-described electronic device, at least one of the case or the cover includes a radiating fin.

  As described above, according to the present invention, it is possible to provide an electronic device including a heat dissipation structure that can improve the assembly workability and reduce the thickness of the device.

It is explanatory drawing for demonstrating the structure of an electronic device provided with the thermal radiation structure which concerns on one Embodiment of this invention, and the procedure of an assembly. It is a figure which shows the detail of a stud. It is explanatory drawing for demonstrating the structure of an electronic device provided with the conventional heat dissipation structure, and the procedure of an assembly.

  Hereinafter, an electronic device including a heat dissipation structure according to an embodiment of the present invention will be described. An electronic device including a heat dissipation structure according to an embodiment of the present invention includes a first unit in which an electronic component is mounted in a casing including a case and a cover, and a second unit in which a heat generating electronic component is mounted. In the electronic apparatus having a heat dissipation structure that releases heat generated from the heat-generating electronic component to the outside through the housing, the first unit and the second unit are connected to each other via a connection cable. The first unit is attached to the inside of the case, and the second unit is temporarily fixed to the first unit, and after the cover is fitted to the case, the heat generating electronic component Is attached so as to be in close contact with the inside of the cover. Note that the present invention is not limited to electronic devices such as communication devices, video devices, and broadcasting devices, and can be applied to any electronic device that mounts electronic components that generate high heat.

[Configuration of Electronic Device] Next, a configuration of an electronic device including a heat dissipation structure according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is an explanatory diagram for explaining a configuration of an electronic device including a heat dissipation structure and an assembling procedure according to an embodiment of the present invention. FIG. 1 (a) shows a substrate unit (1) and a substrate unit. It is a figure which shows the state of temporarily fixing the board | substrate unit (1) to the structure of (2) and a board | substrate unit (2), FIG.1 (b) attaches the unit of the state of Fig.1 (a) inside a case. 1 (c) is a view showing a state where a cover is placed on the case in the state shown in FIG. 1 (b), and FIG. 1 (d) is a view showing each fixing screw. It is a figure which shows the state which used and attached the board | substrate unit (1) to the cover and the cover to the case. FIG. 2 is a diagram showing details of the stud.

  As shown in FIG. 1D, an electronic apparatus 1 according to an embodiment of the present invention includes a case 10 and a cover 20 that form a casing, a substrate unit (1) 30 that is accommodated in the casing, and a substrate unit. (2) 40 and includes a heat dissipation structure that releases heat generated from the heat generating electronic components mounted on the board unit (1) 30 and the board unit (2) 40 to the outside through the housing. In FIG. 1, the case 10 is drawn as if it were formed from two side wall portions and a bottom surface portion, but actually there are side wall portions on the front side and the back side of the paper surface. All surroundings shall be assumed.

  As shown in FIG. 1A, the board unit (1) 30 includes a circuit board (1) 32, a heat generating component 34, a heat generating component 36, and a stud 38 (see FIG. 2A). ing. The heat generating component 34 and the heat generating component 36 are soldered to the upper surface side of the circuit board (1) 32. The stud 38 is screwed to the upper surface side of the board (1) 32 by a unit set screw 210 through a mounting hole (not shown) provided in the circuit board (1) 32. As shown in FIG. 2 (a), the stud 38 has a shape having female screw portions 38a and 38b on the upper and lower sides, but is soldered to the circuit board (1) 32 instead of the female screw portion 38a. It is good also as a shape which can perform.

  As shown in FIG. 1A, the board unit (2) 40 includes a circuit board (2) 42, a heat generating component 44, a heat generating component 46, and a positioning column 48. The heat generating component 44 and the heat generating component 46 are soldered to the lower surface side of the circuit board (2) 42. The positioning column 48 has a positioning projection 48 a at the upper part, and is soldered to the upper surface side of the circuit board (2) 42. For example, the positioning column 48 is provided with a female screw processing portion in the lower part, and further provided with a mounting hole in the board (2) 42, so that the circuit board (2) 42 passes through the mounting hole and is set with a set screw. You may make it screw to the board | substrate (2) 42.

