JPH11233979A - Heat radiating structure for electronic equipment and power unit using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate designing of the temperature of electronic equipment by reducing the effects of temperature on a plurality of other discrete parts mounted on the mounting surface of a substrate, by mounting a heating element on the mounting surface and a heat radiating means which radiates the heat generated from the heating element on the surface of the substrate on the opposite side of the mounting surface. SOLUTION: A power unit 1 which is constituted as electronic equipment is provided with a metallic case 2 at front face of which a terminal block section is located. A heat sink mounting section 3 is provided on the bottom face section 2A of the case 2, and a mounting hole section 4 is formed at the center of the section 3. Many electronic components of a non-heat generating component represented by electrolytic capacitor, semiconductor, transformer 6 which is a heating element, etc., are mounted on a substrate 5 incorporated in the case 2. The heat generated from the winding section 6B of the shell type transformer 6 is transferred to a heat sink 9 via a heat radiating sheet 11 and radiated to the outside from the case 2 after heat has been transferred to the case 2 from the heat sink 9. In this way, the temperature of the power unit 1 can be suppressed, because the heat generated from the winding section 6B of the transformer is radiated to the outside from the case 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for electronic equipment and a power supply device using the heat dissipation structure.

[0002]

2. Description of the Related Art In a power supply device 20, for example, FIG.
As shown in the figure, a large number of electronic components such as an electrolytic capacitor 33 and a transformer 34 are mounted on a substrate 32 built in a case 31. The transformer 34 is a heat-generating component, and generates a large amount of heat. It is necessary to radiate the heat generated by the transformer 34.

As a heat dissipation structure of the conventional power supply device 20, for example, a large number of heat release slits (not shown) are formed in a case 31 of the power supply device 30 and a case 3 is formed.
One end is provided with a metal heat sink 36.

[0004]

In the power supply device 20, the transformer 34 is one of large discrete components. To reduce the size of the power supply device 20 as a whole, the transformer 3 is used.
4 was an important factor. That is, one of the factors that hinders the downsizing of the transformer 34 is an increase in the temperature of the transformer 34. In particular, in a high-capacity power supply device, if the heat radiation cannot be effectively performed, the transformer 34 must be reduced in size. Difficult to do.

The present invention has been made in view of the above problems, and a first object of the present invention is to prevent the influence of temperature on a plurality of other discrete components mounted on a mounting surface. This reduces the temperature of other discrete parts, makes it easier to expand the operating temperature range of the electronic equipment, and makes it possible to reduce the size of the heating element (transformer). It is to provide a structure.

A second object of the present invention is to reduce the influence of temperature on a plurality of other discrete components mounted on a mounting surface, and to facilitate the temperature design of other discrete components. It is another object of the present invention to provide a power supply device that not only allows the range of the operating temperature of the device main body to be widened but also allows the heating element (transformer) to be downsized.

[0007]

According to a first aspect of the present invention, there is provided a heat dissipation structure for an electronic device, comprising: a heating element mounted on a mounting surface of a substrate; A heat radiating means for the heating element is provided on a surface portion side opposite to the mounting surface.

[0008] With this configuration, since the heat is radiated by the heat radiating means on the side of the substrate opposite to the mounting surface on which the heat generating element is mounted, a plurality of other heat sources mounted on the mounting surface are provided. The temperature effect on the discrete components is reduced, the temperature design of other discrete components becomes easier, and the operating temperature range of the electronic device can be expanded, thereby improving the reliability of the entire electronic device. become.

According to a second aspect of the present invention, there is provided a heat dissipation structure for an electronic device according to the first aspect of the present invention. An opening was provided in the mounting surface of the substrate, a heat sink was arranged in the opening, and the heat sink was applied to the heating element via an electric heating sheet.

With this configuration, not only the same effects as those of the first aspect of the invention can be obtained, but also the heat generated by the heating element is transmitted to the heat sink via the heat radiation sheet and is radiated from the heat sink. . In this way, the heat generated by the heating element is reliably radiated, so that the temperature rise of the heating element can be suppressed. For this reason, the heat radiating area of the heating element can be small, and the heating element can be downsized.