  Moreover, as shown to Fig.1 (a), the board | substrate unit (1) 30 and the board | substrate unit (2) 40 are connected with the wiring cable 50 for signal transmission and electric power transmission. In this embodiment, both ends of the wiring cable 50 are directly soldered to the circuit board (1) 32 and the circuit board (2) 42, respectively, but at least one end is connected to the connector. Anyway.

  As shown in FIG. 1C, the cover 20 is formed with a plurality of heat radiating fins 20a on the outer side, and faces the heat generating component 34 and the heat generating component 36 of the board unit (1) 30 on the inner side. A convex surface portion 20b and a convex surface portion 20c are formed at the respective positions, and a concave groove portion 20d for attaching the substrate unit (1) 30 is formed. Note that the heights of the convex surface portion 20b and the convex surface portion 20c of the cover 20 are in close contact with the heat generating component 34 and the heat generating component 36 of the substrate unit (1) 30 when the substrate unit (1) 30 is attached to the cover 20, respectively. It is set to height. Moreover, about the radiation fin 20a, you may make it attach by welding etc. separately using another component.

  As shown in FIG. 1B, the case 10 has a plurality of heat radiation fins 10a formed on the outer side, and faces the heat generating component 44 and the heat generating component 46 of the board unit (2) 40 on the inner side. A convex surface portion 10b and a convex surface portion 10c are formed at the positions, respectively, and a fixing column 12 for attaching the substrate unit (2) 40 is formed. Note that the height of the convex surface portion 10b and the convex surface portion 10c of the case 10 is such that the heating component 44 and the heating component 46 of the substrate unit (2) 40 when the substrate unit (2) 40 is attached to the fixing column 12 of the case 10. The height is set to be in close contact with each other. In addition, about the radiation fin 10a and the support | pillar 12 for fixation, you may make it attach separately by welding etc. using another components.

[Assembly Procedure of Electronic Device] Next, an assembly procedure of the electronic device 1 including the heat dissipation structure according to the embodiment of the present invention will be described with reference to FIG. First, the board unit (1) 30 and the board unit (2) 40 are placed as close as possible, and both ends of the wiring cable 50 are directly soldered to each board unit or connected via connectors to connect the two units. . As shown in FIG. 1A, the board unit (1) 30 is moved in the direction of arrow F1, and the positioning holes 32a provided in the circuit board (1) 32 are inserted into the positioning posts 48 of the board unit (2) 40. The board unit (1) 30 is temporarily fixed to the board unit (2) 40 by being fitted to the positioning convex portion 48a. As shown in FIG. 1B, the board unit (2) 40 is provided on the fixing column 12 on the inner side of the case 10 through the mounting hole 42 a provided in the circuit board (2) 42 using the unit set screw 210. The female screw portion 12a is screwed.

  As shown in FIG. 1C, the cover 20 is placed at a predetermined position on the upper surface of the side wall of the case 10. As shown in FIG. 1 (d), a unit set screw 210 is inserted from above through the hole of the recessed groove 20 d of the cover 20, and a screw is inserted into the female screw 38 b provided on the stud 38 of the board unit (1) 30. Stop. By doing so, the board unit (1) 30 moves in the direction of the arrow F2 and is screwed to the inside of the cover 20 via the stud 38, and the heating component 34 and the heating part 36 of the board unit (1) 30 are also secured. Are in close contact with the convex surface portion 20b and the convex surface portion 20c of the cover 20, respectively.

  In addition, between the convex surface part 20b and the convex surface part 20c of the cover 20, and the heat generating component 34 and the heat generating component 36 of the board unit (1) 30, and the convex surface part 10b and the convex surface part 10c of the case 10 and the board unit (2) 40. For example, a heat conductive elastic member or a heat conductive grease may be interposed between the heat generating component 44 and the heat generating component 46 to improve adhesion and heat dissipation.