According to a third aspect of the present invention, there is provided a heat dissipation structure for an electronic device according to the first aspect of the present invention, wherein the heat dissipation means comprises: An opening is provided in the mounting surface of the substrate, a heat sink is arranged in the opening, the heat sink is applied to the heating element via an electric heating sheet, and the heat sink is brought into contact with a metal case.

According to this configuration, not only the same operation and effect as the above-described first embodiment can be obtained, but also the heat generated by the heating element is transmitted to the heat sink through the heat radiation sheet, and the heat generated from the heat sink is transferred to the heat sink. The heat is transmitted to the case and dissipated. In this way, the heat generated by the heating element is reliably radiated, so that the temperature rise of the heating element can be suppressed. For this reason, the heat radiating area of the heating element can be small, and the heating element can be downsized.

According to a fourth aspect of the present invention, there is provided a heat dissipation structure for an electronic device according to the first aspect of the present invention. An opening is provided in the mounting surface of the substrate, a heat sink is arranged in the opening, and the heat sink is connected to the heat radiating means of the conductor module, and the heat sink is applied to the heating element via an electric heating sheet.

According to this configuration, not only the same operation and effect as the above-described first embodiment can be obtained, but also the heat generated by the heat generating element is transmitted to the heat sink through the heat radiation sheet, and the heat generated from the heat sink is transferred from the heat sink. The heat is dissipated by the heat dissipating means. In this way, the heat generated by the heating element is reliably radiated, so that the temperature rise of the heating element can be suppressed. For this reason, the heat radiating area of the heating element can be small, and the heating element can be downsized.

According to a fifth aspect of the present invention, there is provided a heat radiation structure for an electronic device according to the first or second aspect of the present invention. In the above, the heating element is a transformer, and a surface of the transformer abutting on an electric heating sheet is a winding part.

With this configuration, the heat generated by the winding of the transformer is transmitted to the heat sink via the heat dissipation sheet.
The heat is radiated from the heat sink and transmitted to the metallic case, and is radiated from the case.

As described above, the heat generated by the winding of the transformer is reliably radiated, so that the temperature rise of the winding can be suppressed. For this reason, the heat radiation area of the transformer can be small, and the transformer can be downsized.

Further, since the heat of the transformer is radiated on the side opposite to the mounting surface on which the transformer is mounted on the substrate, the temperature of the plurality of other discrete components mounted on the mounting surface can be reduced. The influence is reduced, the temperature design of other discrete components becomes easier, and the range of the operating temperature of the electronic device can be expanded, thereby improving the reliability of the entire electronic device.

According to a sixth aspect of the present invention, there is provided a heat dissipation structure for an electronic device according to the first or second or fourth aspect of the present invention. In the above, the heating element is a transformer, and an electric heating sheet contact surface of the transformer is a metal part connected to the winding part.

With this configuration, the heat generated by the transformer is transmitted from the metal part connected to the winding part of the transformer to the heat sink via the heat radiation sheet, and is radiated from the heat sink by the heat radiation means of the conductor module.

As described above, since the heat generated by the transformer is reliably radiated, the temperature rise of the winding portion can be suppressed. For this reason, the heat radiation area of the transformer can be small, and the transformer can be downsized.

Further, since the heat is dissipated from the transformer on the side opposite to the mounting surface on which the transformer is mounted on the substrate, the temperature to a plurality of other discrete components mounted on the mounting surface can be reduced. The influence is reduced, the temperature design of other discrete components becomes easier, and the range of the operating temperature of the electronic device can be expanded, thereby improving the reliability of the entire electronic device.

In order to achieve the second object, a power supply according to a seventh aspect of the present invention uses the heat dissipation structure of the electronic equipment according to the first to sixth aspects.

With this configuration, the heat generated by the heating element (transformer) is reliably radiated, so that the temperature rise of the heating element (transformer) can be suppressed. For this reason, the heat radiating area of the heating element (transformer) can be small, and the heating element (transformer) can be downsized.

In the substrate, a heating element (transformer)
Since the heat is dissipated from the transformer on the side opposite to the mounting surface on which the is mounted, the temperature effect on the other discrete components mounted on the mounting surface is reduced, and other discrete components are Temperature design becomes easier, and the range of operating temperature of the power supply can be expanded, so that the reliability of the entire power supply can be improved.

[0026]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view of a power supply device as an electronic device having a heat dissipation structure (Embodiment 1) according to the present invention, and FIG. 2 is a heat dissipation structure of the electronic device according to the present invention. FIG. 3 is a perspective view of the disassembled state of the first embodiment, and FIG. 3 is a longitudinal sectional view of the heat dissipation structure (first embodiment).

A power supply device 1 as an electronic device includes a metal case 2, a terminal block 2-1 is provided on a front surface 2 B of the case 2, and a heat sink is provided on a bottom surface 2 A of the case 2. It has a mounting portion 3, and a mounting hole 4 is formed in the center of the heat sink mounting portion 3.

On the substrate 5 built in the case 2, a large number of electronic components such as a non-heating component (not shown) typified by an electrolytic capacitor, a semiconductor (not shown), and a transformer 6 as a heating element are provided. It is installed.

The transformer 6 is of a shell type and has a horizontal winding portion. That is, this transformer 6 is
A has a winding portion 6B in which a coil wire is wound, and a plurality of terminals 6C projecting downward are provided on the left and right sides of the winding portion 6B.

The substrate 5 has a rectangular opening 7 facing the winding 6B of the transformer 6. This opening 7
Are located within the range of the area when the transformer is mounted, which is surrounded by the dotted line, and through holes 8 are provided to the left and right of the opening 7 within the range of the area when the transformer is mounted. The upper surface of the substrate 5 is the side on which electronic components are mounted, and a plurality of discrete components (not shown) are mounted on this mounting surface.

The heat sink 9 has a rectangular shape which can be inserted into the opening 7 of the substrate 5, and has a lower surface 9A.
Is flat, and its upper surface 9B is
It is formed on a concave curved surface similar to the lower shape of B. A screw hole 10 is provided in the center of the heat sink 9.

The heat radiating sheet 11 has a rectangular shape, and has a low hardness adapted to the curved surface of the upper surface 9 B of the heat sink 9.

The heat sink 9 is mounted on the bottom surface 2A of the case 2 with the flat lower surface 9A in contact with the heat sink mounting portion 3 and is inserted into the mounting hole 4 from the back of the case 2. A set screw 12 is screwed into the screw hole 10, and the heat sink 9 is attached to the heat sink attachment portion 3.

The terminal 6C is inserted into the through hole 8 of the substrate 5 and soldered.
The transformer 6 is mounted with the interposition of the transformer 6, and the lower part of the winding part 6 B of the transformer 6 faces the opening 7 of the substrate 5. In this case, the transformer 6 is located within a range of the area when the transformer is mounted, which is surrounded by a dotted line.

After the heat radiating sheet 11 is placed on the upper surface 9 B of the heat sink 9, the substrate 5 is accommodated in the case 2, and the heat sink 9 and the heat radiating sheet 11 are arranged (inserted) in the opening 7 of the substrate 5. Then, the lower part of the winding part 6B of the transformer 6 is brought into contact with the heat radiation sheet 11, and the lower part of the winding part 6B is brought into contact with the upper surface part 9B of the heat sink 9 via the heat radiation sheet 11. In this case, the lower curved surface of the winding portion 6B follows the curved surface of the upper surface portion 9B of the heat sink 9 via the heat radiation sheet 11. The substrate 5 is fixed to the case 2 by fixing means (not shown). Then, at least the heat radiating sheet 11 and the heat sink 9 constitute a heat radiating means.

Next, the transformer 6 constructed as described above is used.
The heat dissipating function of the heat dissipating structure will be described. The heat generated by the winding portion 6 </ b> B of the transformer 6 is transmitted to the heat sink 9 via the heat radiation sheet 11, radiated from the heat sink 9, transmitted to the metallic case 2, and radiated from the case 2.

As described above, since the heat generated by the winding portion 6B of the transformer 6 is reliably radiated, the winding portion 6B
The temperature rise of B can be suppressed. For this reason, the heat radiation area of the transformer 6 can be small, and the transformer 6 can be downsized.

Further, since the heat of the transformer 6 is radiated on the side of the substrate 5 opposite to the mounting surface on which the transformer 6 is mounted, a plurality of other discrete components mounted on the mounting surface are provided. Temperature effect on other discrete parts becomes easier,
In addition, the range of operating temperature of the power supply device can be expanded, and the reliability of the entire power supply device can be improved.