  Further, by changing the stud which is a component of the board unit (1) 30 to a stud 39 having a female screw part 39a at the lower part and a male screw part 39b at the upper part as shown in FIG. 2 (b). Alternatively, the male threaded portion 39b of the stud 39 fixed to the circuit board (1) 32 may be protruded upward from the hole of the concave groove hole portion 20d of the cover 20 so as to be fastened with a nut.

  As described above, according to the electronic device including the heat dissipation structure according to the embodiment of the present invention, it is possible to provide the electronic device including the heat dissipation structure that enables improvement in assembly workability and thinning of the device. .

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.

  The present invention is not limited to electronic devices such as communication devices, video devices, and broadcast devices, and can be applied to electronic devices that mount electronic components that generate high heat.

  DESCRIPTION OF SYMBOLS 1: Electronic device, 10: Case, 10a: Radiation fin, 10b: Convex part, 10c: Convex part, 10d: Female thread part, 12: Fixing support | pillar, 12a: Female thread part, 20: Cover, 20a: Radiation fin 20b: convex surface portion, 20c: convex surface portion, 20d: concave groove hole portion, 20e: mounting hole, 30: substrate unit (1), 32: circuit board (1), 32a: positioning hole, 34: heat generating component, 36: Heat generating component, 38: Stud, 38a: Female screw part, 38b: Female screw part, 39: Stud, 39a: Female screw part, 39b: Male screw part, 40: Board unit (2), 42: Circuit board ( 2), 42a: mounting hole, 44: heat generating component, 46: heat generating component, 48: positioning post, 48a: positioning projection, 50: wiring cable, 100: electronic device, 110: case, 110a: heat radiation fin, 11 b: convex surface portion, 110c: convex surface portion, 110d: female screw portion, 112: fixing column, 112a: female screw portion, 120: cover, 120a: heat radiation fin, 120b: convex surface portion, 120c: convex surface portion, 120d: mounting Hole: 122: Fixing column, 122a: Female screw part, 130: Board unit (1), 132: Circuit board (1), 132a: Fixing hole, 134: Heat generating component, 136: Heat generating component, 140: Board unit (2), 142: circuit board (2), 142a: fixing hole, 144: heat generating component, 146: heat generating component, 150: wiring cable, 200: housing set screw, 210: unit set screw.

Claims (4)

The enclosure comprising a cover having a case and a plurality of through-holes, accommodating the first unit heat-generating electronic components are mounted, and a second unit heat-generating electronic components mounted thereon, the first unit And an electronic device including a heat dissipation structure that releases heat generated from each heat generating electronic component mounted on the second unit to the outside through the housing.
The first unit and the second unit are connected to each other via a connection cable,
The first unit is attached so that a heat generating electronic component mounted on the first unit is in close contact with the inside of the case via a heat conductive member ,
The second unit is temporarily fixed by fitting with a convex portion of a support provided in the first unit using a positioning hole, and after the cover is fitted to the case, the second unit is inserted through the through hole. The second unit is attached from the outside of the cover using a predetermined fastening means so that the heat generating electronic component mounted on the second unit is in close contact with the inside of the cover via a heat conductive member. Features electronic equipment. 2. The electronic device according to claim 1 , wherein the predetermined fastening means includes a bolt having a male screw portion on a female screw portion of a stud provided on the second unit side via the through hole of the cover. An electronic device characterized by being means for screwing with a screw. 2. The electronic device according to claim 1 , wherein the predetermined fastening means includes a male screw portion of a stud provided on the second unit side passing through the through hole of the cover, and a female screw portion on the male screw portion. An electronic device characterized by being means for screwing with a nut having 4. The electronic device according to claim 1 , wherein at least one of the case and the cover includes a heat radiating fin. 5.