(Embodiment 2) FIGS. 4 and 5 show Embodiment 2 of the present invention. In the second embodiment of the present invention, the heat radiation structure is provided on the mounting surface of the substrate 15 with the opening 1.
7, a heat sink 17 is arranged (inserted) in the opening 17, the heat sink 19 is connected to the heat radiating means of the conductor module 21, and the heat sink 19 is applied to the transformer 16 via the electric heating sheet 24. It is.

The transformer 16 is a shell type and has a vertical winding portion 16B. A metal plate (metal portion) 16 </ b> D is in contact with the winding portion 16 </ b> B of the transformer 16, and the metal plate 16 </ b> D goes around the lower part of the transformer 16. Further, a plurality of terminals 16C protruding downward are provided on the left and right of the lower part of the transformer 16.

A rectangular opening 17 facing the lower part of the transformer 16 is formed in the substrate 15. The opening 17 is located within a range of the area when the transformer is mounted, which is surrounded by a dotted line, and through holes 18 are provided on the left and right sides of the opening 17 within the range of the area when the transformer is mounted. It is. The upper surface of the substrate 15 is the side on which electronic components are mounted, and a plurality of discrete components (not shown) are mounted on this mounting surface.

The heat sink 19 has a rectangular shape that can be inserted into the opening 17 of the substrate 15.
The lower surfaces 19B and 19A are flat, and the heat sink 19 is provided with a screw hole 20.

Reference numeral 23 denotes a module heat sink for dissipating heat generated by the semiconductor module 21 and constitutes a heat dissipating means for the conductor module 21. On the inner surface (upper surface) of the semiconductor module 21, a heat sink mounting portion 22 without module mounting is formed.

A module heat sink 23 is disposed on the outer surface (lower surface) of the semiconductor module 21 and is screwed. A heat sink 19 is mounted on the heat sink mounting portion 22 of the semiconductor module 21.
However, the heat sink 19 is fixed by screws (not shown) using the screw holes 20, and a heat radiation sheet 24 is placed on the upper surface 19 </ b> B of the heat sink 19.

The semiconductor module 21 on which the module heat sink 23, the heat sink 19 and the heat radiation sheet 24 are mounted is mounted on the back surface of the substrate 15, and in this case, the heat sink 19 is provided in the opening 17 of the substrate 15. Then, the heat dissipating sheet 24 is arranged 8).

Then, on the substrate 15, a terminal 16C is inserted into the through hole 18 and soldered, and a transformer 16 is mounted with a spacer (not shown) interposed therebetween. Metal plate 16 located at the bottom
D is applied to the upper surface 19B of the heat sink 19 via the heat radiation sheet 24, and the substrate 15 is fixed to the case by fixing means (neither is shown).

Next, the transformer 1 constructed as described above is used.
The heat radiation effect of the heat radiation structure 6 will be described. Transformer 16
The heat generated by the winding portion 16 </ b> B is transmitted to the heat sink 19 via the metal plate 16 </ b> D and the heat radiating sheet 23, radiated from the heat sink 19, and from the heat sink mounting portion 22 of the semiconductor module 21 to the module heat sink 23.
And is radiated from the module heat sink 23.

As described above, the winding portion 16B of the transformer 16
The heat generated is surely radiated, so that the temperature rise of the winding portion 16B can be suppressed. Therefore, the heat radiation area of the transformer 16 can be small, and the transformer 16 can be downsized.

Further, on the substrate 15, the transformer 16 is mounted on the side opposite to the mounting surface on which the transformer 16 is mounted.
Heat dissipation, the temperature effect on the other discrete components mounted on the mounting surface is reduced, the temperature design of other discrete components becomes easier, and the operating temperature of the power supply unit is reduced. Can be increased, and the reliability of the entire power supply device can be improved.

[0051]

As described above, according to the heat radiating structure for an electronic device according to the present invention, the heat radiating means radiates the heat of the heat generating element to the side of the substrate opposite to the mounting surface on which the heat generating element is mounted. As a result, the temperature influence on a plurality of other discrete components mounted on the mounting surface is reduced, and the temperature design of the other discrete components becomes easier, and
The range of operating temperature of the power supply (electronic device) can be expanded, and the reliability of the entire power supply can be improved.

The heat generated by the heating element is transmitted to the heat sink via the heat radiating sheet, and is radiated from the heat sink. Also, by attaching the heat sink to the metal case, the heat generated by the heating element is transmitted from the heat sink to the case and is radiated. Further, the heat generated by the heat generating element by connecting the heat sink to the heat radiating means of the conductor module is transmitted from the heat sink to the heat radiating means of the conductor module, and is radiated.

As described above, the heat generated by the heating element is reliably radiated, so that the temperature rise of the heating element can be suppressed. For this reason, the heat radiating area of the heating element can be small, and the heating element can be downsized.

In particular, when the heating element is a transformer,
The heat generated by the winding of the transformer is reliably radiated, so that the temperature rise of the winding can be suppressed. For this reason, the heat radiation area of the transformer can be small, and the transformer can be downsized.

Further, since the heat is dissipated from the transformer on the side opposite to the mounting surface on which the transformer is mounted on the substrate, the temperature to a plurality of other discrete components mounted on the mounting surface is reduced. The influence is reduced, the temperature design of other discrete parts becomes easy, and the range of the operating temperature of the power supply device (electronic device) can be expanded, so that the reliability of the entire power supply device improves. .

Further, according to the power supply device of the present invention, the heat generated by the heating element (transformer) is reliably radiated, so that the temperature rise of the heating element (transformer) can be suppressed. Therefore, the heat radiating area of the heating element (transformer) can be small, and the heating element (transformer) can be reduced.
Can be downsized.

In the substrate, a heating element (transformer)
Since the heat is dissipated from the transformer on the side opposite to the mounting surface on which the is mounted, the temperature effect on the other discrete components mounted on the mounting surface is reduced, and other discrete components are Temperature design becomes easier, and the range of operating temperature of the power supply can be expanded, so that the reliability of the entire power supply can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic apparatus having a heat dissipation structure (first embodiment) according to the present invention.

FIG. 2 is an exploded perspective view of a heat dissipation structure (first embodiment) of the electronic device according to the invention.

FIG. 3 is a longitudinal sectional view of the heat radiation structure (Embodiment 1).

FIG. 4 is an exploded perspective view of a heat dissipation structure (Embodiment 2) of an electronic device according to the present invention.

FIG. 5 is a longitudinal sectional view of the heat radiation structure (Embodiment 2).

FIG. 6 shows a conventional electronic device (power supply device) having a heat dissipation structure.
FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Power supply device (electronic device) 2 Case 5 Substrate 6 Transformer 6B Winding part 6C Terminal 6D Metal plate (metal part) 7 Opening 9 Heat sink 11 Heating sheet 15 Substrate 17 Opening 19 Heat sink 21 Semiconductor module 23 Heat sink for module

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yasuyasu Murabayashi Omron Co., Ltd. 10 Hanazono Todocho, Ukyo-ku, Kyoto-shi, Kyoto

Claims (7)

[Claims] 1. A heat radiating structure for an electronic device, wherein a heat generating element is mounted on a mounting surface of a substrate, and a heat radiating means for the heat generating element is provided on a surface of the substrate opposite to the mounting surface. . 2. The heat dissipating means is configured by providing an opening in the mounting surface of the substrate, disposing a heat sink in the opening, and applying the heat sink to the heating element via an electric heating sheet. 2. A heat dissipation structure for an electronic device according to item 1. 3. The heat radiating means is provided with an opening in the mounting surface of the substrate, a heat sink is arranged in the opening, and the heat sink is applied to the heating element via an electric heating sheet. The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation structure is configured to be in contact with a metal case. 4. The heat dissipating means is provided with an opening in the mounting surface of the substrate, a heat sink is arranged in the opening, and the heat sink is connected to the heat dissipating means of the conductor module. 2. The heat radiating structure for an electronic device according to claim 1, wherein the heat radiating structure is configured to be applied to the heat generating element via an intermediary. 5. The heat radiating structure for an electronic device according to claim 2, wherein the heating element is a transformer, and an electric heating sheet contact surface of the transformer is a winding portion. 6. The heat radiating structure for an electronic device according to claim 2, wherein the heating element is a transformer, and an electric heating sheet contact surface of the transformer is a metal part connected to a winding part. 7. A power supply device using the heat dissipation structure for an electronic device according to claim 1.